Shenzhen Bicheng Electronics Technology Co., Ltd
| Payment Terms | T/T, Paypal |
| Supply Ability | 45000 pieces per month |
| Delivery Time | 10 working days |
| Packaging Details | Vacuum |
| Glass Epoxy | RO4730G3, RogersCorp |
| Final height of PCB | 0.8mm ± 10% |
| Final foil external: | 1 oz |
| Surface Finish | Immersion gold (51.3% ) 0.05µm over 3µm nickel |
| Solder Mask Color: | NO |
| Colour of Component Legend | N/A |
| Number of Layers | 2 |
| Test | 100% Electrical Test prior shipment |
| Brand Name | Bicheng Enterprise Limited |
| Model Number | BIC-0059-V0.1 |
| Certification | UL |
| Place of Origin | China |
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Product Specification
| Payment Terms | T/T, Paypal | Supply Ability | 45000 pieces per month |
| Delivery Time | 10 working days | Packaging Details | Vacuum |
| Glass Epoxy | RO4730G3, RogersCorp | Final height of PCB | 0.8mm ± 10% |
| Final foil external: | 1 oz | Surface Finish | Immersion gold (51.3% ) 0.05µm over 3µm nickel |
| Solder Mask Color: | NO | Colour of Component Legend | N/A |
| Number of Layers | 2 | Test | 100% Electrical Test prior shipment |
| Brand Name | Bicheng Enterprise Limited | Model Number | BIC-0059-V0.1 |
| Certification | UL | Place of Origin | China |
RO4730G3 30mil 0.762mm High Frequency PCB for Wireless Telecommunications Antennas
Rogers RO4730G3 antenna grade laminates are reliable, low-cost alternative to the conventional PTFE-based laminates. It has the mechanical and electrical properties that antenna designers need. The materials have a dielectric constant of 3.0 and a loss tangent of 0.0022 measured at 2.5 GHz when using LoPro Reverse Treated EDC foil. These values allow antenna designers to realize substantial gain values while minimizing signal loss. Materials are available with demonstrated low PIM performance, with values better than -160dBc.
RO4730G3 materials are compatible with conventional epoxy and high temperature lead-free solder processing. It does not require the special treatment needed on traditional PTFE-based laminates for plated through holes preparation. Multi-layer can be achieved using RO4450F bondply at 175 ℃. The resin systems of RO4730G3 are designed to provide the properties sought after by antenna designers. The glass transition temperature exceeds 280oC, leading to a low Z-axis CTE, excellent plated through holes reliability, and lead free solder processability.
Typical application is cellular base station antennas.
General description
This is a type of double sided RF PCB built on 0.762mm (30mil) RO4730G3 for the application of Wireless telecommunications antennas.
Basic specifications
Base material: RO4730G3 30mil (0.762mm)
Dielectric constant: 3.0+/-0.5
Layer count: 2 layers
Type: Through holes
Format: 110mm x 100mm = 1 type = 1 piece
Surface finish: Immersion gold
Copper weight: Outer layer 35 μm
Solder mask | Legend: Green | White
Final PCB height: 1.1 mm
Standard: IPC 6012 Class 2
Packing: 20 pieces are packed for shipment.
Lead time: 7 working days
Shelf life: 6 months
| RO4730G3 Typical Value | |||||
| Property | RO4730G3 | Direction | Units | Condition | Test Method |
| Dielectric Constant,εProcess | 3.0±0.5 | Z | 10 GHz 23℃ | IPC-TM-650 2.5.5.5 | |
| Dielectric Constant,εDesign | 2.98 | Z | 1.7 GHz to 5 GHz | Differential Phase Length Method | |
| Dissipation Factor,tanδ | 0.0028 | Z | 10 GHz 23℃ | IPC-TM-650 2.5.5.5 | |
| 2.5 GHz | |||||
| Thermal Coefficient of ε | +34 | Z | ppm/℃ | -50 ℃to 150℃ | IPC-TM-650 2.5.5.5 |
| Dimensional Stability | <0.4 | X, Y | mm/m | after etech +E2/150 ℃ | IPC-TM-650 2.4.39A |
| Volume Resistivity (0.030") | 9 X 107 | MΩ.cm | COND A | IPC-TM-650 2.5.17.1 | |
| Surface Resistivity (0.030") | 7.2 X 105 | MΩ | COND A | IPC-TM-650 2.5.17.1 | |
| PIM | -165 | dBc | 50 ohm 0.060" | 43 dBm 1900 MHz | |
| Electrical Strength (0.030") | 730 | Z | V/mil | IPC-TM-650 2.5.6.2 | |
| Flexural Strength MD | 181 (26.3) | Mpa (kpsi) | RT | ASTM D790 | |
| CMD | 139 (20.2) | ||||
| Moisure Absorption | 0.093 | - | % | 48/50 | IPC-TM-650 2.6.2.1 ASTM D570 |
| Thermal Conductivity | 0.45 | Z | W/mK | 50℃ | ASTM D5470 |
| Coefficient of Thermal Expansion | 15.9 14.4 35.2 | X Y Z | ppm/℃ | -50 ℃to 288℃ | IPC-TM-650 2.4.4.1 |
| Tg | >280 | ℃ | IPC-TM-650 2.4.24 | ||
| Td | 411 | ℃ | ASTM D3850 | ||
| Density | 1.58 | gm/cm3 | ASTM D792 | ||
| Copper Peel Stength | 4.1 | pli | 1oz,LoPro EDC | IPC-TM-650 2.4.8 | |
| Flammability | V-0 | UL 94 | |||
| Lead-free Process Compatible | Yes | ||||
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Seller
Year Established:
2003
Total Annual:
10 million-18 million
Employee Number:
350~450
Ecer Certification：
Site Member
Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millimeter wave equipm... Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millimeter wave equipm...
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