Shenzhen Bicheng Electronics Technology Co., Ltd
| Payment Terms | T/T, Western Union |
| Supply Ability | 45000 pieces per month |
| Delivery Time | 10 working days |
| Packaging Details | Vacuum |
| Glass Epoxy | S1000-2M |
| Solder Mask Color | Green |
| Test | 100% Electrical Test prior shipment |
| Surface Finish | HASL LF |
| Colour of Component Legend | White |
| Final foil | 1.5 Oz |
| Number of Layers | 6 |
| Final height of PCB | 1.6 mm ±10% |
| Brand Name | Bicheng Technologies Limited |
| Model Number | BIC-505-V0.45 |
| Certification | UL |
| Place of Origin | China |
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Product Specification
| Payment Terms | T/T, Western Union | Supply Ability | 45000 pieces per month |
| Delivery Time | 10 working days | Packaging Details | Vacuum |
| Glass Epoxy | S1000-2M | Solder Mask Color | Green |
| Test | 100% Electrical Test prior shipment | Surface Finish | HASL LF |
| Colour of Component Legend | White | Final foil | 1.5 Oz |
| Number of Layers | 6 | Final height of PCB | 1.6 mm ±10% |
| Brand Name | Bicheng Technologies Limited | Model Number | BIC-505-V0.45 |
| Certification | UL | Place of Origin | China |
High Tg Printed Circuit Board (PCB) Made on S1000-2M With Immersion Gold and 90 Ohm Impedance Control
(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)
Brief Introduction
This is a type of high Tg PCB with differential impedance on layer 3 at 6mil/7mil, 6mil/10mil; and layer 4 at 7mil/7mil and 6mil/7mil track/gap. It is made on high performance and low CTE FR-4 S1000-2M. It’s 6-layer board with 1 oz copper each layer, coating with hot air soldering level (HASL) and green solder mask. It’s supplied by individual board with V-cut. 25 boards are packed for shipment.
Applications
Computers
Communications
Automotive electronics etc.
PCB Parameters
| Item | Description | Requirement | Actual | Result |
| 1. Laminate | Material Type | FR-4 S1000-2M | FR-4 S1000-2M | ACC |
| Tg | 170℃ | 170℃ | ACC | |
| Supplier | SHENGYI | SHENGYI | ACC | |
| Thickness | 1.6±10% mm | 1.63-1.68mm | ACC | |
| 2.Plating thickness | Hole Wall | ≥25µm | 30.17µm | ACC |
| Outer copper | 35µm | 41.09µm | ACC | |
| Inner Copper | 30µm | 33.69µm | ACC | |
| 3.Solder mask | Material Type | TAIYO/ PSR-2000GT600D | TAIYO/ PSR-2000GT600D | ACC |
| Color | Green | Green | ACC | |
| Rigidity (Pencil Test) | ≥4H or above | 5H | ACC | |
| S/M Thickness | ≥10 µm | 20.11µm | ACC | |
| Location | Both Sides | Both Sides | ACC | |
| 4. Component Mark | Material Type | TAIYO/ IJR-4000 MW300 | IJR-4000 MW300 | ACC |
| Color | White | White | ACC | |
| Location | C/S | C/S | ACC | |
| 5. Peelable Solder Mask | Material Type | |||
| Thickness | ||||
| Location | ||||
| 6. Identification | UL Mark | YES | YES | ACC |
| Date Code | WWYY | 0421 | ACC | |
| Mark Location | Solder Side | Solder Side | ACC | |
| 7. Surface Finish | Method | HASL Lead Free | HASL Lead Free | ACC |
| Tin Thickness | 3-6µm | 4.06µm | ACC | |
| Nickel Thickness | ||||
| Gold Thickness | ||||
| 8. Normativeness | RoHS | Directive 2015/863/EU | OK | ACC |
| REACH | Directive 1907 /2006 | OK | ACC | |
| 9.Annular Ring | Min. Line Width (mil) | 6mil | 5.8mil | ACC |
| Min. Spacing (mil) | 5mil | 5.2mil | ACC | |
| 10.V-groove | Angle | |||
| Residual thickness | ||||
| 11. Beveling | Angle | |||
| Height | ||||
| 12. Function | Electrical Test | 100% PASS | 100% PASS | ACC |
| 13. Appearance | IPC Class Level | IPC-A-600J &6012D Class 2 | IPC-A-600J &6012D Class 2 | ACC |
| Visual Inspection | IPC-A-600J &6012D Class 2 | IPC-A-600J &6012D Class 2 | ACC | |
| Warp and Twist | ≦0.7% | 0.21% | ACC | |
| 14. Reliability Test | Tape Test | No Peeling | OK | ACC |
| Solvent Test | No Peeling | OK | ACC | |
| Solderability Test | 265 ±5℃ | OK | ACC | |
| Thermal Stress Test | 288 ±5℃ | OK | ACC | |
| Ionic Contamination Test | ≦ 1.56 µg/c㎡ | 0.56µg/c㎡ | ACC |
Hole Diameter Measurement (Unit: mm),Tolerance: PTH±0.075; NPTH±0.05
| Hole Code | PTH | Required | Actual value | Result | |||
| 1 | Y | 0.375 | 0.375 | 0.400 | 0.400 | 0.375 | ACC |
| 2 | Y | 0.500 | 0.500 | 0.550 | 0.525 | 0.525 | ACC |
| 3 | Y | 0.7*2.4 | 0.7*2.4 | 0.7*2.41 | 0.69*2.4 | 0.7*2.4 | ACC |
| 4 | Y | 0.625 | 0.625 | 0.600 | 0.625 | 0.600 | ACC |
| 5 | Y | 0.725 | 0.725 | 0.725 | 0.750 | 0.725 | ACC |
| 6 | Y | 0.900 | 0.925 | 0.900 | 0.900 | 0.900 | ACC |
| 7 | Y | 1.000 | 1.000 | 0.950 | 0.975 | 1.000 | ACC |
| 8 | N | 1.050 | 1.050 | 1.050 | 1.075 | 1.050 | ACC |
| 9 | Y | 1.300 | 1.300 | 1.300 | 1.325 | 1.325 | ACC |
| 10 | Y | 1.350 | 1.350 | 1.325 | 1.350 | 1.325 | ACC |
| 11 | Y | 1.575 | 1.575 | 1.600 | 1.600 | 1.575 | ACC |
| 12 | Y | 1.650 | 1.650 | 1.700 | 1.675 | 1.675 | ACC |
| 13 | Y | 1.700 | 1.700 | 1.750 | 1.725 | 1.725 | ACC |
| 14 | Y | 3.250 | 3.250 | 3.250 | 3.275 | 3.250 | ACC |
| 15 | Y | 3.450 | 3.450 | 3.400 | 3.425 | 3.450 | ACC |
| 16 | Y | 0.7*2.6 | 0.7*259 | 0.7*2.61 | 0.69*2.6 | 0.7*2.59 | ACC |
Impedance Test Report
| Sample NO. | Layer | Line Width(mil)±10% | Line Space (mil)±10% | Impedance Type | Required Value (ohm) | Tolerance | Actual Value | Result | |
| Single End | Differential | ||||||||
| 1 | L3 | 6.000 | 7.000 | V | 90.00 | ±10% | 93.59 | ACC | |
| L3 | 6.000 | 10.000 | V | 100.00 | ±10% | 102.33 | ACC | ||
| L4 | 7.000 | 7.000 | V | 90.00 | ±10% | 88.99 | ACC | ||
| L4 | 6.000 | 7.000 | V | 90.00 | ±10% | 90.76 | ACC | ||
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Seller
Year Established:
2003
Total Annual:
10 million-18 million
Employee Number:
350~450
Ecer Certification：
Site Member
Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd. has established itself as a reliable high-frequency PCB supplier and exporter based in Shenzhen, China. For over 24 years, we have served industries worldwide, including cellular base station antennas, satellite communi... Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd. has established itself as a reliable high-frequency PCB supplier and exporter based in Shenzhen, China. For over 24 years, we have served industries worldwide, including cellular base station antennas, satellite communi...
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