Shenzhen Bicheng Electronics Technology Co., Ltd
| Payment Terms | T/T, Paypal |
| Supply Ability | 50000pcs |
| Delivery Time | 2-10 working days |
| Packaging Details | Packing |
| Brand Name | Rogers |
| Model Number | RT5880 |
| Certification | ISO9001 |
| Place of Origin | China |
View Detail Information
Explore similar products
Rogers RO4003C LoPro 20.7mil Double-Sided Copper Clad Laminate raw material
Rogers RO4730G3 RF Printed Circuit Board 2-Layer Rogers 4730 60mil 1.524mm
RO3010 4-layer rigid PCB 2.6mm Thick with Immersion Tin and no solder mask
Rogers RO4003C/RO4450F Mixed Pressure 3-Layer PCB, 1.82mm Thickness Substrates
Product Specification
| Payment Terms | T/T, Paypal | Supply Ability | 50000pcs |
| Delivery Time | 2-10 working days | Packaging Details | Packing |
| Brand Name | Rogers | Model Number | RT5880 |
| Certification | ISO9001 | Place of Origin | China |
4-Layer PCB with RT5880 + TG170 FR-4 Hybrid Stackup
Designed with precision and high-performance materials, this 4-layer PCB combines RT5880 high-frequency laminate and TG170 FR-4 prepreg for exceptional electrical performance, mechanical stability, and cost-effectiveness. With a compact design and robust construction, this PCB is ideal for applications in RF, microwave, telecommunications, and aerospace industries where high-frequency performance and reliability are essential.
PCB Specifications
This PCB is engineered to meet stringent technical requirements, ensuring optimal performance. Below are the detailed specifications:
| Category | Details |
| Layers | 4-layer copper |
| Base Materials | RT5880 (0.254mm) + TG170 FR-4 PP (0.204mm) + RT5880 (0.254mm) |
| Finished Board Thickness | 0.833mm |
| Copper Weight | 1oz (outer layers), 0.5oz (inner layers) |
| Solder Mask | Green (no markings) |
| Surface Finish | Immersion Silver |
| Board Dimensions | 126mm x 63mm ± 0.15mm |
| Minimum Trace/Space | 5/5 mils |
| Via Specifications | 0.2mm via hole with 0.5mm pad |
| Hole Type | Through-hole (no blind or buried vias) |
PCB Stackup
This PCB features a specialized hybrid stackup that combines RT5880 and TG170 FR-4 PP, providing the perfect balance of high-frequency performance and structural integrity:
| Layer | Material | Thickness |
| Copper Layer 1 | Outer Copper | 1oz (35μm) |
| Dielectric Layer | RT5880 | 0.254mm |
| Copper Layer 2 | Inner Copper | 0.5oz (17μm) |
| Dielectric Layer | TG170 FR-4 PP | 0.204mm |
| Copper Layer 3 | Inner Copper | 0.5oz (17μm) |
| Dielectric Layer | RT5880 | 0.254mm |
| Copper Layer 4 | Outer Copper | 1oz (35μm) |
Material Properties
RT5880 (High-Frequency Laminate):
TG170 FR-4 Prepreg:
Key Features and Benefits
The RT5880 laminate ensures low dielectric loss and excellent signal integrity, enabling reliable operation at high frequencies.
The inclusion of TG170 FR-4 PP provides exceptional structural support and thermal reliability, allowing the PCB to handle high operating temperatures.
With a minimum line width/spacing of 5mil/5mil and 0.2mm via holes, this PCB is ideal for compact, high-density designs.
The immersion silver finish provides excellent solderability, corrosion resistance, and long-term reliability.
Combining RT5880 and TG170 FR-4 ensures the perfect balance of electrical performance and mechanical strength, making this PCB cost-effective and high-performing.
The low moisture absorption of RT5880 ensures stable performance in challenging environmental conditions, such as high humidity or extreme temperatures.
Application Scenarios
This PCB, with its advanced hybrid stackup and high-frequency capabilities, is suitable for a wide range of applications, including:
Conclusion
The 4-layer PCB with RT5880 and TG170 FR-4 hybrid stackup offers an unbeatable combination of high-frequency performance, thermal stability, and cost-effective manufacturability. Its superior material properties and precise construction make it the perfect choice for high-frequency RF and microwave applications, as well as demanding environments.
For more information or to request a quote, contact us today. We are committed to delivering high-quality PCBs tailored to your specific needs!
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Seller
Year Established:
2003
Total Annual:
10 million-18 million
Employee Number:
350~450
Ecer Certification：
Site Member
Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millimeter wave equipm... Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millimeter wave equipm...
Get in touch with us
Leave a Message, we will call you back quickly!