Chemical Mechanical Planarization (CMP) Polishing Pads | POLISHER

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Material	Foam
Durability	High
Color	Various
Surfacetype	Smooth and soft for scratch-free polishing
Reusability	Yes, washable and reusable
Product name	Polishing Pad
Certification	ISO 9001 Quality Management System, ISO 14001 Environmental Management System, ISO 45001 Occupational Health and Safety
Place of Origin	China
Brand Name	POLISHER

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Product Specification


Material	Foam	Durability	High
Color	Various	Surfacetype	Smooth and soft for scratch-free polishing
Reusability	Yes, washable and reusable	Product name	Polishing Pad
Certification	ISO 9001 Quality Management System, ISO 14001 Environmental Management System, ISO 45001 Occupational Health and Safety	Place of Origin	China
Brand Name	POLISHER

Chemical Mechanical Planarization (CMP)

Precision CMP Polishing Pads for Semiconductor & Sapphire Wafer Processing

Chemical Mechanical Planarization (CMP) is a process that combines chemical corrosion and mechanical grinding, primarily used for nanoscale planarization of wafer surfaces in 3C electronics and semiconductor manufacturing.

POLISHER CMP Polishing Pads are specifically engineered for CMP processes on materials such as sapphire and silicon wafers. The product line includes three main categories, each suited to a different stage of the polishing process.

Product Line Categories:

Polyurethane Red Pads – For coarse polishing, delivering powerful rough grinding as the first stage of the process
Non-Woven White Pads – For intermediate polishing, bridging coarse and fine processing stages with versatile mid-stage performance
Damped Fabric Black Pads – For fine/final polishing, delivering the ultimate surface perfection at the last stage

Key Advantages:

Broad Slurry Compatibility – Compatible with various polishing slurries, including alumina, ceria, silica, silicon carbide, and diamond
Data-Verified Performance – Performance is data-verified to help enhance quality and efficiency in semiconductor and precision manufacturing
Complete Coarse-to-Fine Chain – A full three-stage pad system covering the entire CMP polishing process

Applications:
Ideal for nanoscale wafer planarization in 3C electronics and semiconductor manufacturing — supporting sapphire, silicon, and related precision material processing

Company Details

Bronze Gleitlager

Bronze Sleeve Bushings

and

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from Quality China Factory

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Business Type:

Manufacturer,Exporter 
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Year Established:

2013 


Total Annual:

20000000-30000000
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Employee Number:

40~50 


Ecer Certification：

Verified Supplier 

Burnish Abrasives Technology Co., Ltd. Headquartered in Shanghai with a state-of-the-art production facility in Changzhou, Jiangsu Province, Burnish Abrasives is an innovation-driven enterprise specializing in the R&D, manufacturing, and global distribution of advanced surface treatment consumab... Burnish Abrasives Technology Co., Ltd. Headquartered in Shanghai with a state-of-the-art production facility in Changzhou, Jiangsu Province, Burnish Abrasives is an innovation-driven enterprise specializing in the R&D, manufacturing, and global distribution of advanced surface treatment consumab...

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Baolishi Grinding Technology (Changzhou) Co., Ltd.
Qianling Road, Zhaiqiao Industrial Park, Wujin District, Changzhou City, Jiangsu Province，China
https://www.baolishipolisher.com/

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