Shenzhen Bicheng Electronics Technology Co., Ltd
| Model Number | RO4003C + S1000-2M |
| Brand Name | Rogers |
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Product Specification
| Model Number | RO4003C + S1000-2M | Brand Name | Rogers |
Hybrid High-Frequency PCB Solution – RO4003C + S1000-2M 8-Layer Custom Board
Q: What is this hybrid PCB solution, and what does it achieve?
A: This solution combines Rogers RO4003C (a high-frequency hydrocarbon ceramic laminate) with S1000-2M (a high-performance FR-4–type material from Shengyi) in a single 8-layer hybrid stack-up. The top and bottom layers use 0.203mm RO4003C for optimal RF signal integrity, while the inner core uses S1000-2M for cost-effective, reliable multilayer routing.
The reference product is specified as:
This hybrid design delivers high-frequency performance where it matters (outer layers) and cost-effective, high-density routing inside – ideal for RF front-ends, 5G small cells, and radar modules.
Key Takeaways
| Key Highlight | Description | |
| ① | Hybrid Stack-Up | Combines Rogers RO4003C (RF-grade) and Shengyi S1000-2M (high-Tg FR-4) in one board – balancing performance and cost. |
| ② | RF-Optimized Outer Layers | Top and bottom RO4003C layers provide low Dk (3.38±0.05) and low Df (0.0027 @ 10GHz) for clean signal launch and termination. |
| ③ | High-Thermal Core | S1000-2M core offers Tg = 185°C (DMA), Td = 355°C, and excellent CAF/IST reliability – ideal for high-layer-count inner routing. |
| ④ | Advanced HDI Capabilities | Supports blind vias (L1–L2, L7–L8) and resin-filled vias (0.2/0.25/0.35mm) – enabling dense BGA breakout and impedance control. |
| ⑤ | RoHS & Lead-Free Compatible | Both materials are fully compatible with lead-free assembly processes (peak reflow >260°C). |
| ⑥ | Proven Reliability | S1000-2M has passed IST >2000 cycles, CAF >1000 hours, and 6× 260°C reflow – ensuring long-term field performance. |
1. Material Overview – RO4003C (Rogers)
RO4003C is a hydrocarbon ceramic laminate from Rogers Corporation, specifically designed for high-frequency RF/microwave applications. It bridges the performance gap between PTFE-based materials and standard FR-4, offering:
Low and stable Dk – 3.38 ± 0.05 (process) / 3.55 (design) from 8–40 GHz
Low dissipation factor – 0.0027 @ 10GHz, 0.0021 @ 2.5GHz
Very low Dk temperature coefficient – +40 ppm/°C (stable over -50°C to 150°C)
High Tg > 280°C (TMA) and Td = 425°C – exceptional thermal robustness
Low Z-axis CTE – ~46 ppm/°C – ensures reliable plated through-holes
FR-4 process compatible – no sodium etch or special via prep required
Key Electrical Properties (RO4003C):
| Property | Value | Condition |
| Dielectric Constant (Process Dk) | 3.38 ± 0.05 | 10 GHz / 23°C |
| Dielectric Constant (Design Dk) | 3.55 | 8–40 GHz |
| Dissipation Factor (Df) | 0.0027 / 0.0021 | 10 GHz / 2.5 GHz |
| Tεr (Thermal Coefficient of Dk) | +40 ppm/°C | -50°C to 150°C |
| Volume Resistivity | 1.7 × 10¹⁰ MΩ·cm | COND A |
| Surface Resistivity | 4.2 × 10⁹ MΩ | COND A |
| Electrical Strength | 31.2 kV/mm (780 V/mil) | 0.51mm |
| Moisture Absorption | 0.06% | 48h immersion @50°C |
Mechanical & Thermal (RO4003C):
| Property | X / Y / Z | Value |
| Tensile Modulus | X / Y | 19,650 / 19,450 MPa (2,850 / 2,821 ksi) |
| Tensile Strength | X / Y | 139 / 100 MPa (20.2 / 14.5 ksi) |
| Flexural Strength | – | 276 MPa (40 kpsi) |
| CTE | X / Y / Z | 11 / 14 / 46 ppm/°C (-55 to 288°C) |
| Tg (TMA) | – | >280°C |
| Td (TGA) | – | 425°C |
| Thermal Conductivity | – | 0.71 W/m·K |
| Copper Peel Strength | – | 1.05 N/mm (6.0 pli) |
Standard Thicknesses Available: 0.008" (0.203mm), 0.012", 0.016", 0.020", 0.032", 0.060" – our design uses 0.203mm (8 mil) for outer layers.
Applications: Automotive radar (77GHz), 5G mmWave antennas, point-to-point radios, satellite communications, test & measurement equipment.
2. Material Overview – S1000-2M (Shengyi)
S1000-2M is a high-performance, high-Tg FR-4–type laminate from Shengyi Technology, designed for multilayer boards requiring excellent thermal reliability and CAF resistance. It is widely used in:
High-layer-count backplanes and server boards
Automotive and industrial electronics
Base station equipment
Any application requiring lead-free soldering compatibility and long-term reliability
Key Properties (S1000-2M):
| Property | Condition | Spec | Typical Value |
| Tg (DMA) | – | ≥180°C | 185°C |
| Td (5% wt loss) | – | ≥340°C | 355°C |
| CTE (Z-axis, pre-Tg) | – | ≤60 ppm/°C | 41 ppm/°C |
| CTE (Z-axis, post-Tg) | – | ≤300 ppm/°C | 208 ppm/°C |
| CTE (Z-axis, 50–260°C) | – | ≤3.0% | 2.40% |
| T260 / T288 / T300 | TMA | ≥30 / ≥5 / ≥2 min | 60 / 30 / 15 min |
| Thermal Stress (288°C solder dip) | – | >10s, no delam | >100s, no delam |
| Peel Strength (1 oz) | 288°C/10s | ≥1.05 N/mm | 1.3 N/mm |
| Water Absorption | D-24/23 | ≤0.5% | 0.08% |
| CTI (Comparative Tracking Index) | IEC60112 | PLC3 (175–250V) | PLC3 (200V) |
| Volume Resistivity | After moisture / E-24/125 | ≥10⁶ / ≥10³ MΩ·cm | 6.79×10⁷ / 2.19×10⁸ |
| Surface Resistivity | After moisture / E-24/125 | ≥10⁴ / ≥10³ MΩ | 3.16×10⁶ / 2.24×10⁷ |
| Dielectric Constant (Dk) | @1GHz / @1MHz | – / ≤5.4 | 4.6 / 4.9 |
| Dissipation Factor (Df) | @1GHz / @1MHz | – / ≤0.035 | 0.018 / 0.015 |
| Flammability | UL94 | V-0 | V-0 |
Reliability Validation (S1000-2M):
24-layer board (0.13mm core, 4.0mm total thickness, 0.35mm min hole, aspect ratio 11.5:1) – passed 5× 260°C lead-free reflow.
IST (Interconnect Stress Test) – 20-layer board, >2000 power cycles (room temp to 150°C), no failure.
CAF (Conductive Anodic Filament) Test – 20-layer, TH–TH 16/20 mil spacing, >1000 hours at 65°C/87%RH/100V DC, passed.
3. Custom PCB – 8-Layer Hybrid Stack-Up
This board represents our capability to integrate dissimilar materials into a single, high-reliability PCB with advanced HDI features.
Basic Specifications
| Item | Specification |
| Layer Count | 8 layers |
| Stack-Up Type | Hybrid – Top/Bottom: RO4003C (0.203mm); Inner Core: S1000-2M |
| Finished Board Thickness | 1.6mm |
| Outer Layer Copper | 1 oz (both top and bottom) |
| Inner Layer Copper | Mixed – 0.5 oz / 1 oz (designed per signal/power requirements) |
| Surface Finish | ENIG (Immersion Gold) – excellent for fine-pitch components and wire bonding |
| Solder Mask / Legend | Green solder mask / White silkscreen (both sides) |
| Panel Size | 273mm × 185mm (1 piece, including manufacturing borders) |
Advanced HDI & Via Features
| Feature | Detail | Benefit |
| Blind Vias | L1–L2, L7–L8 | Eliminates stub effects on RF layers; improves signal integrity |
| Resin-Filled Vias | 0.2mm, 0.25mm, 0.35mm diameters | Provides flat, solderable surfaces; enables via-in-pad design for BGA routing |
| Mixed Copper Weights | 0.5 oz inner / 1 oz outer | Optimizes impedance control (inner) and current capacity (outer) |
| Hybrid Material Bonding | RO4003C + S1000-2M with compatible prepreg | Balances RF performance and mechanical strength across the board |
Hybrid Stack-Up
This configuration ensures that critical RF paths reside entirely within RO4003C, while the bulk of digital and power layers use S1000-2M – giving you the best of both worlds.
Comparison Table – RO4003C vs. S1000-2M vs. Typical FR-4
| Parameter | RO4003C (Rogers) | S1000-2M (Shengyi) | Standard FR-4 (High-Tg) |
| Dk @ 1GHz / 10GHz | 3.38 (10GHz) / 3.55 (8–40GHz) | ~4.6 (1GHz) / – | ~4.2–4.5 |
| Df @ 10GHz / 1GHz | 0.0027 (10GHz) | 0.018 (1GHz) | 0.015–0.020 |
| Tg (DMA/TMA) | >280°C (TMA) | 185°C (DMA) | ~170–180°C |
| Td (TGA) | 425°C | 355°C | ~340°C |
| CTE Z-axis (pre/post Tg) | ~46 ppm/°C | 41 / 208 ppm/°C | ~50–70 / 250–350 |
| Thermal Conductivity | 0.71 W/m·K | – | ~0.3–0.5 |
| Moisture Absorption | 0.06% | 0.08% | ~0.3–0.5% |
| Process Compatibility | FR-4 compatible | FR-4 standard | FR-4 standard |
| Primary Application | RF/mmWave front-end | High-layer-count digital/backplane | General digital |
| Relative Cost | Higher | Mid | Low |
Application Areas – Where This Hybrid PCB Excels
Q1: Why choose a hybrid stack-up instead of all-RO4003C?
A: Cost optimization. RO4003C is significantly more expensive than FR-4-type materials. By using RO4003C only on the outer layers where RF performance matters, and S1000-2M for the inner layers, we reduce material cost while maintaining critical RF performance.
Q2: Are RO4003C and S1000-2M compatible in terms of lamination?
A: Yes. Both materials are thermoset systems compatible with standard FR-4 lamination cycles. We use transition prepreg layers to ensure reliable bonding between the different core materials.
Q3: Can you support impedance-controlled designs on this hybrid board?
A: Absolutely. We can calculate and control differential/single-ended impedances on both RO4003C and S1000-2M layers based on your stack-up and trace geometry requirements.
Q4: What is the minimum via diameter you can drill and fill?
A: We support mechanical drilling down to 0.15mm and resin filling for vias as small as 0.2mm (as specified in this design: 0.2, 0.25, 0.35mm).
Q5: Is ENIG (Immersion Gold) suitable for RF applications?
A: Yes. ENIG provides a flat, solderable surface and good corrosion resistance. For very high-frequency (mmWave) applications, some designers prefer immersion silver to avoid the nickel layer, but ENIG is widely accepted for most RF designs up to 40GHz.
Q6: What is the lead time for this hybrid 8-layer board?
A: Typical prototype lead time is 10–15 working days for this stack-up with blind vias and resin filling. Volume production lead time can be shortened with advance material sourcing.
Q7: Do you provide stack-up design assistance?
A: Yes. Our engineering team can help you define layer assignments, calculate impedance, and optimize the hybrid stack-up for manufacturability and signal integrity.
Q8: What are the storage conditions for S1000-2M prepreg?
A: Short-term (<3 months): <23°C, <50% RH. Long-term (up to 6 months): 5°C. Always keep wrapped in moisture-proof material and avoid UV/strong light.
Q9: Can you build this board with LoPro foil on RO4003C for lower loss?
A: Yes. Rogers offers RO4003C with LoPro® (reverse-treated) foil for reduced insertion loss. Please specify this requirement in your inquiry.
Q10: Is this design compliant with IPC standards?
A: Yes. RO4003C conforms to IPC-4103 /10, and S1000-2M meets applicable IPC-4101 specifications. Our manufacturing process is IPC Class 2/3 compliant.
Contact Us
As a specialized PCB supplier based in China, we have extensive experience with hybrid high-frequency materials and complex HDI processes. Whether you need a prototype or volume production, we provide:
Full material traceability
Impedance testing (TDR)
X-ray inspection for blind vias
Electrical testing (flying probe / fixture)
Quick-turn services available
For technical inquiries, quotation requests, or design review support, please contact our sales team directly. We look forward to helping you bring your high-frequency designs to life.
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Seller
Year Established:
2003
Total Annual:
10 million-18 million
Employee Number:
350~450
Ecer Certification：
Site Member
Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd. has established itself as a reliable high-frequency PCB supplier and exporter based in Shenzhen, China. For over 24 years, we have served industries worldwide, including cellular base station antennas, satellite communi... Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd. has established itself as a reliable high-frequency PCB supplier and exporter based in Shenzhen, China. For over 24 years, we have served industries worldwide, including cellular base station antennas, satellite communi...
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