Shenzhen Bicheng Electronics Technology Co., Ltd
| Payment Terms | T/T, Paypal |
| Supply Ability | 45000 pieces per month |
| Delivery Time | 5-6 working days |
| Packaging Details | Vacuum |
| Glass Epoxy | RF-35A2 |
| Final height of PCB | 0.8 mm ±10% |
| Final foil external | 1.0 oz |
| Surface Finish | ENIG |
| Solder Mask Color | Green |
| Colour of Component Legend | White |
| TEST | 100% Electrical Test prior shipment |
| Brand Name | Bicheng Technologies Limited |
| Model Number | BIC-168-V7.83 |
| Certification | UL |
| Place of Origin | China |
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Product Specification
| Payment Terms | T/T, Paypal | Supply Ability | 45000 pieces per month |
| Delivery Time | 5-6 working days | Packaging Details | Vacuum |
| Glass Epoxy | RF-35A2 | Final height of PCB | 0.8 mm ±10% |
| Final foil external | 1.0 oz | Surface Finish | ENIG |
| Solder Mask Color | Green | Colour of Component Legend | White |
| TEST | 100% Electrical Test prior shipment | Brand Name | Bicheng Technologies Limited |
| Model Number | BIC-168-V7.83 | Certification | UL |
| Place of Origin | China |
Taconic RF-35A2 PCB 20mil (0.508 mm) 30mil(0.762mm) 60mil (1.524mm) With Immersion Gold Immersion Silver and Blue Mask
(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)
Taconic’s RF-35A2 substrate is designed to have ultra-low fiberglass content to achieve "best in class" insertion loss properties and the uniform dielectric constant 3.5 +/-0.05 throughout the laminate. It is a type of ultra low loss power amplifier material.
The uniform dispersion of ceramics throughout the laminate yields an extremely low X and Y thermal expansion coefficient. Low modulus and low X-Y CTE values make RF-35A2 an attractive material for chip carrier in surface mounting technology.
RF-35A2 is manufactured with a proprietary multi-step process with excellent dielectric performance and excellent copper peel adhesion.The low 0.0015 dissipation factor at 10 GHz allows for maximum power transfer resulting in low heat generation.
Benefits:
Low loss properties
DK tolerance of +/- 0.05
Homogeneous DK
Excellent peel strength
Low moisture absorption
Our PCB Capability (RF-35A2)
| PCB Material: | PTFE Ceramic Fiberglass |
| Designation: | RF-35A2 |
| Dielectric constant: | 3.15 |
| Dissipation Factor | 0.0015 |
| Layer count: | Double Layer, Multilayer, Hybrid PCB |
| Copper weight: | 0.5oz (17 µm), 1oz (35µm) |
| PCB thickness: | 10mil (0.254mm); 20mil (0.508mm), 30mil (0.762mm), 60mil (1.524mm) |
| PCB size: | ≤400mm X 500mm |
| Solder mask: | Green, Black, Blue, Yellow, Red etc. |
| Surface finish: | Bare copper, HASL, ENIG, Immersion silver, Immersoin tin, OSP etc.. |
Applications:
Power amplifiers
Filters / couplers
High speed digital
Passive components
Wireless antennas
RF-35A2 Typical Values
| Property | Test Method | Unit | Value | Unit | Value |
| Dk @ 10 GHz | IPC-650 2.5.5.5.1 (Modified) | 3.5 | 3.5 | ||
| Df @ 10 GHz | IPC-650 2.5.5.5.1 (Modified) | 0.0015 | 0.0015 | ||
| Moisture Absorption | IPC-650 2.6.2.1 | % | 0.03 | % | 0.03 |
| Dielectric Breakdown | IPC-650 2.5.6/ASTM D 149 | kV | 59 | kV | 59 |
| Dielectric Strength | ASTM D 149 | V/mil | 1000 | V/mm | 39,370 |
| Volume Resistivity | IPC-650 2.5.17.1 Sec. 5.2.1 (Humidity Cond.) | Mohm/cm | 10^9 | Mohm/cm | 10^9 |
| Surface Resistivity | IPC-650 2.5.17.1 Sec. 5.2.1 (Humidity Cond.) | Mohm | 10^8 | Mohm | 10^8 |
| Arc Resistance | IPC-650 2.5.1 | Seconds | 242 | Seconds | 242 |
| Flexural Strength (MD) | IPC-650 2.4.4 | kpsi | 24 | N/mm2 | 165 |
| Flexural Strength (CD) | IPC-650 2.4.4 | kpsi | 15 | N/mm2 | 103 |
| Tensile Strength (MD) | ASTM D 3039 | psi | 16,800 | N/mm2 | 116 |
| Tensile Strength (CD) | ASTM D 3039 | psi | 11,000 | N/mm2 | 75.8 |
| Young’s Modulus (MD) | ASTM D 3039 | psi | 106 | N/mm2 | 8,343 |
| Young’s Modulus (CD) | ASTM D 3039 | psi | 106 | N/mm2 | 7,171 |
| Poisson’s Ratio (MD) | ASTM D 3039 | 0.14 | 0.14 | ||
| Poisson’s Ratio (CD) | ASTM D 3039 | 0.1 | 0.1 | ||
| Strain at Break (MD) | ASTM D 3039 | % | 1.6 | % | 1.6 |
| Strain at Break (CD) | ASTM D 3039 | % | 1.4 | % | 1.4 |
| Compressive Modulus (Z axis) | ASTM D 695 (23°C) | kpsi | 385 | N/mm2 | 2,650 |
| Peel Strength (1 oz. VLP) | IPC-650 2.4.8 (Thermal Stress) | lbs/in | 12 | N/mm | 2.1 |
| Peel Strength (1 oz. VLP) | IPC-650 2.4.8.3 (150°C ) (Elevated Temp.) | lbs/in | 14 | N/mm | 2.5 |
| Peel Strength (1 oz. VLP) | IPC-650 2.4.8 Sec. 5.2.3 (Proc. Chemicals) | lbs/in | 11 | N/mm | 2 |
| Density (Specific Gravity) | gm/cm3 | 2.28 | gm/cm3 | 2.28 | |
| Specific Heat | ASTM E 1269 (DSC) (100°C) | J/g/K | 0.99 | J/g/K | 0.99 |
| Thermal Conductivity | ASTM F 433 | W/M*K | 0.29 | W/M*K | 0.29 |
| Td | IPC-650 2.4.24.6 2% Weight Loss | °C | 528 | °C | 528 |
| Td | IPC-650 2.4.24.6 5% Weight Loss | °C | 547 | °C | 547 |
| CTE (x) | IPC-650 2.4.41 (>RT - 125°C) | ppm/°C | 10 | ppm/°C | 10 |
| CTE (y) | IPC-650 2.4.41 (>RT - 125°C) | ppm/°C | 13 | ppm/°C | 13 |
| CTE (z) | IPC-650 2.4.41 (>RT - 125°C) | ppm/°C | 108 | ppm/°C | 108 |
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Seller
Year Established:
2003
Total Annual:
10 million-18 million
Employee Number:
350~450
Ecer Certification：
Site Member
Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millimeter wave equipm... Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millimeter wave equipm...
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