Shenzhen ECER Network Technology Co., Ltd.
| Pitch | 2mm |
| Flame Retardant Rating | UL94V-0 |
| colour | 白色 |
| Number of Rows | 1 |
| Reference Series | HY |
| Operating Temperature | -25℃~+85℃ |
| Plastic Material | PA66 |
| Number of PINs Per Row | 2 |
| With Locker | 带锁扣 |
| Description | Connector Housing 2 Position 2mm Pitch Single Row HY Series PA66 -25℃~+85℃ |
| Mfr. Part # | WAFER-HY200JK-2A |
| Package | P=2mm |
| Model Number | WAFER-HY200JK-2A |
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Product Specification
| Pitch | 2mm | Flame Retardant Rating | UL94V-0 |
| colour | 白色 | Number of Rows | 1 |
| Reference Series | HY | Operating Temperature | -25℃~+85℃ |
| Plastic Material | PA66 | Number of PINs Per Row | 2 |
| With Locker | 带锁扣 | Description | Connector Housing 2 Position 2mm Pitch Single Row HY Series PA66 -25℃~+85℃ |
| Mfr. Part # | WAFER-HY200JK-2A | Package | P=2mm |
| Model Number | WAFER-HY200JK-2A |
This product features brass contacts plated with nickel and tin, housed in a white LCP/PA66 (UL94V-0) base. It is designed for electrical applications with a rated voltage of 250V AC/DC and a rated current of 2.0A AC/DC. Key technical specifications include a contact resistance of 10m, insulation resistance of 1000M, and a dielectric strength of 1000V AC/Minute. The operating temperature range is from -25C to +85C. The product also meets environmental requirements regarding hazardous substances. It is suitable for PCB mounting as indicated by the suggested PCB layout.
| Specification | Value |
|---|---|
| Contact Resistance | 10m |
| Insulation Resistance | 1000M |
| Rated Voltage | 250V AC DC |
| Rated Current | 2.0A AC DC |
| Withstand Voltage | 1000V AC/Minute |
| Operating Temperature | -25C to +85C |
| Solderability Test (Immersion Area) | 95% |
| Solderability Test (Temperature) | 220C +5C / -0C |
| Solderability Test (Time) | 2.5 0.5 seconds |
| Hazardous Substances | Compliant with environmental requirements (e.g., Lead, Cadmium) |
| Dimensions (Overall Height) | 8 0.2 mm |
| Dimensions (Wafer Length) | 5.10 0.2 mm |
| Dimensions (Wafer Width) | 4.00 +0.15 / -0.15 mm |
| Dimensions (Contact Diameter) | 0.50 0.05 mm |
| Dimensions (Pitch) | 2.00 0.10 mm |
| Dimensions (PCB Layout Hole Diameter) | 0.7 0.10 mm |
| Dimensions (PCB Layout Pad Diameter) | 0.7 0.10 mm |
| Dimensions (PCB Layout Pad Spacing) | 2.00 0.10 mm |
| Dimensions (PCB Layout Offset) | A 0.20 mm |
| Dimensions (PCB Layout Offset) | B 0.2 mm |
| Dimensions (PCB Layout Offset) | C 0.15 mm |
| Dimensions (PCB Layout Offset) | (B-1.1) +0.15 / -0.15 mm |
| Dimensions (PCB Layout Offset) | 3.4 0.3 mm |
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Agent,Importer
Year Established:
2009
Total Annual:
10000000-50000000
Employee Number:
300~500
Ecer Certification：
Verified Supplier
Your Trusted Source for Integrated Circuit Shenzhen ECER Network Technology Co., Ltd. is a professional company focus on integrated circuit ic business. ECER connects buyers worldwide with verified manufacturers across 40+ industries. Every component sourced with precision, quality, and reliability... Your Trusted Source for Integrated Circuit Shenzhen ECER Network Technology Co., Ltd. is a professional company focus on integrated circuit ic business. ECER connects buyers worldwide with verified manufacturers across 40+ industries. Every component sourced with precision, quality, and reliability...
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