Shenzhen Bicheng Electronics Technology Co., Ltd
| Payment Terms | T/T, Paypal |
| Supply Ability | 45000 pieces per month |
| Delivery Time | 4-5 working days |
| Packaging Details | Vacuum |
| Board Material | Aluminum PCB, MCPCB ITEQ 150℃ |
| Board Thickness | 1.20 mm +/-0.1 |
| Surface Cu thickness | 280 um (8 oz) |
| Surface Finish | OSP |
| Solder Mask Colour | N/A |
| Color of Silkscreen | N/A |
| Function | 100% Pass electrical test |
| Brand Name | Bicheng Enterprise Limited |
| Model Number | BIC-0583-V5.83 |
| Certification | UL |
| Place of Origin | China |
View Detail Information
Explore similar products
PCB with Ball Grid Array 10-Layer BGA PCB Built On High Tg FR-4 With Immersion
Gold Finger PCB Gold-plated Edge Connector Circuit Board Hard Gold Contact
Metal Core PCB Built On Aluminum Base With 3W/MK Dielectric and Immersion Gold
Heavy Copper PCB Built On Aluminum Base With 10 Oz Copper Weight
Product Specification
| Payment Terms | T/T, Paypal | Supply Ability | 45000 pieces per month |
| Delivery Time | 4-5 working days | Packaging Details | Vacuum |
| Board Material | Aluminum PCB, MCPCB ITEQ 150℃ | Board Thickness | 1.20 mm +/-0.1 |
| Surface Cu thickness | 280 um (8 oz) | Surface Finish | OSP |
| Solder Mask Colour | N/A | Color of Silkscreen | N/A |
| Function | 100% Pass electrical test | Brand Name | Bicheng Enterprise Limited |
| Model Number | BIC-0583-V5.83 | Certification | UL |
| Place of Origin | China |
General Profile
Metal core PCB is thermal management circuit board used in LED lighting which
needs fast cooling dissipation. The metal core can be aluminum (aluminum core
PCB) and copper (copper core PCB), even iron base. The fastest speed of heat
transfer is on copper which is designed in the form of thermoelectric separation.
Advantages
1) Effective heat dissipation reduces the operating temperature of the module
and prolongs the service life;
2) Power density and reliability are improved up 10%;
3) Reduce the dependence of heat sinks and other hardware (including thermal
interface materials);
4) Reduce the volume of the product;
5) Reduce the cost of hardware and assembly;
6) Optimization combination of power circuit and control circuit;
7) Replace the fragile ceramic substrate and obtain a better mechanical durability;
8) Reduce the operating temperature of the equipment;
Applications
LED lighting, Switch regulator, DC/AC converter, Communication electronic
equipment, A filter electric circuit, Office automation equipment, Motor driver,
Motor controller, Automobile etc.
Metal Core PCB Capability
| NO. | Parameter | Value |
| 1 | Type of Metal Core | Aluminum, Copper, Iron |
| 2 | Model of Metal Core | A1100, A5052, A6061, A6063, C1100 |
| 3 | Surface Finish | HASL, Immersion Gold, Immersion Silver, OSP |
| 4 | Thickness of Surface plating | HASL: Sn>2.54µm, ENIG: Au 0.025-0.1µm, Ni 2.5-5µm |
| 5 | Layer Count | 1-4 Layers |
| 6 | Maximum of Board Size | 23" x 46" (584mm×1168mm) |
| 7 | Mininum of Board Size | 0.1969" x 0.1969" (5mm×5mm) |
| 8 | Board Thickness | 0.0157" x 0.2362" (0.4-6.0mm) |
| 9 | Copper Thickness | 0.5OZ(17.5µm),1OZ(35µm), 2OZ(70µm),3OZ(105µm), 4OZ(140µm) to 10oz (350µm) |
| 10 | Minimum Track Width | 5mil (0.127mm) |
| 11 | Minimum Space | 5mil (0.127mm) |
| 12 | Minimum Hole Size | 0.0197" (0.5mm) |
| 13 | Maximum Hole Size | No limit |
| 14 | Minimum Holes Punched | PCB thickness <1.0mm: 0.0394" (1.0mm) |
| PCB thikness 1.2-3.0mm: 0.0591" (1.5mm) | ||
| 15 | PTH Wall Thickness | >20µm |
| 16 | Tolerance of PTH | ±0.00295" (0.075mm) |
| 17 | Tolerance of NPTH | ±0.00197" (0.05mm) |
| 18 | Deviation of Hole Position | ±0.00394" (0.10mm) |
| 19 | Outline Tolerance | Routing: ±0.00394" (0.1mm) |
| Punching: ±0.00591" (0.15mm) | ||
| 20 | Angle of V-cut | 30°, 45°, 60° |
| 21 | V-cut Size | 0.1969" x 47.24" (5mm×1200mm) |
| 22 | Thickness of V-cut Board | 0.0236" x 0.1181" (0.6-3mm) |
| 23 | Tolerance of V-cut Angle | ±5º |
| 24 | V-CUT Verticality | ≤0.0059" (0.15mm) |
| 25 | Minimum Square Slots Punched | PCB thickness < 1.0mm: 0.0315" x 0.0315" (0.8 x 0.8mm) |
| PCB thickness 1.2-3.0mm: 0.0394" x 0.0394" (1.0 x 1.0mm) | ||
| 26 | Minimum BGA PAD | 0.01378" (0.35mm) |
| 27 | Minimum Width of Solder Mask Bridge. | 8mil (0.2032mm) |
| 28 | Minimum Thickness of Solder Mask | >13µm (0.013mm) |
| 29 | Insulation Resistance | 1012ΩNormal |
| 30 | Peel-off Strength | 2.2N/mm |
| 31 | Solder float | 260℃ 3min |
| 32 | E-test Voltage | 50-250V |
| 33 | Thermal Conductivity | 0.8-8W/M.K |
| 34 | Warp or Twist | ≤0.5% |
| 35 | Flammability | FV-0 |
| 36 | Minimum Height of Component indicator | 0.0059"(0.15mm) |
| 37 | Minimum Open Solder Mask on Pad | 0.000394" (0.01mm) |
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Seller
Year Established:
2003
Total Annual:
10 million-18 million
Employee Number:
350~450
Ecer Certification：
Site Member
Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millimeter wave equipm... Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millimeter wave equipm...
Get in touch with us
Leave a Message, we will call you back quickly!