Shenzhen ECER Network Technology Co., Ltd.
| Pins Structure | 1x8P |
| Contact Plating | 锡 |
| Pitch | 0.8mm |
| Contact Material | 磷铜;LCP |
| Voltage Rating (Max) | 50V |
| Number of PINs Per Row | 8 |
| Number of Rows | 1 |
| Z-Height of the Board | 2.75mm |
| Mounting Type | 立贴 |
| Operating Temperature | -25℃~+85℃ |
| Description | 1x8P Tin 0.8mm 50V 8 1 Surface Mount,Vertical -25℃~+85℃ SMD,P=0.8mm Headers, Male Pins RoHS |
| Mfr. Part # | W-0800N08P-R000 |
| Package | SMD,P=0.8mm |
| Model Number | W-0800N08P-R000 |
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Product Specification
| Pins Structure | 1x8P | Contact Plating | 锡 |
| Pitch | 0.8mm | Contact Material | 磷铜;LCP |
| Voltage Rating (Max) | 50V | Number of PINs Per Row | 8 |
| Number of Rows | 1 | Z-Height of the Board | 2.75mm |
| Mounting Type | 立贴 | Operating Temperature | -25℃~+85℃ |
| Description | 1x8P Tin 0.8mm 50V 8 1 Surface Mount,Vertical -25℃~+85℃ SMD,P=0.8mm Headers, Male Pins RoHS | Mfr. Part # | W-0800N08P-R000 |
| Package | SMD,P=0.8mm | Model Number | W-0800N08P-R000 |
The SUH0.8 is a wire-to-board connector with a 0.8mm pitch, designed for pressure crimping. It is suitable for applications requiring a rated voltage of up to 50V AC/DC and a rated current of 0.5A. The connector operates within an ambient temperature range of -25 to +85.
| Item | Specification | Requirement |
| Ratings and Applicable Wires | ||
| Rated Voltage (MAX) | 50V [AC(rms)/DC] | |
| Insulation O.D. | 0.5-0.6mm | |
| Rated Current (MAX) | AWG#30: 0.5A, AWG#32: 0.5A | |
| Ambient Temperature Range | -25 +85 | |
| Performance - Electrical | ||
| Contact Resistance | Measure by dry circuit, 20mV MAX, 10mA | 20 milliohms MAX |
| Insulation Resistance | Apply 100V DC between adjacent terminals or ground | 100 Megohms MIN |
| Dielectric Strength | Apply 200V AC (rms) for 1 minute between adjacent terminals or ground | No Breakdown |
| Contact Resistance On Crimped Portion | Measure by dry circuit, 20mV MAX, 10mA | 5 milliohms MAX |
| Performance - Mechanical | ||
| Contact Retention Force (Min.) | Apply axial pull out force at a speed of 253mm/minute | 4-7N MIN |
| Terminal/Housing Retention Force | Apply axial pull out force at a speed of 253mm/minute | 4-7N MIN |
| Contact Insertion Force | Insert and withdraw connectors with hand | 1-2N/PIN |
| Contact Withdrawal Force | Insert and withdraw connectors with hand | 0.3N/PIN |
| Performance - Environmental and Others | ||
| Repeated Insertion and Withdrawal | 20 cycles at a speed rate of less than 10 cycles/minute (no power) | Contact Resistance: 60 mMAX |
| Temperature Rise | Carrying rated current load (UL 498) | 30 MAX |
| Vibration | DC 1mA, Amplitude: 5mm P-P, Sweep time: 10-55-10Hz/min, Duration: 2 hours in each X,Y,Z axes | Appearance: No Damage, Contact Resistance: 60 mMAX, Discontinuity: 1 ms.MAX. |
| Shock | DC 1mA, 490m/s{50G}, 3 strokes in each X,Y,Z axes | Appearance: No Damage, Discontinuity: 1 ms.MAX. |
| Heat Resistance | 852 for 96 hours, then return to room temperature for 1-2 hours | Appearance: No Damage, Contact Resistance: 60 mMAX |
| Cold Resistance | -402 for 96 hours, then return to room temperature for 1-2 hours | Appearance: No Damage, Contact Resistance: 60 mMAX |
| Humidity | 402, 90-94% RH for 96 hours, then return to room temperature for 0.5 hours | Appearance: No Damage, Contact Resistance: 60 mMAX, Dielectric Strength: Must meet 4.1.3, Insulation Resistance: 20 M MIN |
| Temperature Cycling | 5 cycles of: -253 for 30 minutes; 852 for 30 minutes (with intermediate room temp. periods) | Appearance: No Damage, Contact Resistance: 60 mMAX |
| Salt Spray | 24 hours exposure to salt spray (51% solution at 352), followed by washing and drying | Appearance: No Damage, Corrosion, Contact Resistance: 60 mMAX |
| SO2 Gas Resistance | 24 hours exposure to 505ppm SO2 gas at 402 | Contact Resistance: 60 mMAX |
| NH3 Gas Resistance | 40 minutes exposure to NH3 gas evaporating from 28% Ammonia solution | Appearance: No Damage, Contact Resistance: 60 mMAX |
| Solderability | Terminal tip immersed in 2355 tin bath for 20.5 sec (0.2 mm from tip) | Solder Wetting: More Than 95% Apply Area |
| Resistance to Soldering Heat | Terminal tip immersed in 2555 tin bath for 50.5 sec (0.2 mm from tip) | Appearance: No Damage, Deformation |
| Parameter | Specification |
| Average temperature gradient in preheating | 2.5C/s |
| Soak time (tsoak) | 2-3 minutes |
| Time above 150C (T1) | 60s |
| Time above 180C (T2) | 50s |
| Time above 250C (T3) | 2-5s |
| Peak temperature in reflow (Tpeak) | 255C (0/+5C) |
| Temperature gradient in cooling | Max -5C/s |
| Time above 230C | 2010 sec |
| Pre-Heat | 9030 sec |
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Agent,Importer
Year Established:
2009
Total Annual:
10000000-50000000
Employee Number:
300~500
Ecer Certification：
Verified Supplier
Your Trusted Source for Integrated Circuit Shenzhen ECER Network Technology Co., Ltd. is a professional company focus on integrated circuit ic business. ECER connects buyers worldwide with verified manufacturers across 40+ industries. Every component sourced with precision, quality, and reliability... Your Trusted Source for Integrated Circuit Shenzhen ECER Network Technology Co., Ltd. is a professional company focus on integrated circuit ic business. ECER connects buyers worldwide with verified manufacturers across 40+ industries. Every component sourced with precision, quality, and reliability...
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