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Shenzhen Bicheng Electronics Technology Co., Ltd

  • China,Shenzhen ,Guangdong
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China RO3206 PCB 25mil thickness substrate double Layer with Immersion Gold Finish for
China RO3206 PCB 25mil thickness substrate double Layer with Immersion Gold Finish for

  1. China RO3206 PCB 25mil thickness substrate double Layer with Immersion Gold Finish for
  2. China RO3206 PCB 25mil thickness substrate double Layer with Immersion Gold Finish for
  3. China RO3206 PCB 25mil thickness substrate double Layer with Immersion Gold Finish for

RO3206 PCB 25mil thickness substrate double Layer with Immersion Gold Finish for

  1. MOQ: 1PCS
  2. Price: 0.99-99USD/PCS
  3. Get Latest Price
Payment Terms T/T, Paypal
Supply Ability 50000pcs
Delivery Time 2-10 working days
Packaging Details Packing
Brand Name Rogers
Model Number RO3206
Certification ISO9001
Place of Origin China

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  1. Product Details
  2. Company Details

Product Specification

Payment Terms T/T, Paypal Supply Ability 50000pcs
Delivery Time 2-10 working days Packaging Details Packing
Brand Name Rogers Model Number RO3206
Certification ISO9001 Place of Origin China

RO3206 PCB: 2-Layer, 25mil Core, 0.75mm Thickness with Immersion Gold Finish

(All PCBs are custom-manufactured. Reference images and parameters may vary based on your design requirements.)
 

 

Overview of RO3206 2-Layer PCB

The RO3206 PCB is a high-performance 2-layer rigid PCB designed for RF, microwave, and high-frequency applications. Built with Rogers RO3206 laminates, this PCB features a 25mil (0.635mm) core and a finished thickness of 0.75mm, ensuring exceptional electrical performance, mechanical stability, and low dielectric loss. With a dielectric constant (Dk) of 6.15 ± 0.15 at 10 GHz and a dissipation factor of 0.0027, the RO3206 PCB is an ideal choice for wireless communication systems and automotive radar applications.

 

The blue solder mask, white silkscreen on the top layer, and Immersion Gold (ENIG) surface finish enhance the board's durability, aesthetics, and solderability, making it suitable for high-precision and high-frequency designs.

 

 

 

 

PCB Construction Details

Parameter Specification
Base Material Rogers RO3206
Layer Count 2 layers
Board Dimensions 63mm x 45mm
Minimum Trace/Space 4/4 mils
Minimum Hole Size 0.3mm
Blind Vias None
Finished Thickness 0.75mm
Copper Weight 1oz (1.4 mils) outer layers
Via Plating Thickness 20μm
Surface Finish Immersion Gold (ENIG)
Top Silkscreen White
Bottom Silkscreen None
Top Solder Mask Blue
Bottom Solder Mask None
Electrical Testing 100% tested before shipment

 

 

 

PCB Stackup

Layer Material Thickness
Copper Layer 1 Copper (1oz) 35μm
Dielectric Layer Rogers RO3206 Core 0.635mm (25mil)
Copper Layer 2 Copper (1oz) 35μm

 

 

 

Introduction to RO3206 Material

The Rogers RO3206 laminates are ceramic-filled, woven fiberglass-reinforced PTFE composites, offering superior electrical and mechanical stability. These laminates are widely used in high-frequency circuits due to their low dielectric loss, high thermal conductivity, and excellent dimensional stability. The material's characteristics make it perfect for complex multilayer structures and surface-mounted assemblies.

 

 

Key Features of RO3206

  • Dielectric Constant (Dk): 6.15 ± 0.15 at 10 GHz / 23°C.
  • Dissipation Factor: Low at 0.0027 at 10 GHz.
  • Thermal Conductivity: 0.67 W/mK for superior heat dissipation.
  • CTE (Coefficient of Thermal Expansion): X-axis: 13 ppm/°C. Y-axis: 13 ppm/°C. Z-axis: 34 ppm/°C.
  • Moisture Absorption: Very low at <0.1%.
  • Peel Strength: Strong copper adhesion at 10.7 lbs/in.

 

 

Benefits of RO3206

  • Woven Glass Reinforcement: Improves rigidity for easier handling.
  • Uniform Electrical and Mechanical Properties: Ensures consistent performance in high-frequency designs.
  • Low Dielectric Loss: Ideal for RF and microwave applications.
  • Dimensional Stability: High production yields and reliability.
  • Cost-Effective: Economical for volume manufacturing.
  • Surface Smoothness: Enables finer line etching tolerances.

 

 

Applications

Automotive Collision Avoidance Systems

Global Positioning Antennas

Wireless Telecommunications Systems

Microstrip Patch Antennas

Direct Broadcast Satellites

Datalink on Cable Systems

Remote Meter Readers

Power Backplanes

LMDS and Wireless Broadband

 

 

Conclusion

The RO3206 2-layer PCB is a high-performance solution for RF, microwave, and high-frequency designs, offering low dielectric loss, thermal stability, and dimensional accuracy. With its 25mil RO3206 core, blue solder mask, and Immersion Gold finish, this PCB delivers consistent performance for demanding applications such as automotive radar systems, wireless telecommunications, and satellite communications.

 

Compliant with IPC-Class-2 standards and available worldwide, the RO3206 PCB is the perfect choice for engineers seeking cost-effective, high-frequency PCB solutions.

 

Company Details

Bronze Gleitlager

,

Bronze Sleeve Bushings

 and 

Graphite Plugged Bushings

 from Quality China Factory
  • Business Type:

    Manufacturer,Distributor/Wholesaler,Exporter,Seller

  • Year Established:

    2003

  • Total Annual:

    10 million-18 million

  • Employee Number:

    350~450

  • Ecer Certification:

    Site Member

Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millimeter wave equipm... Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millimeter wave equipm...

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Get in touch with us

  • Reach Us
  • Shenzhen Bicheng Electronics Technology Co., Ltd
  • 6-11C Shidai Jingyuan Fuyong Town, Baoan District, Shenzhen City, Guangdong Province, China
  • https://www.circuitboardpcbs.com/

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