Shenzhen Bicheng Electronics Technology Co., Ltd
| Payment Terms | T/T, Paypal |
| Delivery Time | 2-10 working days |
| Packaging Details | Packing |
| Supply Ability | 50000pcs |
| Place of Origin | China |
| Certification | ISO9001 |
| Model Number | TP440 |
| Brand Name | Wangling |
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Product Specification
| Payment Terms | T/T, Paypal | Delivery Time | 2-10 working days |
| Packaging Details | Packing | Supply Ability | 50000pcs |
| Place of Origin | China | Certification | ISO9001 |
| Model Number | TP440 | Brand Name | Wangling |
Product Overview
A newly shipped, high-performance 2-layer rigid printed circuit board has been developed for demanding high-frequency and aerospace-grade applications. This PCB has been fabricated using the TP440 laminate from the Wangling TP Series, a unique high-frequency thermoplastic material. The dielectric layer of the TP440 is composed of ceramic and polyphenylene oxide (PPO) resin, and no fiberglass reinforcement has been included. By adjusting the ratio between ceramic and PPO resin, a precise and stable dielectric constant of 4.4 has been achieved. Excellent dielectric performance and high reliability are provided.
The finished PCB is classified as a 2-layer rigid board, and 100% electrical testing has been performed prior to shipment. Worldwide availability has been ensured.
Laminate Material Properties (TP440)
| Parameter | Test Condition | Value |
| Dielectric Constant (Dk) | 10 GHz | 4.4 ± 0.09 |
| Dielectric Constant Tolerance | — | ±2% |
| Dissipation Factor (Df) | 10 GHz | 0.001 |
| Dk Temperature Coefficient | -55°C to +150°C | -50 PPM/°C |
| Peel Strength (1 oz ED copper) | Normal State | >0.6 N/mm |
| After Damp Heat Cycling | >0.4 N/mm | |
| Volume Resistivity | 500V, Normal State | >1×10⁹ MΩ·cm |
| Surface Resistance | 500V, Normal State | >1×10⁷ MΩ |
| CTE (X / Y / Z) | -55°C to +150°C | 60 / 60 / 70 PPM/°C |
| Water Absorption | 20±2°C, 24 hours | ≤0.01% |
| Long-Term Operating Temperature | — | -100°C to +150°C |
| Density | — | 1.89 g/cm³ |
| Thermal Conductivity | — | 0.44 W/(M·K) |
| Material Composition | — | PPO, Ceramic, ED copper foil |
Finished PCB Construction Details
| Parameter | Value |
| PCB Type | 2-Layer Rigid PCB |
| Laminate Core | TP440 (0.5 mm dielectric thickness) |
| Board Dimensions | 67.5 mm × 58.6 mm (±0.15 mm) |
| Finished Board Thickness | 0.6 mm |
| Minimum Trace / Space | 6 / 8 mils |
| Minimum Hole Size | 0.3 mm |
| Blind Vias | None |
| Finished Copper Weight | 1 oz (35 μm) on outer layers |
| Via Plating Thickness | 20 μm |
| Surface Finish | Immersion Gold (ENIG) |
| Top Silkscreen | None |
| Bottom Silkscreen | None |
| Top Solder Mask | None |
| Bottom Solder Mask | None |
| Electrical Test | 100% performed prior to shipment |
| Quality Standard | IPC-Class-2 |
| Artwork Format | Gerber RS-274-X |
PCB Statistics
Components: 11 are populated.
Total Pads: 19 are included.
Through-Hole Pads: 10 are used.
Top SMT Pads: 9 are placed on the top layer.
Bottom SMT Pads: 0 are used.
Vias: 7 are drilled.
Nets: 1 is routed (single-net design).
Available Laminate Configurations (for future orders)
Copper Foil Type: ED copper foil
Copper Thickness Options: 0.018 mm or 0.035 mm
Standard Panel Sizes (tolerance: -2mm):
150 × 150 mm / 160 × 160 mm / 200 × 200 mm / 170 × 240 mm
Available Thicknesses (total thickness including copper OR dielectric thickness; please specify when ordering):
| Thickness (mm) | Tolerance (mm) | Thickness (mm) | Tolerance (mm) |
| 0.5 | ±0.04 | 4 | ±0.1 |
| 0.8 | ±0.05 | 5 | ±0.12 |
| 1 | ±0.05 | 6 | ±0.12 |
| 1.2 | ±0.05 | 7 | ±0.15 |
| 1.5 | ±0.06 | 8 | ±0.18 |
| 2 | ±0.075 | 10 | ±0.2 |
| 3 | ±0.1 | 12 | ±0.3 |
| Volume Resistivity | 500V, Normal State | >1×10⁹ MΩ·cm | |
| Surface Resistance | 500V, Normal State | >1×10⁷ MΩ | |
| CTE (X / Y / Z) | -55°C to +150°C | 60 / 60 / 70 PPM/°C | |
| Water Absorption | 20±2°C, 24 hours | ≤0.01% | |
| Long-Term Operating Temperature | — | -100°C to +150°C | |
| Density | — | 1.89 g/cm³ | |
| Thermal Conductivity | — | 0.44 W/(M·K) | |
| Material Composition | — | PPO, Ceramic, ED copper foil |
Processing & Handling Notes (to be observed)
Fabrication Ease: The material can be easily machined (drilling, turning, grinding, shearing, etching), and a high yield is typically achieved. Processing cost is significantly reduced compared to ceramic substrates.
Multilayer Boards: Multilayer processing is generally not recommended. If attempted, low-temperature bonding sheets must be selected, and feasibility should be carefully evaluated.
Soldering Restrictions:
260°C thermal shock testing is not suitable for this material.
Wave soldering should be avoided.
Hand soldering with a constant-temperature iron is recommended.
Reflow soldering is generally not advised. If reflow soldering must be performed, a maximum set temperature of 200°C should not be exceeded, and full feasibility validation is required.
Typical Applications
The TP440-based PCB has been identified as an ideal solution for the following applications:
Compliance & Testing
All typical laminate data have been obtained using GB/T 12636-1990 or IPC-TM-650 (2.5.5.5 stripline method for Dk) and IPC-TM-650 or GBT4722-2017 for other properties. The finished PCB has been manufactured and tested to IPC-Class-2 standards. The Immersion Gold surface finish supports lead-free (RoHS) assembly processes.
It should be noted that all test data are typical measurement values intended to aid material selection. No express or implied warranty is constituted, nor is it ensured that all performance characteristics will be met in every specific application. Suitability for a particular use case must be independently verified by the customer.
Ordering Information
Worldwide availability has been established. For the finished PCB described herein, immediate integration into RF, defense, or communication systems is supported. For custom laminate Dk values, non-standard thicknesses, larger panel sizes, or higher-layer-count PCBs, contacting our technical sales team is recommended.
When placing an order, the following parameters should be clearly specified:
Order now to have your next-generation high-frequency design accelerated.
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Seller
Year Established:
2003
Total Annual:
10 million-18 million
Employee Number:
350~450
Ecer Certification：
Site Member
Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd. has established itself as a reliable high-frequency PCB supplier and exporter based in Shenzhen, China. For over 24 years, we have served industries worldwide, including cellular base station antennas, satellite communi... Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd. has established itself as a reliable high-frequency PCB supplier and exporter based in Shenzhen, China. For over 24 years, we have served industries worldwide, including cellular base station antennas, satellite communi...
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