Shenzhen APG Material Company Limited
| Packaging Details | Vacuum-sealed packaging, case-packed for storage and transport |
| Delivery Time | 4-5 weeks |
| Payment Terms | T/T |
| Supply Ability | Stable supply |
| Name | Target Bonding Adhesive |
| Core Functions | Firmly bonding the target to the backing plate, provding mechanical support for brittle targets (such as ceramic targets) to prevent cracking or deformation. |
| Key Features | Process Friendly, Stress Buffering,Overall Performance Stability |
| Application Field | Target Bonding |
| Brand Name | APG |
| Place of Origin | china |
| Certification | ISO9001、ISO14001、ISO45001、IAFT16949 |
View Detail Information
Explore similar products
Safe Durable Electrically Conductive Silver Paste For Automotive Glass
PCB Through Hole Silver Paste For Interlayer Electrical Connection
Automotive Anti Glare Rearview Mirror Conductive Silver Paste
Eco Friendly Electronic Paste Resistor Overglaze Paste For Hybrid Integrated
Product Specification
| Packaging Details | Vacuum-sealed packaging, case-packed for storage and transport | Delivery Time | 4-5 weeks |
| Payment Terms | T/T | Supply Ability | Stable supply |
| Name | Target Bonding Adhesive | Core Functions | Firmly bonding the target to the backing plate, provding mechanical support for brittle targets (such as ceramic targets) to prevent cracking or deformation. |
| Key Features | Process Friendly, Stress Buffering,Overall Performance Stability | Application Field | Target Bonding |
| Brand Name | APG | Place of Origin | china |
| Certification | ISO9001、ISO14001、ISO45001、IAFT16949 | ||
| High Light | Sputtering Target Adhesive ，Target Bonding Adhesive ，Target Adhesive Process Friendly | ||
Target Bonding Adhesive is a specialized adhesive used to securely bond sputtering targets to the backing plate. It plays a key role in processes such as physical vapor deposition (PVD).
● Process Friendly
It typically cures at temperatures from medium to low, avoiding potential damage to target material properties from high temperatures, and is relatively easy to operate.
● Stress Buffering
With certain flexibility, it effectively alleviates stress generated between the target and the backing plate due to differences in thermal expansion coefficients.
● Overall Performance Stability
It has good chemical and mechanical stability, strong adhesion to various substrates (such as aluminum, copper, stainless steel, glass), and is environmentally friendly and non-toxic.
● Ceramic and Brittle Target Bonding
Especially suitable for bonding ceramic targets such as ITO (Indium Tin Oxide) and SiO₂, which are brittle and require bonding for support and heat dissipation.
● Thermally Sensitive or Special Targets
Suitable for targets that cannot withstand high-temperature bonding (such as certain oxide targets), organic targets, or temporary bonding applications.
Company Details
Ecer Certification：
Verified Supplier
Shenzhen APG Material Company Limited (APG), headquartered in Shenzhen, China, currently operates three factories located in Shenzhen, Changzhou, and Changsha, and employs more than 200 people. APG specializes in the research and development (R&D) and production of PVD materials (sputtering targ... Shenzhen APG Material Company Limited (APG), headquartered in Shenzhen, China, currently operates three factories located in Shenzhen, Changzhou, and Changsha, and employs more than 200 people. APG specializes in the research and development (R&D) and production of PVD materials (sputtering targ...
Get in touch with us
Leave a Message, we will call you back quickly!