Shenzhen ECER Network Technology Co., Ltd.
| Pins Structure | 1x2P |
| Contact Plating | 锡 |
| Pitch | 0.8mm |
| Contact Material | 磷铜;LCP |
| Voltage Rating (Max) | 50V |
| Number of PINs Per Row | 2 |
| Number of Rows | 1 |
| X-Length of Bottom Edge on Board (Spacing Line) | 3.86mm |
| Mounting Type | 卧贴 |
| Operating Temperature | -25℃~+85℃ |
| Description | 1x2P Tin 0.8mm 50V 2 1 Surface Mount, Right Angle -25℃~+85℃ SMD,P=0.8mm,Surface Mount,Right Angle Headers, Male Pins RoHS |
| Mfr. Part # | W-0800M02P-R000 |
| Package | SMD,P=0.8mm,Surface Mount,Right Angle |
| Model Number | W-0800M02P-R000 |
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Product Specification
| Pins Structure | 1x2P | Contact Plating | 锡 |
| Pitch | 0.8mm | Contact Material | 磷铜;LCP |
| Voltage Rating (Max) | 50V | Number of PINs Per Row | 2 |
| Number of Rows | 1 | X-Length of Bottom Edge on Board (Spacing Line) | 3.86mm |
| Mounting Type | 卧贴 | Operating Temperature | -25℃~+85℃ |
| Description | 1x2P Tin 0.8mm 50V 2 1 Surface Mount, Right Angle -25℃~+85℃ SMD,P=0.8mm,Surface Mount,Right Angle Headers, Male Pins RoHS | Mfr. Part # | W-0800M02P-R000 |
| Package | SMD,P=0.8mm,Surface Mount,Right Angle | Model Number | W-0800M02P-R000 |
0.8mm pitch pressure type bar connectors for wire-to-board connections. Designed for applications requiring reliable electrical connections between wires and circuit boards.
| Item | Specification | Requirement |
| Ratings and Applicable Wires | ||
| Rated Voltage (MAX) | 50V [AC(rms)/DC] | |
| Insulation O.D. | 0.5-0.6mm | |
| Rated Current (MAX) | AWG#30 | 0.5A |
| Rated Current (MAX) | AWG#32 | 0.5A |
| Ambient Temperature Range | -25 +85 | |
| Performance | ||
| Contact Resistance | Measure by dry circuit, 20mV MAX, 10mA | 20 milliohms MAX |
| On Crimped Portion (measure by dry circuit, 20mV MAX, 10mA) | 5 milliohoms MAX | |
| Insulation Resistance | Apply 100V DC between adjacent terminal or ground | 100Megohms MIN |
| Dielectric Strength | Apply 200V AC (min) for 1 minute between adjacent terminal or ground | No Breakdown |
| Mechanical Performance | ||
| Contact Retention Force (Min.) | Apply axial pull out force at a speed of 253mm/minute | 4-7N MIN |
| Terminal /Housing Retention Force | Apply axial pull out force at a speed of 253mm/minute | 4-7N MIN |
| Contact Insertion and Withdrawal Force | Insert force | 1-2N/PIN |
| Pull output | 0.3N/PIN | |
| Environmental Performance and Others | ||
| Repeated Insertion and Withdrawal | Insertion and withdrawal actuator up to 20 cycles at a speed rate of less than 10 cycles/minute | |
| Contact Resistance | 60 mMAX | |
| Temperature Rise | Carrying rated current load (UL 498) | 30 MAX |
| Vibration | Amplitude: 5mm P-P, Sweep time: 10-55-10Hz/min, Duration: 2 hours in each X.Y.Z. axes, DC 1mA energized | |
| Contact Resistance | 60 mMAX | |
| Discontinuity | 1 ms.MAX. | |
| Shock | 490m/s{50G}, 3 strokes in each X.Y.Z. axes, DC 1mA energized | |
| Discontinuity | 1 ms.MAX. | |
| Heat Resistance | 852, 96 hours, then return to room temperature for 1-2 hours | |
| Contact Resistance | 60 mMAX | |
| Cold Resistance | -402, 96 hours, then return to room temperature for 1-2 hours | |
| Contact Resistance | 60 mMAX | |
| Humidity | Temperature: 402, Relative Humidity: 90-94%, Duration: 96 Hours, then measure at room temperature within 0.5 hours | |
| Contact Resistance | 60 mMAX | |
| Dielectric Strength | Must meet 4.1.3 | |
| Insulation Resistance | 20 M MIN | |
| Temperature Cycling | 5 cycles of: a) -253 30 minutes b) 852 30 minutes, with 10-15 minutes at room temp/humidity between cycles | |
| Contact Resistance | 60 mMAX | |
| Salt Spray | 24 hours exposure to a salt spray from the 51% solution at 352. After test, wash with room temp water and dry at room temp. | |
| Contact Resistance | 60 mMAX | |
| SO2 Gas Resistance | 24 hours exposure to 505ppm SO2 gas at 402. | Contact Resistance: 60 mMAX |
| NH3 Gas Resistance | 40 minutes exposure to NH3 gas evaporating from 28% Ammonia solution | |
| Contact Resistance | 60 mMAX | |
| Solderability | Soldering Time: 20.5 sec, Soldering Temperature: 2355, 0.2 mm from terminal tip | |
| Solder Wetting Area | More Than 95% | |
| Resistance to Soldering Heat | Soldering Time: 50.5 sec, Soldering Temperature: 2555, 0.2 mm from terminal tip | Appearance: No Damage, Deformation |
| Conditions for Soldering (Pb-free) | ||
| Parameter | Specification | |
| Average temperature gradient in preheating | 2.5C/s | |
| Soak time (tsoak) | 2-3 minutes | |
| Time above 150C (T1) | 60s | |
| Time above 180C (T2) | 50s | |
| Time above 250C (T3) | 2-5s | |
| Peak temperature in reflow (Tpeak) | 255C (+0/-5C) | |
| Temperature gradient in cooling | Max -5C/s | |
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Agent,Importer
Year Established:
2009
Total Annual:
10000000-50000000
Employee Number:
300~500
Ecer Certification：
Verified Supplier
Your Trusted Source for Integrated Circuit Shenzhen ECER Network Technology Co., Ltd. is a professional company focus on integrated circuit ic business. ECER connects buyers worldwide with verified manufacturers across 40+ industries. Every component sourced with precision, quality, and reliability... Your Trusted Source for Integrated Circuit Shenzhen ECER Network Technology Co., Ltd. is a professional company focus on integrated circuit ic business. ECER connects buyers worldwide with verified manufacturers across 40+ industries. Every component sourced with precision, quality, and reliability...
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