Rogers RO4003C LoPro 20.7mil Double-Sided Copper Clad Laminate raw material

Product Specification

Double-Sided Copper Clad Laminate with Rogers RO4003C LoPro

This double-sided copper clad laminate, constructed with Rogers RO4003C LoPro, is engineered for high-frequency and low-loss applications. The 20.7mil (0.526mm) RO4003C LoPro substrate provides superior signal integrity, low conductor loss, and thermal performance, making it ideal for advanced RF, microwave, and digital circuit designs. With its ability to be processed using standard FR-4 fabrication techniques, this laminate offers a cost-effective solution for high-frequency PCB manufacturing.

Key Construction Details

PCB Stackup

The 2-layer rigid PCB stackup features a 20.7mil RO4003C LoPro substrate, sandwiched between two copper layers, enabling excellent electrical and thermal performance for high-frequency designs

Introduction to Rogers RO4003C LoPro

Rogers RO4003C LoPro laminates combine the superior high-frequency performance of RO4003C materials with a low-profile reverse-treated copper foil. This innovative construction reduces conductor loss, resulting in improved signal integrity and lower insertion loss for demanding applications. The material offers the same hydrocarbon ceramic composition as standard RO4003C laminates, ensuring low dielectric loss while being compatible with standard FR-4 processes, eliminating the need for specialized fabrication methods.

Why Choose Rogers RO4003C LoPro?

1. Low Insertion Loss: Reverse-treated copper foil reduces conductor loss, making it suitable for high-frequency applications.
2. Cost-Effective Fabrication: Can be processed using standard epoxy/glass (FR-4) techniques, reducing manufacturing costs.
3. Improved Signal Integrity: The low dissipation factor (Df = 0.0027 @ 10GHz) ensures minimal signal degradation.
4. Thermal Reliability: With a high decomposition temperature (Td > 425°C), it offers excellent thermal stability for high-power designs.

Key Features of Rogers RO4003C LoPro Copper Clad Laminate

1. Dielectric Constant (Dk): 3.38 ± 0.05 at 10GHz, providing consistent signal propagation for high-frequency designs.
2. Low Dissipation Factor (Df): 0.0027 at 10GHz, reducing signal loss and enabling efficient operation at frequencies above 40GHz.
3. Thermal Stability: High Td (>425°C) and Tg >280°C, ensuring reliable performance in high-temperature processes.
4. Low Z-Axis CTE: 46 ppm/°C, ensuring excellent dimensional stability and reliability during thermal cycling.
5. Improved Conductor Loss Performance: Low-profile copper (LoPro) reduces conductor loss, improving thermal performance and insertion loss.
6. Standard FR-4 Processing Compatibility: Eliminates the need for specialized via preparation, such as sodium etching, reducing costs and complexity.
7. High Thermal Conductivity: 0.64 W/mK, enhancing heat dissipation for high-power RF and microwave designs.

Conclusion

The double-sided copper clad laminate with Rogers RO4003C LoPro is a high-performance material designed for high-frequency RF, microwave, and digital applications. Its low dissipation factor, improved conductor loss, and thermal reliability make it ideal for cellular base stations, satellite communications, and high-speed digital systems. While optimized for 2-layer designs, its compatibility with multi-layer PCBs provides flexibility for more complex systems. Overall, it offers exceptional performance, cost-effective fabrication, and environmental compliance, making it a preferred choice for next-generation high-frequency designs.