Shenzhen Bicheng Electronics Technology Co., Ltd
| Model Number | RT/duroid 6202 |
| Brand Name | Rogers |
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Product Specification
| Model Number | RT/duroid 6202 | Brand Name | Rogers |
4-Layer Hybrid High-Frequency PCB – Rogers RT/duroid 6202 + FR-4 with Via-in-Pad & IPC Class 3
1. Material Overview – RT/duroid 6202 (Rogers)
RT/duroid® 6202 is a low-loss, low-dielectric-constant PTFE-based laminate from Rogers Corporation, reinforced with limited woven glass fabric. It is specifically designed for complex microwave structures that require both mechanical reliability and electrical stability .
The addition of woven glass reinforcement provides excellent dimensional stability (0.05 to 0.07 mils/inch) , enabling tight tolerance manufacturing for planar resistor applications and high-density multilayer circuits .
Key Material Characteristics
| Feature | Benefit |
| Ultra-Low Dk (2.94 ± 0.04 @ 10 GHz) | Reduces signal delay and crosstalk – ideal for high-frequency circuits up to 40 GHz+ . |
| Ultra-Low Df (0.0015 @ 10 GHz) | Minimizes insertion loss – critical for antenna feed networks, radar systems, and beamforming networks . |
| TCDk = +5 ppm/°C | Dielectric constant remains stable across temperature – essential for outdoor and aerospace applications . |
| X/Y CTE = 15 ppm/°C | Matches copper's CTE – reduces stress on plated through-holes and surface-mount components . |
| Dimensional Stability = 0.07 mm/m | Prevents double-etching and maintains tight positional tolerances . |
| Td = 500°C | Exceptional thermal robustness – supports lead-free assembly and harsh operating environments . |
| Low Moisture Absorption (0.04%) | Maintains electrical performance in humid conditions . |
| FR-4 Process Compatible | Unlike many PTFE materials, RT/duroid 6202 can be processed with standard FR-4 fabrication techniques . |
| Lead-Free Process Compatible | Fully supports 260°C peak reflow soldering . |
| UL 94 V-0 Flammability | Meets safety requirements for commercial and aerospace applications . |
| Typical Applications | |
| Market Segment | Specific Use Cases |
| Aerospace & Defense | Phased-array antennas, ground-based and airborne radar systems, commercial airline collision avoidance systems |
| Satellite Communications | Beamforming networks, GPS antennas, high-reliability space-grade circuits |
| High-Frequency Test & Measurement | Complex multilayer circuits with inter-layer connections |
| Microwave Backplanes | High-reliability power backplanes, RF distribution networks |
2. Material Datasheet – Consolidated Properties (RT/duroid 6202)
| Property | Direction | Typical Value | Unit | Test Method |
| Dielectric Constant (Dk) @ 10 GHz | Z | 2.94 ± 0.04 (≥0.020") | – | IPC-TM-650 2.5.5.5 |
| Dk @ 10 GHz (0.005" thickness) | Z | 3.06 ± 0.04 | – | IPC-TM-650 2.5.5.5 |
| Dk @ 10 GHz (0.010–0.015" thickness) | Z | 3.02 ± 0.04 | – | IPC-TM-650 2.5.5.5 |
| Dissipation Factor (Df) @ 10 GHz | Z | 0.0015 | – | IPC-TM-650 2.5.5.5 |
| Thermal Coefficient of Dk | Z | 5 | ppm/°C | IPC-TM-650 2.5.5.5; -50 to +150°C |
| Volume Resistivity | Z | 1 × 10⁶ | MΩ·cm | ASTM D257; Condition A |
| Surface Resistivity | Z | 1 × 10⁹ | MΩ | ASTM D257; Condition A |
| Thermal Conductivity | – | 0.68 | W/m·K | ASTM C518; 80°C |
| CTE X (-55 to 288°C) | X | 15 | ppm/°C | IPC-TM-650 2.4.41 |
| CTE Y (-55 to 288°C) | Y | 15 | ppm/°C | IPC-TM-650 2.4.41 |
| CTE Z (-55 to 288°C) | Z | 30 | ppm/°C | IPC-TM-650 2.4.41 |
| Td (Thermal Decomposition) | – | 500 | °C (TGA) | ASTM D3850 |
| Specific Heat | – | 0.93 (0.22) | J/g·K (BTU/lb/°F) | Calculated |
| Flammability | – | 94V-0 | Rating | UL 94 |
| Tensile Modulus | X,Y | 1007 (146) | MPa (kpsi) | ASTM D638; 23°C |
| Ultimate Stress | X,Y | 30 (4.3) | MPa (kpsi) | ASTM D638; 23°C |
| Ultimate Strain | X,Y | 4.9 | % | ASTM D638; 23°C |
| Compressive Modulus | Z | 1035 (150) | MPa (kpsi) | ASTM D638 |
| Copper Peel Strength (1 oz ED foil) | – | 9.1 (1.6) | lbs/in (N/mm) | IPC-TM-650 2.4.8 |
| Moisture Absorption | – | 0.04 | % | IPC-TM-650 2.6.2.1; ASTM D570; D23/24, D48/50 |
| Density | – | 2.1 | g/cm³ | ASTM D792 |
| Dimensional Stability | X,Y | 0.07 | mm/m (mil/in) | IPC-TM-650 2.4.3.9; after etch +E/150 |
Note on Dk Variation: Due to construction limitations, the dielectric constant of RT/duroid 6202 varies slightly by laminate thickness: 0.005" = 3.06 ± 0.04, 0.010–0.015" = 3.02 ± 0.04, ≥0.020" = 2.94 ± 0.04 .
Laminate Standard Availability
| Parameter | Options |
| Standard Thicknesses | 0.005" (0.127mm), 0.010" (0.254mm), 0.015" (0.381mm), 0.020" (0.508mm), 0.030" (0.762mm) |
| Standard Panel Sizes | 12" × 18", 24" × 18", 24" × 36" |
| Copper Cladding | EDC ½ oz, 1 oz; Rolled ½ oz, 1 oz, 2 oz; Reverse-treated; Resitive foil |
| Prepreg | RT/duroid 6202PR – available in roll or panel form |
3. Custom PCB – 4-Layer Hybrid RT/duroid 6202 + FR-4 with Via-in-Pad & IPC Class 3
This 4-layer hybrid board demonstrates our capability to combine dissimilar materials (RT/duroid 6202 + FR-4) in a single, high-reliability PCB with IPC-6012 Class 3 compliance and advanced via-in-pad technology .
Basic Specifications
| Item | Specification |
| Layer Count | 4 layers |
| Stack-Up Type | Hybrid – Top: RT/duroid 6202 (0.127mm) + Prepreg (0.381mm) + Bottom: FR-4 (0.4mm) |
| Finished Board Thickness | 1.014 mm |
| Inner Layer Copper | 0.5 oz |
| Outer Layer Copper | 1 oz (top and bottom) |
| Surface Finish | ENIG (Electroless Nickel/Immersion Gold) |
| Solder Mask | Blue – both sides |
| Silkscreen | White – both sides |
| Panel Size | 110 mm × 35 mm (single unit, including tooling strips, mounting holes, and fiducials) |
Advanced Process Features
| Feature | Detail | Benefit |
| Via-in-Pad (VIP) | All vias: resin-plugged + plated-over copper cap | Enables component placement directly on vias – essential for dense layouts |
| Resin Plugging | Vias filled with resin and planarized | Provides flat surface for capping; prevents solder wicking |
| Capped Vias | Electroplated copper over filled vias | Ensures electrical continuity and mechanical reliability |
| ENIG Finish | Immersion Gold over Nickel | Excellent solderability, flat surface, corrosion resistance – ideal for fine-pitch and wire bonding |
| 25µm Hole Wall Copper | IPC-6012 Class 3 requirement | Ensures robust PTH reliability in harsh environments (aerospace, defense) |
| Hybrid Material Bonding | RT/duroid 6202 + FR-4 with appropriate prepreg | Balances RF performance and cost – high-frequency signals on RT/duroid, routing/power on FR-4 |
Stack-Up Design
This configuration ensures that critical RF paths reside entirely within RT/duroid 6202, while the bulk of digital and power routing uses FR-4 – giving you the best of both worlds .
4. Why RT/duroid 6202 + FR-4 Hybrid for This Design?
| Requirement | How RT/duroid 6202 + FR-4 Addresses It |
| High-frequency signal integrity (RF front-end) | RT/duroid 6202's Df = 0.0015 @ 10 GHz minimizes insertion loss – critical for antenna feed networks and radar systems . |
| Temperature-stable performance | TCDk = +5 ppm/°C ensures stable impedance over -50°C to +150°C – essential for aerospace and outdoor applications . |
| Mechanical reliability | X/Y CTE = 15 ppm/°C matches copper – reduces PTH stress and ensures reliable surface-mount soldering . |
| Dimensional tolerance | Dimensional stability = 0.07 mm/m – enables tight positional tolerances for complex microwave circuits . |
| Cost-effectiveness | Hybrid construction places expensive RT/duroid only where needed (RF layers), using FR-4 for routing/power – reducing material cost . |
| IPC Class 3 reliability | 25µm hole wall copper and robust material properties meet the highest reliability standards for aerospace and defense. |
| Dense BGA routing | Via-in-pad support (resin plug + cap) allows breakout from fine-pitch components. |
Comparison Table – RT/duroid 6202 vs. Standard FR-4 vs. High-End RF Materials
| Parameter | RT/duroid 6202 | Standard FR-4 (High-Tg) | High-End PTFE (e.g., RT/duroid 5880) |
| Dk (@ 10 GHz) | 2.94 ± 0.04 | ~4.2–4.5 | ~2.20 |
| Df (@ 10 GHz) | 0.0015 | ~0.015–0.020 | ~0.0009 |
| TCDk (ppm/°C) | +5 | ~+50 to +100 | ~0 (very low) |
| Td (TGA) | 500°C | ~340°C | ~500°C |
| CTE X/Y (ppm/°C) | 15/15 | ~14–16 | ~17–20 |
| CTE Z (ppm/°C) | 30 | ~50–70 | ~30–40 |
| Moisture Absorption | 0.04% | ~0.3–0.5% | ~0.02% |
| Dimensional Stability (mm/m) | 0.07 | ~0.10–0.20 | ~0.05–0.10 |
| Glass Reinforcement | Limited woven glass | E-glass | No glass (pure PTFE) |
| FR-4 Process Compatibility | Yes | Yes | Limited (sodium etch) |
| Relative Cost | High | Low | Very High |
| Primary Application | Radar, phased arrays, high-reliability RF | General digital | Space-grade, ultra-low-loss |
Application Areas
Phased-Array Antennas
Airborne & Ground-Based Radar
Commercial Airline Collision Avoidance Systems
Power Backplanes (High-Frequency)
Beamforming Networks
Q1: What makes RT/duroid 6202 different from standard FR-4?
A: RT/duroid 6202 offers significantly lower Dk (2.94 vs. ~4.2–4.5) , lower Df (0.0015 vs. ~0.015–0.020) , TCDk = +5 ppm/°C (very stable across temperature), X/Y CTE matched to copper (15 ppm/°C) , and excellent dimensional stability (0.07 mm/m) – all within a PTFE-based glass-reinforced system compatible with FR-4 processes .
Q2: Why use a hybrid stack-up (RT/duroid + FR-4) instead of all-RT/duroid?
A: Cost optimization. RT/duroid is significantly more expensive than FR-4. By placing RT/duroid only on the top layer (where RF signals are launched) and using FR-4 for routing and power distribution, we reduce material cost while maintaining critical RF performance. Hybrid construction is widely used in RF + control board designs .
Q3: Is RT/duroid 6202 compatible with lead-free soldering?
A: Yes. RT/duroid 6202 is lead-free process compatible and supports 260°C peak reflow soldering .
Q4: Can all vias be resin-plugged and capped (via-in-pad)?
A: Yes. Our manufacturing process supports resin plugging + electroplated capping for all vias. This is standard for this 4-layer design and enables component placement directly over vias.
Q5: What is IPC-6012 Class 3, and why is it important?
A: IPC-6012 Class 3 is the highest reliability class for rigid printed boards, requiring 25µm minimum hole wall copper, stringent inspection criteria, and proven thermal/mechanical reliability. It is required for aerospace, defense, medical, and high-reliability telecom applications.
Q6: What surface finishes are available for this hybrid board?
A: ENIG (Immersion Gold) is specified for this design. We also offer immersion silver, immersion tin, ENEPIG, and OSP – depending on your application requirements.
Contact Us
As a specialized PCB supplier based in China, we have extensive experience with Rogers RT/duroid materials, hybrid stack-ups (RT/duroid + FR-4) , and complex via-in-pad processes.
We provide:
For technical inquiries, stack-up review, or quotation requests, please contact our sales team directly. We are ready to support your high-frequency aerospace, defense, and telecom projects.
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Seller
Year Established:
2003
Total Annual:
10 million-18 million
Employee Number:
350~450
Ecer Certification：
Site Member
Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd. has established itself as a reliable high-frequency PCB supplier and exporter based in Shenzhen, China. For over 24 years, we have served industries worldwide, including cellular base station antennas, satellite communi... Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd. has established itself as a reliable high-frequency PCB supplier and exporter based in Shenzhen, China. For over 24 years, we have served industries worldwide, including cellular base station antennas, satellite communi...
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