Resin Bond Diamond Dish Shape Grinding Wheel 150*26*31.75*6*6mm Suitable For

Product Description:

Diamond resin-bonded grinding wheels are grinding tools made with diamond as the abrasive and resin as the binder. They feature excellent self-sharpening properties, high grinding efficiency, and good heat dissipation. They are primarily used for fine grinding and polishing of high-hardness materials such as cemented carbide, ceramics, optical glass, and semiconductors. Their manufacturing process utilizes low-temperature curing technology to achieve complex shapes, while optimizing the abrasive orientation and binder ratio to enhance wear resistance and sharpness. These grinding wheels offer significant advantages in tool sharpening and cutting hard and brittle materials.

Resin-bonded diamond grinding wheels offer exceptionally high surface finish quality. Thanks to their excellent self-sharpening properties and the inherent elasticity of the resin bond, they effectively absorb grinding vibrations, resulting in extremely low surface roughness (Ra), preventing surface damage such as burns and micro-cracks on the workpiece, and ensuring perfect machining integrity.

Resin-bonded diamond grinding wheels also offer the advantages of low grinding forces and temperatures. Their sharp cutting characteristics reduce grinding resistance and energy consumption. Combined with coolant, they effectively control the temperature of the grinding zone, making them particularly suitable for machining heat-sensitive materials.

Resin-bonded diamond grinding wheels offer a wide range of adaptability: by adjusting the diamond concentration, grit size, resin formulation, and additives, they can be customized to meet a wide range of processing requirements, from rough grinding to mirror polishing.Resin-bonded diamond grinding wheels also offer excellent economic benefits: while the cost per wheel may be lower than that of metal-bonded grinding wheels, their true advantage lies in the reduced overall cost per part, resulting from their high material removal rate and excellent surface quality.

Features:

1. Fast feed rate and high grinding efficiency, while also reducing grinding wheel consumption;

2. Excellent self-sharpening performance, low heat generation during grinding, and resistance to clogging, which reduces burns during grinding;

3. The grinding wheel has a certain degree of elasticity, which helps improve the surface roughness of workpieces. It is mainly used in processes such as fine grinding, semi-fine grinding, knife grinding, and polishing;

4. The grinding wheel cures at low temperatures, resulting in a short production cycle. The equipment and supply process are convenient, fast, and simple;

5. Our company has professional technology and equipment.

Technical Parameters:

Applications:

Resin-reinforced diamond grinding wheels are primarily used for precision machining of high-hardness materials:

Carbide: tool sharpening, CNC blade shaping

Non-metallic materials: ceramic body finishing, optical glass cutting

Semiconductor industry: wafer backside thinning, magnetic material polishing

In the stone processing industry, they are suitable for grooving agate rough stones and cutting granite into special shapes.

Resin-reinforced diamond grinding wheels, due to their exceptional self-sharpening properties, excellent polishing performance, and ability to achieve superior workpiece surface quality, have secured an irreplaceable position in the precision machining field. Their core application revolves around machining hard and brittle materials with high surface quality requirements. Carbide tool grinding is the most traditional and largest application area for resin-reinforced diamond grinding wheels, targeting carbide milling cutters, drills, reamers, taps, inserts, broaches, and more. Superhard material tool machining targets polycrystalline diamond (PCD) and polycrystalline cubic boron nitride (PCBN) tools. Ceramic material machining targets advanced structural and functional ceramics such as zirconium oxide (ZrO₂), aluminum oxide (Al₂O₃), silicon nitride (Si₃N₄), and silicon carbide (SiC). The semiconductor and optical industries are fields that place extremely high demands on machining accuracy and surface integrity.

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