| Payment Terms | T/T, Paypal |
| Supply Ability | 50000pcs |
| Delivery Time | 2-10 working days |
| Packaging Details | Packing |
| Brand Name | Taconic |
| Model Number | TLX-0 |
| Certification | ISO9001 |
| Place of Origin | China |
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Product Specification
| Payment Terms | T/T, Paypal | Supply Ability | 50000pcs |
| Delivery Time | 2-10 working days | Packaging Details | Packing |
| Brand Name | Taconic | Model Number | TLX-0 |
| Certification | ISO9001 | Place of Origin | China |
TLX-0 Copper-Clad Laminate: The Ultra-Low Loss, High-Reliability Workhorse for Demanding RF/Microwave Designs
We are pleased to present TLX-0, a premier woven fiberglass-reinforced PTFE laminate from AGC, engineered to deliver exceptional low-loss performance and robust mechanical reliability for high-volume, mission-critical RF and microwave applications. As the member of the versatile TLX family with the lowest dielectric constant and dissipation factor, TLX-0 is designed to be the dependable "workhorse" substrate for systems operating in severe environments where signal integrity and material endurance are paramount.
| TLX Typical Values | |||||||
| Property | Test | Units | TLX-6 | TLX-7 | TLX-8 | TLX-9 | TLX-0 |
| Method | |||||||
| Outgassing (% TML) | ASTM E 595 | 24 H 257 °F @ ≤ 5 x 10-5 Torr | 0.09 | 0.02 | 0.03 | 0.02 | 0.06 |
| Outgassing (% CVCM) | ASTM E 595 | 24 H 257 °F @ ≤ 5 x 10-5 Torr | <0.01 | 0 | 0 | 0.01 | 0 |
| Outgassing (% WVR) | ASTM E 595 | 24 H 257 °F @ ≤ 5 x 10-5 Torr | 0.06 | 0.01 | 0.01 | 0 | 0 |
Optimized for Ultra-Low Loss and Stable Electrical Performance
TLX-0 stands out with its superior electrical characteristics, specifically tailored for high-frequency efficiency. It features the lowest dielectric constant in the TLX series at 2.45 ± 0.04 (at 10 GHz), enabling precise impedance control and favorable signal propagation speeds. More critically, it offers an exceptionally low dissipation factor (Df) of 0.0009 at 1.9 GHz and 0.0012 at 10 GHz. This ultra-low loss tangent ensures minimal signal attenuation, making it ideal for sensitive passive components and long-life systems. The material demonstrates excellent Passive Intermodulation (PIM) performance, with values measured lower than -160 dBc, which is crucial for modern communication systems.
| TLX-8 Typical Values | |||||
| Property | Test Method | Unit | Value | Unit | Value |
| Dk @ 10 GHz | IPC-650 2.5.5.3 | 2.55 | 2.55 | ||
| Df @ 1.9 GHz | IPC-650 2.5.5.5.1 | 0.0012 | 0.0012 | ||
| Df @ 10 GHz | IPC-650 2.5.5.5.1 | 0.0017 | 0.0017 | ||
| Dielectric Breakdown | IPC-650 2.5.6 | kV | >45 | kV | >45 |
| Moisture Absorption | IPC-650 2.6.2.1 | % | 0.02 | % | 0.02 |
| Flexural Strength (MD) | ASTM D 790 | psi | 28,900 | N/mm2 | 199 |
| Flexural Strength (CD) | ASTM D 790 | psi | 20,600 | N/mm2 | 142 |
| Tensile Strength (MD) | ASTM D 902 | psi | 35,600 | N/mm2 | 245 |
| Tensile Strength (CD) | ASTM D 902 | psi | 27,500 | N/mm2 | 190 |
| Elongation at Break (MD) | ASTM D 902 | % | 3.94 | % | 3.94 |
| Elongation at Break (CD) | ASTM D 902 | % | 3.92 | % | 3.92 |
| Young’s Modulus (MD) | ASTM D 902 | kpsi | 980 | N/mm2 | 6757 |
| Young’s Modulus (CD) | ASTM D 902 | kpsi | 1,200 | N/mm2 | 8274 |
| Young’s Modulus (MD) | ASTM D 3039 | kpsi | 1,630 | N/mm2 | 11,238 |
| Poisson’s Ratio | ASTM D 3039 | 0.135 | 0.135 | ||
| Peel Strength (1 oz. ED) | IPC-650 2.4.8 Sec. 5.2.2 (Thermal Stress) | lbs/in | 15 | N/mm | 2.63 |
| Peel Strength (1 oz. RTF) | IPC-650 2.4.8 Sec. 5.2.2 (Thermal Stress) | lbs/in | 17 | N/mm | 2.98 |
| Peel Strength (½ oz. ED) | IPC-650 2.4.8.3 (Elevated Temp.) | lbs/in | 14 | N/mm | 2.45 |
| Peel Strength (½ oz. ED) | IPC-650 2.4.8 Sec. 5.2.2 (Thermal Stress) | lbs/in | 11 | N/mm | 1.93 |
| Peel Strength (1 oz. rolled) | IPC-650 2.4.8 Sec. 5.2.2 (Thermal Stress) | lbs/in | 13 | N/mm | 2.28 |
| Thermal Conductivity | ASTM F433/ASTM 1530-06 | W/M*K | 0.19 | W/M*K | 0.19 |
| Dimensional Stability (MD) | IPC-650 2.4.39 Sec. 5.4 (After Bake) | mils/in | 0.06 | mm/M | 0.06 |
| Dimensional Stability (CD) | IPC-650 2.4.39 Sec. 5.4 (After Bake) | mils/in | 0.08 | mm/M | 0.08 |
| Dimensional Stability (MD) | IPC-650 2.4.39 Sec. 5.5 (Thermal Stress) | mils/in | 0.09 | mm/M | 0.09 |
| Dimensional Stability (CD) | IPC-650 2.4.39 Sec. 5.5 (Thermal Stress) | mils/in | 0.1 | mm/M | 0.1 |
| Surface Resistivity | IPC-650 2.5.17.1 Sec. 5.2.1 (Elevated Temp.) | Mohm | 6.605 x 108 | Mohm | 6.605 x 108 |
| Surface Resistivity | IPC-650 2.5.17.1 Sec. 5.2.1 (Humidity Cond.) | Mohm | 3.550 x 106 | Mohm | 3.550 x 106 |
| Volume Resistivity | IPC-650 2.5.17.1 Sec. 5.2.1 (Elevated Temp.) | Mohm/cm | 1.110 x 1010 | Mohm/cm | 1.110 x 1010 |
| Volume Resistivity | IPC-650 2.5.17.1 Sec. 5.2.1 (Humidity Cond.) | Mohm/cm | 1.046 x 1010 | Mohm/cm | 1.046 x 1010 |
| CTE (X axis) (25-260 .C) | IPC-650 2.4 .41/ASTM D 3386 | ppm/.C | 21 | ppm/.C | 21 |
| CTE (Y axis) (25-260 .C) | IPC-650 2.4 .41/ASTM D 3386 | ppm/.C | 23 | ppm/.C | 23 |
| CTE (Z axis) (25-260 .C) | IPC-650 2.4 .41/ASTM D 3386 | ppm/.C | 215 | ppm/.C | 215 |
| Density (Specific Gravity) | ASTM D 792 | g/cm3 | 2.25 | g/cm3 | 2.25 |
| Td (2% Weight Loss) | IPC-650 2.4.24.6 (TGA) | .C | 535 | .C | 535 |
| Td (5% Weight Loss) | IPC-650 2.4.24.6 (TGA) | .C | 553 | .C | 553 |
| Flammability Rating | UL 94 | V-0 | V-0 | ||
Engineered for Severe Environmental Resilience
The woven fiberglass reinforcement in TLX-0 provides the mechanical backbone for applications facing extreme conditions. It is specifically designed for resistance to creep, vibration, radiation, and wide temperature ranges. This makes it a proven choice for aerospace, defense, and space applications, with a long heritage in environments from satellite launches to warship antennas. The material exhibits outstanding dimensional stability and a very low moisture absorption of 0.02%, ensuring reliable performance through thermal cycling and in humid conditions. It meets NASA outgassing requirements and carries a UL 94 V-0 flammability rating.
Robust Mechanical Properties for High-Yield Manufacturing
TLX-0 is built for manufacturability and durability. It offers strong flexural and tensile strength, high Young's Modulus, and reliable copper peel strength (e.g., 15 lbs/in for 1 oz ED foil). Its favorable Coefficient of Thermal Expansion (CTE) in the X and Y axes (21-23 ppm/°C) closely matches that of copper, reducing stress on plated through-holes and enhancing multilayer reliability.
Standard Product Configuration and Flexibility
Dielectric Constant: 2.45 ± 0.04.
Thickness Range: Available from an ultra-thin 0.0050" (0.127 mm) up to 0.250" (6.35 mm), making it perfect for couplers and a wide variety of other components.
Cladding: Compatible with the full range of AGC's copper claddings (electrodeposited, rolled, reverse treated). The substrate surface is optimized for superior copper adhesion.
Panel Sizes: Available in standard sizes such as 18" x 24" (457 mm x 610 mm).
Ideal for a Broad Spectrum of Demanding Applications
Aerospace & Defense Radar Systems
Satellite Communications and Space-Qualified Electronics
Low-PIM Base Station Antennas and Filters
Power Dividers/Combiners, Couplers, and Hybrids
Automotive Radar and High-Reliability Consumer RF
For engineers who require a proven, low-loss material that can withstand harsh operational environments without compromising electrical performance, TLX-0 delivers proven reliability. Contact our technical sales team today to discuss your specific application, request a detailed datasheet, or obtain a quotation. We provide the material expertise and global support to ensure the success of your most challenging RF designs.
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Seller
Year Established:
2003
Total Annual:
10 million-18 million
Employee Number:
350~450
Ecer Certification:
Site Member
Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd. has established itself as a reliable high-frequency PCB supplier and exporter based in Shenzhen, China. For over 24 years, we have served industries worldwide, including cellular base station antennas, satellite communi... Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd. has established itself as a reliable high-frequency PCB supplier and exporter based in Shenzhen, China. For over 24 years, we have served industries worldwide, including cellular base station antennas, satellite communi...
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