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Shenzhen APG Material Company Limited

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China High Purity Sputtering Target Material Si Target For Semiconductor Manufacturing
China High Purity Sputtering Target Material Si Target For Semiconductor Manufacturing

  1. China High Purity Sputtering Target Material Si Target For Semiconductor Manufacturing
  2. China High Purity Sputtering Target Material Si Target For Semiconductor Manufacturing

High Purity Sputtering Target Material Si Target For Semiconductor Manufacturing

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Packaging Details Vacuum-sealed packaging, case-packed for storage and transport
Delivery Time 4-5 weeks
Payment Terms T/T
Supply Ability Stable supply
Purity The purity of crystalline silicon is 99.999%, and the purity of Hsi is 99.99%
Density 2.33 g/cm³
Name Silicon Target (Si)
Forming Process Spraying, Sintering, Crystal Growth
Product Specifications Flat target, Rotating target
Application Fields Optical Device Manufacturing, Semiconductor Manufacturing, Sensor Manufacturing
Brand Name APG
Place of Origin china
Certification ISO9001、ISO14001、ISO45001、IAFT16949

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  1. Product Details
  2. Company Details

Product Specification

Packaging Details Vacuum-sealed packaging, case-packed for storage and transport Delivery Time 4-5 weeks
Payment Terms T/T Supply Ability Stable supply
Purity The purity of crystalline silicon is 99.999%, and the purity of Hsi is 99.99% Density 2.33 g/cm³
Name Silicon Target (Si) Forming Process Spraying, Sintering, Crystal Growth
Product Specifications Flat target, Rotating target Application Fields Optical Device Manufacturing, Semiconductor Manufacturing, Sensor Manufacturing
Brand Name APG Place of Origin china
Certification ISO9001、ISO14001、ISO45001、IAFT16949
High Light Silicon Sputtering Target MaterialHigh Purity Sputtering Target MaterialSilicon Si Target

High Purity Silicon Target Material: Core Material for Thin Film Deposition

Silicon target material is used in physical vapor deposition (PVD) processes, primarily for depositing medium layers such as silicon oxide, silicon nitride, and silicon hydride. It can be divided into crystalline silicon and HSi types. Silicon targets are typically dark gray with a semi-metallic appearance and a density of about 2.33 g/cm³. The melting point of silicon is 1414°C, and its boiling point is 3265°C. Silicon has a high thermal conductivity coefficient (149 W·m⁻¹·K⁻¹) and excellent thermal conductivity. Additionally, silicon target material has good hardness, optical properties, wear resistance, and excellent corrosion resistance.

Excellent Properties of Silicon Target Material:

 

l High Purity Ensures Stable Thin Film Performance


Crystalline silicon has a purity of 99.999%, while HSi purity is 99.99%

 

 

l Excellent Thin Film Uniformity and Density


Silicon targets have a high sputtering efficiency and are compatible with various vacuum coating equipment in the PVD process. At the same time, silicon atoms have good adhesion to common substrates (such as glass, metal, silicon wafers), forming stable, non-peeling films that meet high reliability requirements.

 

 

l Good Sputtering Rate and Adhesion


The good thermal conductivity of silicon helps dissipate heat from the target surface quickly, preventing local overheating. Also, its conductivity is essential for magnetron sputtering, aiding in efficient film deposition.

 

 Wide Applications of Silicon Target Material

 

l Optical Device Manufacturing


High Purity: Silicon targets ensure the clarity, stability, and accuracy of optical devices, enhancing their performance and reliability. Anti-reflection and protective layers: In fiber optic communications and integrated optical circuits, silicon dioxide films are used as waveguide materials to transmit and process optical signals.

 

 

l Semiconductor Manufacturing

 

Used to prepare substrates and packaging materials for LEDs, providng improvement in the luminous efficiency and stability of LEDs.

 

 

l Sensor Manufacturing

 

Used in the production of sensor elements and signal processing circuits, enhancing the sensitivity and accuracy of sensors

 

 

Company Details

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Shenzhen APG Material Company Limited (APG), headquartered in Shenzhen, China, currently operates three factories located in Shenzhen, Changzhou, and Changsha, and employs more than 200 people. APG specializes in the research and development (R&D) and production of PVD materials (sputtering targ... Shenzhen APG Material Company Limited (APG), headquartered in Shenzhen, China, currently operates three factories located in Shenzhen, Changzhou, and Changsha, and employs more than 200 people. APG specializes in the research and development (R&D) and production of PVD materials (sputtering targ...

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  • Shenzhen APG Material Company Limited
  • HQ Add:Rooms 1401,Bldg.2,Runzhi R&D Center,CRB Tech-Innovative City, Xinan Street,Bao'an District,Shenzhen,China
  • https://www.apgsputtertarget.com/

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