Shenzhen APG Material Company Limited
| Packaging Details | Vacuum-sealed packaging, case-packed for storage and transport |
| Delivery Time | 4-5 weeks |
| Payment Terms | T/T |
| Supply Ability | Stable supply |
| Name | Target Bonding Adhesive |
| Core Functions | Firmly bonding the target to the backing plate, provding mechanical support for brittle targets (such as ceramic targets) to prevent cracking or deformation. |
| Key Features | Process Friendly, Stress Buffering,Overall Performance Stability |
| Application Field | Target Bonding |
| Brand Name | APG |
| Place of Origin | china |
| Certification | ISO9001、ISO14001、ISO45001、IAFT16949 |
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Product Specification
| Packaging Details | Vacuum-sealed packaging, case-packed for storage and transport | Delivery Time | 4-5 weeks |
| Payment Terms | T/T | Supply Ability | Stable supply |
| Name | Target Bonding Adhesive | Core Functions | Firmly bonding the target to the backing plate, provding mechanical support for brittle targets (such as ceramic targets) to prevent cracking or deformation. |
| Key Features | Process Friendly, Stress Buffering,Overall Performance Stability | Application Field | Target Bonding |
| Brand Name | APG | Place of Origin | china |
| Certification | ISO9001、ISO14001、ISO45001、IAFT16949 | ||
| High Light | Sputtering Target Adhesive ，Target Bonding Adhesive ，Target Adhesive Process Friendly | ||
Target Bonding Adhesive is a specialized adhesive used to securely bond sputtering targets to the backing plate. It plays a key role in processes such as physical vapor deposition (PVD).
● Process Friendly
It typically cures at temperatures from medium to low, avoiding potential damage to target material properties from high temperatures, and is relatively easy to operate.
● Stress Buffering
With certain flexibility, it effectively alleviates stress generated between the target and the backing plate due to differences in thermal expansion coefficients.
● Overall Performance Stability
It has good chemical and mechanical stability, strong adhesion to various substrates (such as aluminum, copper, stainless steel, glass), and is environmentally friendly and non-toxic.
● Ceramic and Brittle Target Bonding
Especially suitable for bonding ceramic targets such as ITO (Indium Tin Oxide) and SiO₂, which are brittle and require bonding for support and heat dissipation.
● Thermally Sensitive or Special Targets
Suitable for targets that cannot withstand high-temperature bonding (such as certain oxide targets), organic targets, or temporary bonding applications.
Company Details
Ecer Certification：
Verified Supplier
Sputtering Targets for PVD Thin-Film Deposition APG manufactures metal, alloy, ceramic and rare earth sputtering targets for industrial PVD applications. Explore materials for semiconductor, photovoltaic, optical coating, display and Low-E glass applications. Browse sputtering target materials, meta... Sputtering Targets for PVD Thin-Film Deposition APG manufactures metal, alloy, ceramic and rare earth sputtering targets for industrial PVD applications. Explore materials for semiconductor, photovoltaic, optical coating, display and Low-E glass applications. Browse sputtering target materials, meta...
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