| Pins Structure | 1x10P |
| Contact Plating | 锡 |
| Pitch | 0.8mm |
| Contact Material | 磷铜;LCP |
| Voltage Rating (Max) | 50V |
| Number of PINs Per Row | 10 |
| Number of Rows | 1 |
| X-Length of Bottom Edge on Board (Spacing Line) | 10.7mm |
| Mounting Type | 卧贴 |
| Operating Temperature | -25℃~+85℃ |
| Description | 1x10P Tin 0.8mm 50V 10 1 Surface Mount, Right Angle -25℃~+85℃ SMD,P=0.8mm,Surface Mount,Right Angle Headers, Male Pins RoHS |
| Mfr. Part # | W-0800M10P-R000 |
| Package | SMD,P=0.8mm,Surface Mount,Right Angle |
| Model Number | W-0800M10P-R000 |
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Product Specification
| Pins Structure | 1x10P | Contact Plating | 锡 |
| Pitch | 0.8mm | Contact Material | 磷铜;LCP |
| Voltage Rating (Max) | 50V | Number of PINs Per Row | 10 |
| Number of Rows | 1 | X-Length of Bottom Edge on Board (Spacing Line) | 10.7mm |
| Mounting Type | 卧贴 | Operating Temperature | -25℃~+85℃ |
| Description | 1x10P Tin 0.8mm 50V 10 1 Surface Mount, Right Angle -25℃~+85℃ SMD,P=0.8mm,Surface Mount,Right Angle Headers, Male Pins RoHS | Mfr. Part # | W-0800M10P-R000 |
| Package | SMD,P=0.8mm,Surface Mount,Right Angle | Model Number | W-0800M10P-R000 |
This specification applies to 0.8mm spacing pressure type bar connectors, designed for wire-to-board connections. The product is manufactured by Shenzhen Cankemeng Industrial Co., Ltd. and is suitable for applications requiring a rated voltage of up to 50V and a rated current of 0.5A for AWG#30 and AWG#32 wires. The operating temperature range is -25 to +85.
| Item | Specification | Requirement |
| 3 Ratings and Applicable Wires | ||
| Rated Voltage (MAX) | [AC(rms)/DC] | 50V |
| Insulation O.D. | External Diameter: 0.5-0.6mm | AWG#30: 0.5A AWG#32: 0.5A |
| Rated Current (MAX) | ||
| Ambient temperature Range | -25 +85 | |
| 4 Performance | ||
| 4.1 Performance | ||
| Contact Resistance | Measure by dry circuit, 20mV MAX, 10mA | 20 milliohms MAX |
| Insulation Resistance | Apply 100V DC between adjacent terminals or ground | 100 Megohms MIN |
| Dielectric Strength | Apply 200V AC (rms) for 1 minute between adjacent terminals or ground | No Breakdown |
| Contact Resistance On Crimped Portion | Measure by dry circuit, 20mV MAX, 10mA | 5 milliohoms MAX |
| 4.2 Mechanical Performance | ||
| Contact Retention Force (Min.) | Apply axial pull out force at a speed of 253mm/minute on the contact assembled in the housing | 4-7N MIN |
| Terminal /Housing Retention Force | Apply axial pull out force at a speed of 253mm/minute on the contact assembled in the housing | 4-7N MIN |
| Contact Insertion and Withdrawal Force | Insert and withdraw connectors with hand | Insert force: 1-2N/PIN Pull output: 0.3N/PIN |
| 4.3 Environmental Performance and Others | ||
| Repeated Insertion and Withdrawal | Insertion and withdrawal up to 20 cycles at a speed rate of less than 10 cycles/minute | Contact Resistance: 60 mMAX |
| Temperature Rise | Carrying rated current load (UL 498) | 30 MAX |
| Vibration | DC 1mA energized; Amplitude: 5mm P-P; Sweep time: 10-55-10Hz/min; Duration: 2 hours in each X, Y, Z axes | Appearance: No Damage Contact Resistance: 60 mMAX Discontinuity: 1 ms.MAX. |
| Shock | DC 1mA energized; 490m/s {50G}, 3 strokes in each X, Y, Z axes | Appearance: No Damage Discontinuity: 1 ms.MAX. |
| Heat Resistance | 852 for 96 hours; then return to room temperature for 1-2 hours | Appearance: No Damage Contact Resistance: 60 mMAX |
| Cold Resistance | -402 for 96 hours; then return to room temperature for 1-2 hours | Appearance: No Damage Contact Resistance: 60 mMAX |
| Humidity | 402, 90-94% RH for 96 hours; then return to room temperature for 0.5 hours | Appearance: No Damage Contact Resistance: 60 mMAX Dielectric Strength: Must meet 4.1.3 Insulation Resistance: 20 M MIN |
| Temperature Cycling | 5 cycles of: a) -253 30 minutes; b) 852 30 minutes | Appearance: No Damage Contact Resistance: 60 mMAX |
| Salt Spray | 24 hours exposure to a salt spray from 51% solution at 352. After test, wash with room temperature water and dry at room temperature. | Appearance: No Damage, Corrosion Contact Resistance: 60 mMAX |
| SO2 Gas | 24 hours exposure to 505ppm SO2 gas at 402. | Contact Resistance: 60 mMAX |
| NH3 Gas | 40 minutes exposure to NH3 gas evaporating from 28% Ammonia solution. | Appearance: No Damage Contact Resistance: 60 mMAX |
| Solderability | Soldering Time: 20.5 sec. Soldering Temperature: 2355 0.2 mm from terminal tip | Solder Wetting: Apply Area More Than 95% |
| Resistance to Soldering Heat | Soldering Time: 50.5 sec. Soldering Temperature: 2555 0.2 mm from terminal tip | Appearance: No Damage, Deformation |
| 5 Conditions for Soldering | ||
| Pb-free Reflow Profile Requirements | Average temperature gradient in preheating: 2.5C/s Soak time (tsoak): 2-3 minutes Time above 150C (T1): 60s Time above 180C (T2): 50s Time above 250C (T3): 2-5s Peak temperature in reflow (Tpeak): 255C (0/+5C) Temperature gradient in cooling: Max -5C/s | |
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Agent,Importer
Year Established:
2009
Total Annual:
10000000-50000000
Employee Number:
300~500
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Verified Supplier
Your Trusted Source for Integrated Circuit Shenzhen ECER Network Technology Co., Ltd. is a professional company focus on integrated circuit ic business. ECER connects buyers worldwide with verified manufacturers across 40+ industries. Every component sourced with precision, quality, and reliability... Your Trusted Source for Integrated Circuit Shenzhen ECER Network Technology Co., Ltd. is a professional company focus on integrated circuit ic business. ECER connects buyers worldwide with verified manufacturers across 40+ industries. Every component sourced with precision, quality, and reliability...
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