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{"title":"FCBGA\/BGA package substrate manufacture","imgUrl":"https:\/\/img.chinax.com\/nimg\/80\/6f\/0d44693e70665b767007a1d6b275-200x200-1\/fcbga_2fbga_package_substrate_manufacture.jpg","attrs":{"Brand Name":"Horexs","Model Number":"HRX","Certification":"UL","Place of Origin":"CHINA"}}
{"title":"MEMS package substrate manufacture","imgUrl":"https:\/\/img.chinax.com\/nimg\/64\/89\/afba90ded4fd557463cf3c54c4fe-200x200-1\/mems_package_substrate_manufacture.jpg","attrs":{"Brand Name":"Horexs","Model Number":"HRX","Certification":"UL","Place of Origin":"CHINA"}}
{"title":"System in package Sip package substrate manufacture","imgUrl":"https:\/\/img.chinax.com\/nimg\/c2\/0a\/b2450d96a85f0058cb2e680c0111-200x200-1\/system_in_package_sip_package_substrate_manufacture.jpg","attrs":{"Brand Name":"Horexs","Model Number":"HRX","Certification":"UL","Place of Origin":"CHINA"}}
{"title":"FCCSP Flipchip package substrate manufacture","imgUrl":"https:\/\/img.chinax.com\/nimg\/eb\/ff\/f820acc465a9da97b02379248415-200x200-1\/fccsp_flipchip_package_substrate_manufacture.jpg","attrs":{"Brand Name":"Horexs","Model Number":"HRX","Certification":"UL","Place of Origin":"CHINA"}}
{"title":"Flash\/Nand memory IC substrate manufacture","imgUrl":"https:\/\/img.chinax.com\/nimg\/23\/c4\/9b85dd6017871cc87c4c7ae9158d-200x200-1\/flash_2fnand_memory_ic_substrate_manufacture.jpg","attrs":{"Brand Name":"Horexs","Model Number":"HRX","Certification":"UL","Place of Origin":"CHINA"}}
{"title":"semiconductor FCCSP package substrate manufacture in HOREXS","imgUrl":"https:\/\/img.chinax.com\/nimg\/c4\/23\/aadbdb22b3f548c3dd1902613124-200x200-1\/semiconductor_fccsp_package_substrate_manufacture_in_horexs.jpg","attrs":{"Brand Name":"Horexs","Model Number":"HRX","Certification":"UL","Place of Origin":"CHINA"}}
{"title":"semiconductor FCCSP Package Substrate manufacture","imgUrl":"https:\/\/img.chinax.com\/nimg\/94\/0f\/63a23567b2e6c731dfbe8c611db6-200x200-1\/semiconductor_fccsp_package_substrate_manufacture.jpg","attrs":{"Brand Name":"Horexs","Certification":"UL","Place of Origin":"china","Minimum Order Quantity":"1 square meter"}}
{"title":"FCBGA\/BGA package substrate manufacture","imgUrl":"https:\/\/img.chinax.com\/nimg\/d2\/56\/73dc264795a0b959df75d2a2b88d-200x200-1\/fcbga_2fbga_package_substrate_manufacture.jpg","attrs":{"Brand Name":"Horexs","Model Number":"HRX","Certification":"UL","Place of Origin":"CHINA"}}
BGA Substrate,IC Package Substrate and Sip Package Substrate from Quality China Factory.
HOREXS Group was located in CHINA mainland,has three subsidiaries:Boluo HongRuiXing Electronics Co., Ltd(Located in Huizhou city GuangDong),HongRuiXing (HuBei) Electronics Co.,Ltd(Located in HuBei province),Horexs Electronics (HK) Co.,Ltd(Located in HK),All are just located in differen... + Read More
