Shenzhen Bicheng Electronics Technology Co., Ltd
| Payment Terms | T/T, Paypal |
| Supply Ability | 50000pcs |
| Delivery Time | 2-10 working days |
| Packaging Details | Packing |
| Brand Name | Rogers |
| Model Number | RO3006 + Tg170 FR-4 |
| Certification | ISO9001 |
| Place of Origin | China |
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Product Specification
| Payment Terms | T/T, Paypal | Supply Ability | 50000pcs |
| Delivery Time | 2-10 working days | Packaging Details | Packing |
| Brand Name | Rogers | Model Number | RO3006 + Tg170 FR-4 |
| Certification | ISO9001 | Place of Origin | China |
3-Layer RF Hybrid PCB: RO3006 + Tg170 FR-4, 0.86mm Thickness, No Solder Mask for RF Applications
(All PCBs are custom-manufactured. Reference images and parameters may vary based on your design requirements.)
Overview of the 3-Layer RF Hybrid PCB
The 3-layer RF hybrid PCB combines the exceptional performance of Rogers RO3006 laminates with the reliability of Tg170 FR-4 materials, making it a versatile solution for RF and microwave applications. With a 0.86mm finished thickness, this PCB is designed for high-frequency circuits and multi-layer hybrid designs, ensuring excellent dielectric stability, low signal loss, and durability across various environments.
This hybrid PCB is ideal for applications such as automotive radar systems, satellite antennas, cellular telecommunications, and wireless communication devices. The combination of ceramic-filled PTFE composites and FR-4 provides a cost-effective yet high-performing option for engineers seeking consistent electrical performance and mechanical stability.
PCB Construction Details
| Parameter | Specification |
| Base Material | Rogers RO3006 + Tg170 FR-4 |
| Layer Count | 3 layers |
| Board Dimensions | 98mm x 30mm |
| Minimum Trace/Space | 4/4 mils |
| Minimum Hole Size | 0.3mm |
| Blind Vias | Top-Inn1, Inn1-Bot |
| Finished Thickness | 0.86mm |
| Copper Weight | 0.5oz (0.7 mils) inner layers, 1oz (1.4 mils) outer layers |
| Via Plating Thickness | 20μm |
| Surface Finish | Organic Solderability Preservative (OSP) |
| Top Silkscreen | None |
| Bottom Silkscreen | None |
| Top Solder Mask | None |
| Bottom Solder Mask | None |
| Special Features | Staircase profile |
| Electrical Testing | 100% tested before shipment |
Introduction to RO3006 Material
Rogers RO3006 laminates are ceramic-filled PTFE composites known for their stable dielectric constant (Dk) of 6.15 ± 0.15 and low dissipation factor of 0.002 at 10 GHz. These materials ensure minimal signal loss, even at high frequencies, and provide excellent mechanical durability. They are highly resistant to moisture, with an absorption rate as low as 0.02%, and feature a thermal conductivity of 0.79 W/m·K, ideal for heat-sensitive applications.
Key Features of RO3006
Applications
Conclusion
The 3-layer RF hybrid PCB with RO3006 + Tg170 FR-4 is a high-performance solution for engineers designing RF and microwave circuits. Its exceptional dielectric properties, mechanical stability, and cost-effective manufacturing make it a reliable choice for applications requiring precision and durability. With global availability and compliance to IPC-Class-2 standards, this PCB is ready to meet the demands of modern RF systems.
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Seller
Year Established:
2003
Total Annual:
10 million-18 million
Employee Number:
350~450
Ecer Certification：
Site Member
Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millimeter wave equipm... Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millimeter wave equipm...
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