Shenzhen ECER Network Technology Co., Ltd.
| Pins Structure | 1x10P |
| Contact Plating | 锡 |
| Pitch | 0.8mm |
| Contact Material | 磷铜;LCP |
| Voltage Rating (Max) | 50V |
| Number of PINs Per Row | 10 |
| Operating Temperature | -25℃~+85℃ |
| Mounting Type | 立贴 |
| Description | 1x10P Tin 0.8mm 50V 10 -25℃~+85℃ Surface Mount,Vertical SMD,P=0.8mm Headers, Male Pins RoHS |
| Mfr. Part # | W-0800N10P-R000 |
| Package | SMD,P=0.8mm |
| Model Number | W-0800N10P-R000 |
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Product Specification
| Pins Structure | 1x10P | Contact Plating | 锡 |
| Pitch | 0.8mm | Contact Material | 磷铜;LCP |
| Voltage Rating (Max) | 50V | Number of PINs Per Row | 10 |
| Operating Temperature | -25℃~+85℃ | Mounting Type | 立贴 |
| Description | 1x10P Tin 0.8mm 50V 10 -25℃~+85℃ Surface Mount,Vertical SMD,P=0.8mm Headers, Male Pins RoHS | Mfr. Part # | W-0800N10P-R000 |
| Package | SMD,P=0.8mm | Model Number | W-0800N10P-R000 |
This specification applies to the SUH0.8 series of pressure-type bar connectors with a 0.8mm pitch. Designed for wire-to-board connections, these connectors offer reliable electrical performance and mechanical durability for various applications.
| Item | Specification | Requirement |
| Ratings and Applicable Wires | ||
| Rated Voltage (MAX) | 50V [AC (rms) / DC] | |
| Insulation O.D. | 0.5-0.6mm | |
| Rated Current (MAX) | AWG#30: 0.5A, AWG#32: 0.5A | |
| Ambient Temperature Range | -25 +85 | |
| Performance | ||
| Electrical Performance | ||
| Contact Resistance | Measured by dry circuit, 20mV MAX, 10mA | 20 milliohms MAX |
| Insulation Resistance | Apply 100V DC between adjacent terminals or ground | 100 Megohms MIN |
| Dielectric Strength | Apply 200V AC (rms) for 1 minute between adjacent terminals or ground | No Breakdown |
| Contact Resistance On Crimped Portion | Measured by dry circuit, 20mV MAX, 10mA | 5 milliohms MAX |
| Mechanical Performance | ||
| Contact Retention Force (Min.) | Apply axial pull out force at a speed of 253mm/minute | 4-7N MIN |
| Terminal / Housing Retention Force | Apply axial pull out force at a speed of 253mm/minute | 4-7N MIN |
| Contact Insertion Force | Insert connectors with hand | 1-2N/PIN |
| Contact Withdrawal Force | Withdraw connectors with hand | 0.3N/PIN |
| Environmental and Other Performance | ||
| Repeated Insertion and Withdrawal | 20 cycles at a speed rate of less than 10 cycles/minute (no power) | Contact Resistance: 60 m MAX |
| Temperature Rise | Carrying rated current load (UL 498) | 30 MAX |
| Vibration | DC 1mA, Amplitude: 5mm P-P, Sweep time: 10-55-10Hz/min, Duration: 2 hours in each X,Y,Z axes | Appearance: No Damage, Contact Resistance: 60 m MAX, Discontinuity: 1 ms.MAX. |
| Shock | DC 1mA, 490m/s {50G}, 3 strokes in each X,Y,Z axes | Appearance: No Damage, Discontinuity: 1 ms.MAX. |
| Heat Resistance | 852 for 96 hours, then return to room temp for 1-2 hours | Appearance: No Damage, Contact Resistance: 60 m MAX |
| Cold Resistance | -402 for 96 hours, then return to room temp for 1-2 hours | Appearance: No Damage, Contact Resistance: 60 m MAX |
| Humidity | 402, 90-94% RH for 96 hours, then return to room temp for 0.5 hours | Appearance: No Damage, Contact Resistance: 60 m MAX, Dielectric Strength: Must meet 4.1.3, Insulation Resistance: 20 M MIN |
| Temperature Cycling | 5 cycles of: -253 for 30 minutes, then 852 for 30 minutes | Appearance: No Damage, Contact Resistance: 60 m MAX |
| Salt Spray | 24 hours exposure to salt spray (51% solution at 352), then wash with water and dry | Appearance: No Damage, Corrosion, Contact Resistance: 60 m MAX |
| SO2 Gas Resistance | 24 hours exposure to 505ppm SO2 gas at 402 | Contact Resistance: 60 m MAX |
| NH3 Gas Resistance | 40 minutes exposure to NH3 gas from 28% Ammonia solution | Appearance: No Damage, Contact Resistance: 60 m MAX |
| Solderability | Immersion in 2355 tin bath for 20.5 sec at 0.2 mm from terminal tip | Solder Wetting: Apply Area More Than 95% |
| Resistance to Soldering Heat | Immersion in 2555 tin bath for 50.5 sec at 0.2 mm from terminal tip | Appearance: No Damage, Deformation |
| Conditions for Soldering (Pb-free) | ||
| Preheating Average Temperature Gradient | 2.5C/s | |
| Soak Time (tsoak) | Time above 150C (T1) | 2-3 minutes (60s) |
| Time above 180C (T2) | 50s | |
| Time above 250C (T3) | 2-5s | |
| Peak Temperature (Tpeak) | 255C (0/+5C) | |
| Cooling Temperature Gradient | Max -5C/s | |
| Time above 230C | 2010sec | |
| Pre-Heat Time | 9030sec | |
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Agent,Importer
Year Established:
2009
Total Annual:
10000000-50000000
Employee Number:
300~500
Ecer Certification：
Verified Supplier
Your Trusted Source for Integrated Circuit Shenzhen ECER Network Technology Co., Ltd. is a professional company focus on integrated circuit ic business. ECER connects buyers worldwide with verified manufacturers across 40+ industries. Every component sourced with precision, quality, and reliability... Your Trusted Source for Integrated Circuit Shenzhen ECER Network Technology Co., Ltd. is a professional company focus on integrated circuit ic business. ECER connects buyers worldwide with verified manufacturers across 40+ industries. Every component sourced with precision, quality, and reliability...
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