Rogers TMM3 Thermoset Microwave Laminate use to manufacture Custom 100mil 2

Product Specification

Model Number	TMM®3	Brand Name	Rogers

 

1. Introduction to TMM3 Laminate

Rogers TMM®3 is a thermoset microwave material belonging to the TMM family of ceramic, hydrocarbon, thermoset polymer composites. These materials are specifically engineered for high-reliability plated-through-hole (PTH) stripline and microstrip applications, offering an exceptional balance of electrical and mechanical performance.

 

TMM3 laminates combine many of the desirable properties of ceramic substrates—such as excellent dielectric stability and thermal management—with the processing convenience of traditional PTFE microwave circuit laminates, without requiring specialized production techniques commonly associated with those materials. Unlike many PTFE-based substrates, TMM laminates do not require sodium naphthanate treatment prior to electroless plating, simplifying the manufacturing process.

 

One of the standout features of TMM3 is its thermoset resin system. Unlike thermoplastic materials, TMM3 does not soften when heated, enabling reliable wire bonding of component leads to circuit traces without concerns of pad lifting or substrate deformation. This characteristic, combined with its exceptional mechanical properties, makes TMM3 an ideal choice for demanding RF and microwave applications.

 

 

2. Key Technical Specifications (TMM3)

Property	Direction	Units	Conditions	Test Method	TMM3 Value
Dielectric Constant (Process)	Z	—	10 GHz	IPC-TM-650 2.5.5.5	3.27 ± 0.032
Dielectric Constant (Design)	—	—	8–40 GHz	Differential Phase Length Method	3.45
Dissipation Factor (Process)	Z	—	10 GHz	IPC-TM-650 2.5.5.5	0.002
Thermal Coefficient of Dk	—	ppm/°K	-55°C to +125°C	IPC-TM-650 2.5.5.5	37
Insulation Resistance	—	GΩ	C/96/60/95	ASTM D257	>2000
Volume Resistivity	—	MΩ·cm	—	ASTM D257	3×10⁹
Surface Resistivity	—	MΩ	—	ASTM D257	>9×10⁹
Electrical Strength	Z	V/mil	—	IPC-TM-650 2.5.6.2	441
Decomposition Temperature (Td)	—	°C	—	ASTM D3850	425
CTE – X axis	X	ppm/K	0°C to 140°C	ASTM E 831 / IPC-TM-650 2.4.41	15
CTE – Y axis	Y	ppm/K	0°C to 140°C	ASTM E 831 / IPC-TM-650 2.4.41	15
CTE – Z axis	Z	ppm/K	0°C to 140°C	ASTM E 831 / IPC-TM-650 2.4.41	23
Thermal Conductivity	Z	W/m/K	80°C	ASTM C518	0.7
Copper Peel Strength (after thermal stress)	X,Y	lb/inch (N/mm)	After solder float 1 oz EDC	IPC-TM-650 Method 2.4.8	5.7 (1.0)
Flexural Strength (MD/CMD)	X,Y	kpsi	A	ASTM D790	16.53
Flexural Modulus (MD/CMD)	X,Y	Mpsi	A	ASTM D790	1.72
Moisture Absorption (1.27mm / 0.050")	—	%	D/24/23	ASTM D570	0.06
Moisture Absorption (3.18mm / 0.125")	—	%	D/24/23	ASTM D570	0.12
Specific Gravity	—	—	A	ASTM D792	1.78
Specific Heat Capacity	—	J/g/K	A	Calculated	0.87
Lead-Free Process Compatible	—	—	—	—	YES

 

Note: TMM laminates are available in thicknesses from 0.015" to 0.500" with standard panel sizes of 18"×12" and 18"×24".

 

 

3. Features & Benefits

TMM3 delivers a comprehensive set of advantages for high-frequency circuit designs:

 

 

Feature	Description
Wide Dielectric Constant Range	Available across multiple Dk values; TMM3 specifically at 3.27 ± 0.032
Low Dissipation Factor	0.0020 @ 10 GHz ensures low insertion loss
Low Thermal Coefficient of Dk	+37 ppm/°K provides excellent electrical stability across temperature
Copper-Matched CTE	X/Y CTE of 15 ppm/K closely matches copper for reliable PTH integrity
High Thermal Conductivity	0.70 W/m/K—approximately twice that of traditional PTFE/ceramic laminates
Thermoset Resin System	Does not soften when heated
Lead-Free Process Compatible	Supports modern assembly processes

 

 

Superior Mechanical Properties: Resists creep and cold flow, ensuring long-term dimensional stability.

 

High PTH Reliability: Copper-matched CTE and low etch shrinkage values enable production of highly reliable plated-through holes.

 

Chemical Resistance: Resistant to etchants and solvents used in PCB production, reducing fabrication damage.

 

Simplified Processing: No sodium naphthanate treatment required prior to electroless plating.

 

Reliable Wire Bonding: Thermoset resin prevents pad lifting and substrate deformation during wire bonding.

 

Ceramic-Like Performance with Soft Substrate Ease: Combines the desirable features of ceramic substrates with the processing convenience of soft substrates.

 

Versatile Cladding Options: Available with ½ oz to 2 oz electrodeposited copper foil, or bonded directly to brass or aluminum plates.

 

 

4. Custom 2-Layer PCB Solution on TMM3

Leveraging the advanced properties of Rogers TMM3, we offer the following precision-engineered 2-layer rigid PCB solution. This design is ideal for RF and microwave applications requiring a thicker substrate for mechanical stability and controlled impedance.

 

 

PCB Construction Details

Parameter	Specification
Base Material	Rogers TMM3
Number of Layers	2
Finished Board Size	48.6 mm × 50.04 mm
Finished Board Thickness	2.54 mm
Minimum Trace / Space	As per design requirements
Minimum Hole Size	2.5 mm (through-hole only; no blind vias)
Outer Layer Copper Weight	1 oz (35 μm)
Via Plating Thickness	20 μm
Surface Finish	EPIG (Electroless Palladium Immersion Gold – No Nickel)
Top Silkscreen	None
Bottom Silkscreen	None
Top Solder Mask	None
Bottom Solder Mask	None
Electrical Testing	100% prior to shipment
Accepted Quality Standard	IPC-Class-2
Artwork Format	Gerber RS-274-X
Global Availability	Worldwide shipping

 

 

Design & Manufacturing Highlights

 

Thick Substrate Design: At 2.54 mm (100 mils), this PCB offers exceptional mechanical rigidity and is ideal for applications requiring robust structural support, such as chip testers and high-power RF modules.

 

High-Conductivity Copper Layers: 1 oz (35 μm) copper on both sides provides excellent conductivity for RF signal transmission and power handling.

 

EPIG Surface Finish: Electroless Palladium Immersion Gold (EPIG) with no nickel layer offers a flat, highly solderable surface while eliminating the magnetic properties associated with nickel, making it ideal for high-frequency applications where signal integrity is critical.

 

Large Hole Capability: Supports 2.5 mm minimum hole size for connectors, mounting hardware, or through-hole components.

 

Reliable PTH Interconnects: With 20 μm via plating and TMM3's low Z-axis CTE (23 ppm/K), the PCB offers outstanding plated-through-hole reliability even under thermal cycling conditions.

 

Simplified Processing: No specialized production techniques required—TMM3 can be processed using standard PWB processes.

 

Strict Quality Control: Every board undergoes 100% electrical testing and is manufactured to IPC-Class-2 standards, guaranteeing consistent quality and performance.

 

 

5. Typical Applications

TMM3 is extensively used across a wide range of RF and microwave applications:

 

RF & Microwave Circuitry: General-purpose high-frequency circuit designs.

 

Power Amplifiers & Combiners: High-power RF systems requiring excellent thermal management.

 

Filters & Couplers: Frequency-selective and power-dividing networks.

 

Satellite Communication Systems: Spaceborne and ground-based satellite equipment.

 

Global Positioning System (GPS) Antennas: Precision navigation and timing applications.

 

Patch Antennas: Compact, low-profile antenna designs.

 

Dielectric Polarizers & Lenses: Advanced microwave optics and beamforming components.

 

Chip Testers: High-frequency test and measurement interfaces requiring mechanical stability and signal integrity.

 

 

6. Conclusion

As a specialized supplier of custom high-frequency circuit boards, we combine the proven performance of Rogers TMM3 thermoset microwave laminate with our precision manufacturing capabilities to deliver world-class PCB solutions. Our 2-layer offering fully leverages TMM3's stable dielectric properties, low loss, copper-matched CTE, excellent thermal conductivity, and thermoset resin system, ensuring your most demanding RF and microwave applications achieve the highest levels of performance and reliability.

 

Whether you are developing satellite communication systems, power amplifiers, chip testers, or advanced antenna arrays, our engineering team is ready to support your project. For technical consultations, samples, or volume orders, please contact us today. We look forward to being your trusted partner in high-frequency innovation.