15mil TMM10 laminate 2-layer PCB with 1oz copper and EPIG Finish using in RF and

Product Specification

Custom 2-Layer 15mil TMM10 PCB with EPIG Finish

Introducing a high-performance 2-layer PCB built on Rogers TMM10 laminate, designed for demanding RF and microwave applications. With its high dielectric constant (Dk) and nickel-free EPIG (Electroless Palladium Immersion Gold) surface finish, this PCB is ideal for satellite communications, GPS antennas, chip testers, and other high-frequency applications. Manufactured to IPC-Class-2 standards, this PCB ensures reliability and precision for advanced circuits.

PCB Construction Details

This double-sided TMM10 PCB is optimized for high-frequency signal integrity and durability. Below are the detailed construction specifications:

PCB Stackup

The stackup is carefully designed to ensure stable electrical performance for high-frequency applications:

The TMM10 core offers excellent thermal stability and low signal loss, while the EPIG surface finish ensures optimal solderability and wire-bonding compatibility without the need for nickel.

PCB Statistics

This PCB is designed for compact, efficient layouts with the following features:

The Gerber RS-274-X format is used to ensure precise artwork for fabrication.

About Rogers TMM10 Laminate

Rogers TMM10 is a thermoset microwave material that combines the benefits of PTFE and ceramic substrates while addressing the mechanical limitations of these materials. It is ideal for microwave and RF applications due to its high dielectric constant (Dk), low dissipation factor, and thermal stability.

Key Features of TMM10:

• Dielectric Constant (Dk): 9.20 ± 0.230 at 10GHz, providing precise impedance control for RF circuits.
• Dissipation Factor (Df): 0.0022 at 10GHz, ensuring minimal signal loss.
• Thermal Coefficient of Dk: -38 ppm/°K, offering excellent stability across temperature variations.
• Thermal Conductivity: 0.76 W/mK, for efficient heat dissipation.
• Coefficient of Thermal Expansion (CTE): X-axis: 21 ppm/K, Y-axis: 21 ppm/K, Z-axis: 20 ppm/K
• Decomposition Temperature (Td): 425°C, ensuring durability under extreme conditions.
• Flammability: UL-94 V0, meeting safety requirements.

TMM10 is also resistant to process chemicals, does not require sodium napthanate treatment during electroless plating, and supports reliable wire-bonding.

Benefits of TMM10-Based PCBs

The high dielectric constant and low dissipation factor ensure minimal signal loss and precise impedance control, even in high-frequency applications.

The material’s thermal coefficient of expansion is matched to copper, reducing stress during thermal cycling and ensuring long-term reliability.

TMM10 is compatible with standard PCB processes, eliminating the need for specialized techniques while maintaining its mechanical and electrical properties.

The EPIG finish provides excellent solderability, reduces corrosion risks, and is lead-free and nickel-free, making it environmentally friendly and RoHS compliant.

TMM10’s resistance to chemical and mechanical damage ensures reliability during fabrication and operation.

Application Scenarios

Satellite Communication Systems

Global Positioning Systems (GPS) Antennas

Patch Antennas

Chip Testers

Dielectric Polarizers and Lenses

Power Amplifiers and Filters

Conclusion

The 2-layer 15mil TMM10 PCB with EPIG finish is a cutting-edge solution for RF, microwave, and communication system applications. Its high dielectric constant, thermal reliability, and nickel-free EPIG surface finish make it a top choice for industries requiring precision, durability, and environmental compliance. Backed by IPC-Class-2 standards and 100% electrical testing, this PCB is built to exceed expectations.

For more information or to discuss custom designs, contact us today. Let us help you achieve success in your next high-frequency project!