Shenzhen Bicheng Electronics Technology Co., Ltd
| Payment Terms | T/T, Paypal |
| Supply Ability | 50000pcs |
| Delivery Time | 2-10 working days |
| Packaging Details | Packing |
| Brand Name | Rogers |
| Model Number | CLTE |
| Certification | ISO9001 |
| Place of Origin | China |
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Product Specification
| Payment Terms | T/T, Paypal | Supply Ability | 50000pcs |
| Delivery Time | 2-10 working days | Packaging Details | Packing |
| Brand Name | Rogers | Model Number | CLTE |
| Certification | ISO9001 | Place of Origin | China |
CLTE Copper Clad Laminate: High-Performance High-Frequency Circuit Material
CLTE™ is a high-frequency circuit laminate engineered for applications demanding exceptional dimensional stability, low thermal expansion, and consistent electrical performance. As a proven PTFE-based material, it is particularly well-suited for advanced radio frequency (RF) and microwave circuits, including embedded resistor technologies, ground-based and airborne communications systems, and radar applications.
A standout feature of CLTE is its excellent dimensional stability and exceptionally low planar Coefficient of Thermal Expansion (CTE). With typical CTE values of 9.9 ppm/°C (x-direction) and 9.4 ppm/°C (y-direction), it minimizes dimensional changes during temperature fluctuations, ensuring reliable registration for multilayer boards and precise performance of embedded passive components. This stability, combined with its low Dissipation Factor (0.0021 @ 10 GHz), supports high-efficiency signal transmission with minimal loss.
The laminate offers robust mechanical and thermal reliability. It maintains strong copper peel strength (1.2 N/mm after thermal stress) and exhibits high thermal resistance, with a Time to Delamination exceeding 60 minutes at 288°C and a Decomposition Temperature (Td) of 538°C. These properties ensure durability in demanding thermal environments and during assembly processes like soldering.
Standard Properties Table
| Properties | Typical Values1 | Units | Test Conditions | Unit | |||
| CLTE | CLTE-XT | ||||||
| Electrical Properties | |||||||
| Dielectric Constant (process) | 2.98 | See Table | 23˚C @ 50% RH | 10 GHz | IPC TM-650 2.5.5.5 | ||
| Below | - | ||||||
| Dielectric Constant (design) | 2.98 | 2.93 | - | C-24/23/50 | 10 GHz | Microstrip Differential Phase Length | |
| Dissapation Factor | 0.0021 | 0.001 | - | 23˚C @ 50% RH | 10 GHz | IPC TM-650 2.5.5.5 | |
| Thermal Coefficient of Dielectric Constant | 6 | -8 | ppm/˚C | -50 to 150˚C | 10 GHz | IPC TM-650 2.5.5.5 | |
| Volume Resistivity | 1.4 X 10⁹ | 4.25 X 10⁸ | Mohm-cm | C-96/35/90 | - | IPC TM-650 2.5.17.1 | |
| Surface Resistivity | 1.30 X 10⁶ | 2.49 X 10⁸ | Mohm | C-96/35/90 | - | IPC TM-650 2.5.17.1 | |
| Electrical Strength (dielectric strength) | 1100 | 1000 | V/mil | - | - | IPC TM-650 2.5.6.2 | |
| Dielectric Breakdown | 64 | 58 | kV | D-48/50 | X/Y Direction | IPC TM-650 2.5.6 | |
| PIM | - | - | dBc | - | 50 ohm 0.060" | 43dBm 1900 MHz | |
| Thermal Properties | |||||||
| Decomposition Temperature (Td) | 538 | 539 | ˚C | 2hrs @ 105˚C | 5% Weight Loss | IPC TM-650 2.3.40 | |
| Coefficient of Thermal Expansion - x | 9.9 | 12.7 | ppm/˚C | -55˚C to 288˚C | IPC TM-650 2.4.41 | ||
| Coefficient of Thermal Expansion - y | 9.4 | 13.7 | ppm/˚C | -55˚C to 288˚C | IPC TM-650 2.4.41 | ||
| Coefficient of Thermal Expansion - z | 57.9 | 40.8 | ppm/˚C | -55˚C to 288˚C | IPC TM-650 2.4.41 | ||
| Thermal Conductivity | 0.5 | 0.56 | W/(m.K) | z direction | ASTM D5470 | ||
| Time to Delamination | >60 | >60 | minutes | as-received | 288˚C | IPC TM-650 2.4.24.1 | |
| Mechanical Properties | |||||||
| Copper Peel Strength after Thermal Stress | 1.2 (7) | 1.7 (9) | N/mm | 10s @288˚C | 35 μm foil | IPC TM-650 2.4.8 | |
| (lbs/in) | |||||||
| Flexural Strength (MD, CMD) | 92.4, 86.9 (13.4, 12.6) | 40.7, 40.0 (5.9, 5.8) | MPa (ksi ) | 25˚C ± 3˚C | - | ASTM D790 | |
| Tensile Strength (MD, CMD) | 73.8, 71.0 (10.7, 10.3) | 29.0, 25.5 (4.2, 3.7) | MPa (ksi ) | 23C/50RH | - | ASTM D638 | |
| Flex Modulus (MD, CMD) | 8122, 7984 (1178, 1158) | 3247, 3261 (471, 473) | MPa (ksi ) | 25˚C ± 3˚C | - | ASTM D790 | |
| Dimensional Stability (MD, CMD) | -0.07, -0.02 | -0.37, -0.67 | mm/m | 4 hr at 105˚C | - | IPC-TM-650 2.4.39a | |
| Physical Properties | |||||||
| Flammability | V-0 | V-0 | - | - | C48/23/50 & C168/70 | UL 94 | |
| Moisture Absorption | 0.04 | 0.02 | % | E1/105+D24/23 | - | IPC TM-650 2.6.2.1 | |
| Density | 2.31 | 2.17 | g/cm³ | C-24/23/50 | - | ASTM D792 | |
| Specifc Heat Capacity | 0.6 | 0.61 | J/g˚K | 2 hours at 105˚C | - | ASTM E2716 | |
| NASA Outgassing | Total Mass Lost | 0.02 | 0.02 | % | - | ASTM E595 | |
| Collected Volatiles | 0 | 0 | % | ||||
Standard Specifications:
Electrical Properties:
Thermal Properties:
Standard Offerings:
Thicknesses: 0.0053" (0.135 mm), 0.010" (0.254 mm), 0.020" (0.508 mm), and 0.030" (0.762 mm), each with specified tolerances.
Panel Sizes: Standard sizes include 18" x 12" (457 x 305 mm) and 18" x 24" (457 x 610 mm).
Claddings: Available with various copper foils, including Electrodeposited (½ oz. and 1 oz.) and Reverse Treated Electrodeposited Copper Foil (½ oz. and 1 oz.).
In summary, CLTE laminate is a high-reliability material that combines stable electrical properties, outstanding dimensional control, and thermal robustness. Its standardized offerings in thickness, panel size, and cladding type make it a versatile and trusted choice for designing and manufacturing high-performance RF and microwave circuits. For specific configuration needs beyond the standard offerings, Rogers Corporation provides additional options through customer service.
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Seller
Year Established:
2003
Total Annual:
10 million-18 million
Employee Number:
350~450
Ecer Certification：
Site Member
Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millimeter wave equipm... Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millimeter wave equipm...
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