Hyperline Beijing Ltd.
| Delivery Time | 4-8weeks |
| Payment Terms | T/T |
| Supply Ability | 100,000/year |
| Product Name | diode laser module |
| Output Power | 5mW |
| Wavelength | 520nm |
| Fiber bundle diameter | 4µm |
| Numerical aperture | 0.13N.A |
| Application | Printing,Aiming beam |
| Place of Origin | China |
| Brand Name | BWT |
| Certification | ISO9001 |
| Model Number | K520F03SN-0.005W |
View Detail Information
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Product Specification
| Delivery Time | 4-8weeks | Payment Terms | T/T |
| Supply Ability | 100,000/year | Product Name | diode laser module |
| Output Power | 5mW | Wavelength | 520nm |
| Fiber bundle diameter | 4µm | Numerical aperture | 0.13N.A |
| Application | Printing,Aiming beam | Place of Origin | China |
| Brand Name | BWT | Certification | ISO9001 |
| Model Number | K520F03SN-0.005W | ||
| High Light | red laser module ，red laser diode | ||
Features:
520nm wavelength
5mW output power
4µm fiber core diameter
0.13N.A.
Applications:
Aiming Beam
| Specifications (25℃) | Symbol | Unit | K520F03SN-0.005W | |||
| Minimum | Typical | Maximum | ||||
| Parameter | CW Output Power | Po | mW | 5 | - | - |
| Threshold current | Ith | mA | - | 50 | ||
| Operating current | Iop | mA | - | 150 | 160 | |
| Operating voltage | Vop | V | - | 7.3 | 8 | |
| Reverse Voltage | Vre | V | - | 2 | - | |
| Slope Efficiency | η | W/A | - | 0.25 | - | |
| Electrical-to-Optical Efficiency | PE | % | 0.1 | - | - | |
| Center wavelength | λc | nm | 510 | - | 530 | |
| Spectral width(FWHM) | △λ | nm | - | - | 3 | |
| Wavelength Shift with Temperature | - | nm/℃ | - | 0.2 | - | |
| Fiber Data | Buffer diameter | Dbuf | μm | - | 250 | - |
| Cladding diameter | Dclad | μm | - | 125 | - | |
| Core diameter | Dcore | μm | - | 4 | - | |
| Numeric aperture | NA | NA | - | 0.13 | - | |
| Fiber length | lc | m | 0.9 | 1 | 1.1 | |
| Connector | - | - | FC/FA/SC/SA/SMA905/ST | |||
| Fiber Bend Radius | - | mm | - | 40 | - | |
| Others | ESD | - | V | - | - | 500 |
| Storage temperature | - | ℃ | -20 | - | 70 | |
| Lead Soldering Temp | Tis | ℃ | - | - | 260 | |
| Lead Soldering Time | Tis | sec | - | - | 10 | |
| Operating case temperature | Top | ℃ | 15 | - | 35 | |
| Relative Humidity | - | % | 15 | - | 75 | |
Company Details
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