WDS-650 Semi Automatic BGA Rework Station Featuring Touchscreen HMI PLC Control

Product Description:

The Semi Automatic BGA Rework Station is a highly efficient and versatile tool designed for precise and reliable rework of Ball Grid Array (BGA) components. Engineered to meet the demanding requirements of modern electronics manufacturing and repair, this rework station boasts a powerful total power output of 6800 W, ensuring rapid heating and consistent temperature control throughout the entire rework process.

Operating on a single-phase AC 220V ± 10% / 50 Hz power supply, the station is both energy-efficient and compatible with standard electrical systems. It is built to accommodate printed circuit boards (PCBs) up to a maximum size of 470 * 380 mm, providing ample workspace for a wide range of applications, from small-scale repairs to larger, more complex board assemblies.

One of the standout features of this Semi Automatic BGA Rework Station is its advanced three heating zone design. This innovative setup allows for precise temperature control across different areas of the PCB, minimizing thermal stress and reducing the risk of damage to sensitive components. The three heating zones work in harmony to provide uniform heat distribution, essential for achieving high-quality solder joints and ensuring the longevity of the repaired components.

The station utilizes hot air heating technology, which offers a clean, efficient, and controlled thermal environment. Hot air heating is particularly advantageous when working with delicate BGAs, as it enables selective heating without direct contact, reducing the chance of mechanical damage. This method also supports quick heating and cooling cycles, significantly improving the overall workflow speed and productivity.

Equipped with an optical alignment system, the Semi Automatic BGA Rework Station ensures precise placement and alignment of components. This system enhances accuracy during the soldering and removal processes, minimizing errors and improving rework quality. The optical alignment system is especially useful when dealing with fine-pitch BGAs and components with complex layouts, where even the slightest misalignment can lead to functional failures.

The machine offers five versatile operating modes to cater to different user needs and skill levels. These modes include Automatic Soldering, Automatic Removal, Automatic Placement, Semi-automatic, and Manual. This comprehensive mode selection allows operators to choose the most suitable method for each task, whether they require full automation for efficiency or manual control for delicate, custom work. Such flexibility makes the station an excellent choice for diverse production environments, from small repair shops to large-scale manufacturing facilities.

In terms of physical specifications, the rework station measures 82 cm in length, 72 cm in width, and 89 cm in height, with a total weight of 90 kg. This compact footprint ensures that it can be conveniently integrated into existing workspaces without occupying excessive space, while its robust construction guarantees durability and stability during operation.

Overall, the Semi Automatic BGA Rework Station combines powerful heating capabilities, precise optical alignment, and flexible operation modes to deliver a reliable and user-friendly solution for BGA rework tasks. Its three heating zones and hot air heating technology provide exceptional temperature control and safety, making it an indispensable tool for electronics professionals seeking efficiency, accuracy, and quality in their rework processes.

Features:

• Product Name: Semi Automatic BGA Rework Station
• Type: Semi Automatic
• Minimum Order Quantity: 1 Piece
• Maximum Load Capacity: 300g
• Temperature Precision: ± 1℃ for accurate hot air heating
• Overall Dimension: 655 * 620 * 590 Mm
• Equipped with advanced hot air heating technology for efficient BGA rework
• Ideal for precise motherboard repair and component replacement
• User-friendly interface suitable for professional and semi-professional use

Technical Parameters:

Applications:

The Wisdomshow WDS-650 Semi Automatic BGA Rework Station is an advanced and reliable solution designed for precision and efficiency in electronic repair and manufacturing. Originating from China and certified with CE, this high-performance rework station is ideal for various product application occasions and scenarios, especially where accurate and delicate operations are paramount. Equipped with a powerful total power capacity of 6800 W and a down heater power of 4000 W (with 2000 W controlled), the WDS-650 ensures rapid and even heating, crucial for successful BGA rework processes.

One of the standout features of the Wisdomshow WDS-650 is its integrated optical alignment system, which allows technicians to achieve precise positioning of components on the PCB. This optical alignment system significantly reduces errors and improves the success rate of reballing and soldering tasks, making it indispensable in high-stakes environments such as motherboard repair and other PCB servicing tasks. The station supports PCBs up to 470 * 380 mm in size and can handle components with a maximum load of 300g, offering versatility across a wide range of electronic devices.

This semi-automatic BGA rework station is commonly utilized in specialized repair shops, electronics manufacturing plants, and quality control labs where motherboard repair is frequently required. The built-in temperature measuring interface with 3 sensors ensures accurate thermal monitoring during the rework process, preventing overheating and damage to sensitive components. The station’s user-friendly interface and reliable performance make it suitable for both experienced technicians and those new to BGA rework operations.

With a minimum order quantity of just one unit, and delivery time ranging between 3 to 5 days, the Wisdomshow WDS-650 is readily accessible for urgent repair and production needs. Packaged securely in a wooden case to ensure safe transport, this rework station supports payment via TT and is backed by a supply ability of 200 units, catering efficiently to market demand. Whether used for small-scale motherboard repair or larger production line applications, the WDS-650’s optical alignment system and robust heating capabilities make it an essential tool for achieving precision and reliability in BGA rework tasks.