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Color: Blue (for visual inspection) Form: solvent-free, flowable paste like Thermal conductivity: 2.9 W/m · K (high thermal conductivity) Thermal resistance: 0.03 ℃ · cm ²/W (under 40 psi pressure) Curing characteristics: Non curing type, no need for baking
Product Introduction
DOWSIL™ TC-5288 is a blue-colored, solvent-free thermal interface material (TIM) designed for efficient heat dissipation in high-performance electronics. Its flowable formulation allows easy application and thin bond line formation (<0.007mm at 40 psi), ensuring optimal thermal transfer from heat-generating components to heat sinks. The non-curing, oven-free process reduces production complexity, while its blue hue enables precise visual alignment during assembly. With exceptional thermal conductivity (2.9 W/m·K) and ultra-low thermal resistance, this material is ideal for demanding thermal management applications.
Special Attributes
Ultra-Thin Bond Line: Achieves 0.007mm BLT at standard pressure, minimizing thermal gaps for high-efficiency cooling.
Solvent Resistance: Exhibits basic tolerance to intermittent solvent exposure, though prolonged contact is not recommended.
Wide Temperature Stability: Maintains performance from -40°C to 200°C, ensuring reliability in extreme environments.
Shenzhen Huazhisheng New Materials Technology Co., Ltd. is a leading provider of environmentally friendly adhesives and technical solutions, specializing in the application of modified silicone rubber, epoxy adhesives, thermal materials, bonding adhesives, encapsulation adhesives, and UV adhesives a... Shenzhen Huazhisheng New Materials Technology Co., Ltd. is a leading provider of environmentally friendly adhesives and technical solutions, specializing in the application of modified silicone rubber, epoxy adhesives, thermal materials, bonding adhesives, encapsulation adhesives, and UV adhesives a...