Shenzhen APG Material Company Limited
| Packaging Details | Vacuum-sealed packaging, case-packed for storage and transport |
| Delivery Time | 4-5 weeks |
| Payment Terms | T/T |
| Supply Ability | Stable supply |
| Purity | 99.99%-99.999% |
| Name | Copper (Cu) |
| Forming Process | Melting and Hot Rolling |
| Product Specifications | Evaporation Particles |
| Application Fields | Semiconductor Manufacturing, Optical Device Manufacturing. Photovoltaic Industry, Decorative andProtective Coatings |
| Brand Name | APG |
| Place of Origin | china |
| Certification | ISO9001、ISO14001、ISO45001、IAFT16949 |
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Product Specification
| Packaging Details | Vacuum-sealed packaging, case-packed for storage and transport | Delivery Time | 4-5 weeks |
| Payment Terms | T/T | Supply Ability | Stable supply |
| Purity | 99.99%-99.999% | Name | Copper (Cu) |
| Forming Process | Melting and Hot Rolling | Product Specifications | Evaporation Particles |
| Application Fields | Semiconductor Manufacturing, Optical Device Manufacturing. Photovoltaic Industry, Decorative andProtective Coatings | Brand Name | APG |
| Place of Origin | china | Certification | ISO9001、ISO14001、ISO45001、IAFT16949 |
| High Light | Cu Evaporation Materials ，Evaporation Materials High Conductivity ，Evaporation Copper Ingots | ||
Copper (Cu) is a high-conductivity, thermally efficient transition metal essential for advanced thin-film applications. Typically supplied as high-purity ingots, pellets, or chunks, copper is optimized for vacuum deposition, electron-beam (e-beam) evaporation, and magnetron sputtering. The resulting thin films are characterized by high density, homogeneity, and superior interfacial adhesion, significantly optimizing the electrical, thermal, and structural stability of integrated devices.
lHigh Purity
Purity up to 99.9%–99.99%, with low impurity content, ensuring stable and reliable film performance.
lExcellent Conductivity
High electrical conductivity, making it suitable for the production of conductive films, electrodes, and interconnect layers.
lGood Thermal Conductivity
High thermal conductivity, ideal for electronic device films requiring heat dissipation.
l Excellent Ductility
Forms uniform, dense films on various substrates with strong adhesion.
Widespread Applications of Copper
lSemiconductor Manufacturing
Used as interconnect layers, conductive films, electrodes, and contact layers, widely applied in chip, circuit board, and packaging processes.
lOptical Device Manufacturing
Used in reflective films, optical filters, and functional coatings to enhance optical performance.
lPhotovoltaic Industry
Applied in functional films in solar cells, lithium batteries, and fuel cells to improve energy efficiency and stability.
l Decorative and Protective Coatings
Used in consumer electronics housings, architectural decorations, and crafts to form coatings that are both decorative and protective.
Company Details
Ecer Certification：
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Shenzhen APG Material Company Limited (APG), headquartered in Shenzhen, China, currently operates three factories located in Shenzhen, Changzhou, and Changsha, and employs more than 200 people. APG specializes in the research and development (R&D) and production of PVD materials (sputtering targ... Shenzhen APG Material Company Limited (APG), headquartered in Shenzhen, China, currently operates three factories located in Shenzhen, Changzhou, and Changsha, and employs more than 200 people. APG specializes in the research and development (R&D) and production of PVD materials (sputtering targ...
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