Shenzhen Bicheng Electronics Technology Co., Ltd
| Payment Terms | T/T, Paypal |
| Supply Ability | 50000pcs |
| Delivery Time | 2-10 working days |
| Packaging Details | Packing |
| Brand Name | Rogers |
| Model Number | TMM10i |
| Certification | ISO9001 |
| Place of Origin | China |
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Product Specification
| Payment Terms | T/T, Paypal | Supply Ability | 50000pcs |
| Delivery Time | 2-10 working days | Packaging Details | Packing |
| Brand Name | Rogers | Model Number | TMM10i |
| Certification | ISO9001 | Place of Origin | China |
TMM10i 2-Layer PCB: 30mil with Immersion Tin Finish
The TMM10i 2-layer PCB is a high-performance circuit board designed specifically for RF and microwave applications. Built with Rogers TMM10i laminates, this PCB offers exceptional dielectric stability, high mechanical reliability, and ease of processing. The 30mil TMM10i core ensures a low-loss, high-frequency response, making it ideal for advanced communication systems like satellite and GPS antennas. The Immersion Tin surface finish further enhances solderability and protects copper traces during assembly.
Key Construction Details
| Parameter | Specification |
| Base Material | Rogers TMM10i |
| Layer Count | 2 layers (Double-sided) |
| Board Dimensions | 70mm x 75mm (± 0.15mm) |
| Minimum Trace/Space | 6/4 mils |
| Minimum Hole Size | 0.3mm |
| Blind Vias | None |
| Finished Thickness | 0.8mm |
| Copper Weight | 1oz (35μm) on both layers |
| Via Plating Thickness | 20μm |
| Surface Finish | Immersion Tin |
| Top Silkscreen | None |
| Bottom Silkscreen | None |
| Top Solder Mask | None |
| Bottom Solder Mask | None |
| Electrical Testing | 100% tested prior to shipment |
Features of TMM10i Material
Data Sheet of TMM10
| Property | TMM10i | Direction | Units | Condition | Test Method | |
| Dielectric Constant,εProcess | 9.80±0.245 | Z |
| 10 GHz | IPC-TM-650 2.5.5.5 | |
| Dielectric Constant,εDesign | 9.9 | - | - | 8GHz to 40 GHz | Differential Phase Length Method | |
| Dissipation Factor (process) | 0.002 | Z | - | 10 GHz | IPC-TM-650 2.5.5.5 | |
| Thermal Coefficient of dielectric constant | -43 | - | ppm/°K | -55℃-125℃ | IPC-TM-650 2.5.5.5 | |
| Insulation Resistance | >2000 | - | Gohm | C/96/60/95 | ASTM D257 | |
| Volume Resistivity | 2 x 108 | - | Mohm.cm | - | ASTM D257 | |
| Surface Resistivity | 4 x 107 | - | Mohm | - | ASTM D257 | |
| Electrical Strength(dielectric strength) | 267 | Z | V/mil | - | IPC-TM-650 method 2.5.6.2 | |
| Thermal Properties | ||||||
| Decompositioin Temperature(Td) | 425 | 425 | ℃TGA | - | ASTM D3850 | |
| Coefficient of Thermal Expansion - x | 19 | X | ppm/K | 0 to 140 ℃ | ASTM E 831 IPC-TM-650, 2.4.41 | |
| Coefficient of Thermal Expansion - Y | 19 | Y | ppm/K | 0 to 140 ℃ | ASTM E 831 IPC-TM-650, 2.4.41 | |
| Coefficient of Thermal Expansion - Z | 20 | Z | ppm/K | 0 to 140 ℃ | ASTM E 831 IPC-TM-650, 2.4.41 | |
| Thermal Conductivity | 0.76 | Z | W/m/K | 80 ℃ | ASTM C518 | |
| Mechanical Properties | ||||||
| Copper Peel Strength after Thermal Stress | 5.0 (0.9) | X,Y | lb/inch (N/mm) | after solder float 1 oz. EDC | IPC-TM-650 Method 2.4.8 | |
| Flexural Strength (MD/CMD) | - | X,Y | kpsi | A | ASTM D790 | |
| Flexural Modulus (MD/CMD) | 1.8 | X,Y | Mpsi | A | ASTM D790 | |
| Physical Properties | ||||||
| Moisture Absorption (2X2) | 1.27mm (0.050") | 0.16 | - | % | D/24/23 | ASTM D570 |
| 3.18mm (0.125") | 0.13 | |||||
| Specific Gravity | 2.77 | - | - | A | ASTM D792 | |
| Specific Heat Capacity | 0.72 | - | J/g/K | A | Calculated | |
| Lead-Free Process Compatible | YES | - | - | - | - | |
Applications of TMM10i PCB
RF and Microwave Circuitry
Power Amplifiers and Combiners
Filters and Couplers
Satellite Communication Systems
Global Positioning System (GPS) Antennas
Patch Antennas
Dielectric Polarizers and Lenses
Chip Testers
Why Choose TMM10i PCB?
Exceptional Dielectric Stability: With a Dk of 9.80 ± 0.245, TMM10i ensures precise signal integrity at high frequencies.
Low Signal Loss: The Df of 0.0020 makes it suitable for high-power RF applications.
Thermal and Mechanical Reliability: The high decomposition temperature and CTE matched to copper ensure performance in demanding environments.
Ease of Manufacturing: The material supports standard PCB processing, reducing fabrication complexity and costs.
Environmentally Friendly: Lead-free and RoHS-compliant, ensuring sustainability and compliance with modern standards.
The TMM10i 2-layer PCB is the perfect choice for RF engineers and designers seeking a high-performance, high-reliability solution for microwave and communication systems.
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Seller
Year Established:
2003
Total Annual:
10 million-18 million
Employee Number:
350~450
Ecer Certification：
Site Member
Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millimeter wave equipm... Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millimeter wave equipm...
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