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CEMEDINE EP007A Flexible Epoxy Adhesive for Metal and Plastic Bonding Applications
Simple attributes
CEMEDINE EP007A is a two-component flexible epoxy adhesive composed of light yellow transparent base resin and light brown transparent hardener. It has a non-volatile content of 99.7% for the base resin and 99.0% for the hardener, with a mixing ratio of 1:1. The product cures at room temperature and is classified as a flexible type adhesive.
Product Introduction
CEMEDINE EP007A is a reactive adhesive that is solventless and produces no gas during the curing process. It exhibits excellent adhesive strength with a tensile shear strength of 22.0 MPa and provides good heat and chemical resistance. The adhesive shows small shrinkage during curing and offers superb insulation properties.
Property
Value
Unit
Conditions
Base Resin Properties
Appearance
Light yellow transparent
-
-
Non-volatiles
99.7
wt%
-
Viscosity
12
Pa·s
23°C
Density
1.17
g/cm³
-
Hardener Properties
Appearance
Light brown transparent
-
-
Non-volatiles
99.0
wt%
-
Viscosity
34
Pa·s
23°C
Density
0.95
g/cm³
-
Curing Conditions
Standard curing
23°C×7 days
-
-
Accelerated curing
80°C×1 hour
-
-
Pot life
60
min
23°C
Effective curing time
12
hours
23°C
Mechanical Properties
Tensile shear strength
22.0
MPa
-
T-peel strength
2.2
N/mm
-
Hardness (Shore D)
78
-
-
Glass transition temperature
56
°C
-
Elastic modulus
129
MPa
-
Physical Properties
Water absorption
0.7
%
-
Coefficient of linear expansion
9.7×10⁻⁵
-
-
Electrical Properties
Volume resistivity
4.0×10¹⁵
Ω·cm
-
Surface resistivity
1.2×10¹⁶
Ω/sq
-
Dielectric constant
3.28
-
1kHz
Dielectric loss tangent
1.32×10⁻²
-
1kHz
Special attributes
The special properties of EP007A include its high flexibility demonstrated by a T-peel strength of 2.2 N/mm, which is significantly higher than standard epoxy adhesives. It has a Shore D hardness of 78 after curing and a glass transition temperature of 56°C. The product also shows low water absorption of 0.7% and excellent electrical insulation properties with volume resistivity of 4.0×10¹⁵ Ω·cm.
Application scenarios
CEMEDINE EP007A is specifically designed for applications requiring flexible bonds, such as in automotive parts assembly, electronic equipment sealing, and adhesion of composite materials in construction. It is particularly suitable for bonding materials with different coefficients of thermal expansion where flexibility is crucial to prevent cracking under thermal stress.
Frequently Asked Questions
How can I get the price?
We usually quote within 24 hours after receiving your inquiry (except weekends and holidays). For urgent pricing, please email or contact us directly.
What is your lead time?
Lead time depends on order quantity and season. Typically we can ship within 7-15 days for small quantities, and about 30 days for large quantities.
What is your payment term?
We accept T/T, Western Union, MoneyGram, and PayPal. Payment terms are negotiable.
What is the shipping method?
We ship by sea, air, or express (EMS, UPS, DHL, TNT, FedEx, etc.). Please confirm shipping method with us before placing orders.
How do you maintain long-term business relationships?
We maintain good quality and competitive pricing to ensure customer benefits
We treat every customer as a friend and value both business and personal relationships
Shenzhen Huazhisheng New Materials Technology Co., Ltd. is a leading provider of environmentally friendly adhesives and technical solutions, specializing in the application of modified silicone rubber, epoxy adhesives, thermal materials, bonding adhesives, encapsulation adhesives, and UV adhesives a... Shenzhen Huazhisheng New Materials Technology Co., Ltd. is a leading provider of environmentally friendly adhesives and technical solutions, specializing in the application of modified silicone rubber, epoxy adhesives, thermal materials, bonding adhesives, encapsulation adhesives, and UV adhesives a...