Shenzhen ECER Network Technology Co., Ltd.
| Description | SMD,P=1.25mm,Surface Mount,Right Angle Headers, Male Pins RoHS |
| Mfr. Part # | W-1253M08P-0420 |
| Package | SMD,P=1.25mm,Surface Mount,Right Angle |
| Model Number | W-1253M08P-0420 |
View Detail Information
Explore similar products
Precision wafer connector HDGC HDGC1254WR-S-6P featuring 1.25MM pitch and 90
PCB layout part HCTL HC-0.8-6PLT designed for temperature range minus 25 to plus
2.54mm Pitch Single Row Pin Header Connector OUPIIN 2011H-1X40G01SB Straight
PCB mount horizontal SMT connector 1.0mm pitch JUSHUO SHB10-S03DCA-00 with
Product Specification
| Description | SMD,P=1.25mm,Surface Mount,Right Angle Headers, Male Pins RoHS | Mfr. Part # | W-1253M08P-0420 |
| Package | SMD,P=1.25mm,Surface Mount,Right Angle | Model Number | W-1253M08P-0420 |
This specification outlines the requirements for the 1.25 series ultra-thin wafer connector strip, designed for various electrical applications. It covers product performance, testing methods, and inspection criteria, ensuring reliable connectivity in specified environmental and operational conditions.
| Item | Description | Specification |
| Scope | Applicable Range | 1.25 series connector strip (product performance, test methods, inspection requirements) |
| Applicable Standards | Environmental Testing | GB/T2421, GB/T2423, GB/T2424 |
| Applicable Standards | Component Testing | GB/T5095 |
| Use Condition | Ambient Temperature | -25+85 |
| Use Condition | Applicable Wire Sizes | AWG#28#32 |
| Use Condition | Applicable PC Board Thickness | 0.6~1.2mm |
| Appearance | Surface Condition | No defects, dirt, cracks, mechanical damage; contacts free from rust, plating oxidation, or peeling. |
| Appearance | Dimensions | According to drawings |
| Appearance | Interchangeability | Same specifications should be interchangeable. |
| Material | Terminal | Phosphor bronze, 0.15mm thick, Gold Plating: Fu~3" |
| Material | Housing | PBT, UL94V-0, Color: White |
| Material | Housing | Nylon6T, UL94V-0, Color: Beige |
| Material | Contact (Pin) | Phosphor bronze, 0.30mm thick, Gold Plating: Fu~3" |
| Material | Wafer | Solder tab, Phosphor bronze, 0.20mm thick, Gold Plating: Fu~3" |
| Electrical Performance | Rated Current | 1A AC/DC |
| Electrical Performance | Rated Voltage | 125V AC/DC |
| Electrical Performance | Contact Resistance (Initial) | 20 m (Max voltage 20mV, Max current 100mA) |
| Electrical Performance | Withstand Voltage | 500V AC (rms) for 1 min, leakage current < 0.5mA (No breakdown/flashover) |
| Electrical Performance | Insulation Resistance | 100 M (500V DC for 1 min between adjacent contacts) |
| Mechanical Performance | Terminal crimping wire strength | AWG#28: >13N, AWG#30: >8N, AWG#32: >6N (Pullout force at 253mm/min) |
| Mechanical Performance | Fixed terminals and hole seat | >8N per contact (Pullout force at 253mm/min) |
| Mechanical Performance | Single contact insertion force | 3N (Mate connector at 253mm/min) |
| Mechanical Performance | Single contact withdrawal force | 0.3N (Mate connector at 253mm/min) |
| Mechanical Performance | Pin Retention force | 10N per contact (Pullout force at 253mm/min) |
| Mechanical Performance | Durability | 30 cycles (Max 10 cycles/min), Contact Resistance 30 m |
| Mechanical Performance | Vibration | Frequency: 10-55-10 Hz/min, Amplitude: 1.5mm p-p, 2 hours per axis (X, Y, Z). Appearance: No damage. Contact Resistance 30 m, Current Discontinuity: 1sec Max. |
| Environmental Performance | Thermal Aging | 852 for 96 hours. Appearance: No damage. Contact Resistance 30 m. |
| Environmental Performance | Temperature Rise | Max 30 (at max rated current) |
| Environmental Performance | Humidity (Constant) | 402, 90-95%RH for 96 hours. Appearance: No damage. Contact Resistance 30m, Insulation Resistance 50M, No breakdown/flashover. |
| Environmental Performance | Temperature Cycling | 5 cycles (-553 30min -> Room temp. 10-15min -> 853 30min -> Room temp. 10-15min). Same requirements as Humidity test. |
| Environmental Performance | Salt Spray | 353, 51% solution. Stamping then plating: 48 hours. Plating then stamping: 8 hours. Appearance: No damage. Contact Resistance 30 m. |
| Environmental Performance | Solderability | Solder Temp: 2455, Immersion: 30.5S. Soldering Area: 90%. |
| Environmental Performance | Resistance to soldering heat | Manual: 3055, 30.5S. SMT Reflow: Max 2555, 20S Max. Appearance: No damage. |
| Reflow Temperature Curve | SMT Lead-free Process | Refer to 9.1 |
| Packaging | Terminal | Reel packaging |
| Packaging | Housing | Plastic bag packaging |
| Packaging | Wafer | Reel packaging |
| Packaging | Exterior | Carton with packing list |
| Transportation | Conditions | Moisture-proof, no mechanical damage. Temperature: -20~+50. |
| Storage | Conditions | Temperature: -20~+40, RH 80%. No corrosive gases. Re-qualification test required if stored > 6 months. |
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Agent,Importer
Year Established:
2009
Total Annual:
10000000-50000000
Employee Number:
300~500
Ecer Certification：
Verified Supplier
Your Trusted Source for Integrated Circuit Shenzhen ECER Network Technology Co., Ltd. is a professional company focus on integrated circuit ic business. ECER connects buyers worldwide with verified manufacturers across 40+ industries. Every component sourced with precision, quality, and reliability... Your Trusted Source for Integrated Circuit Shenzhen ECER Network Technology Co., Ltd. is a professional company focus on integrated circuit ic business. ECER connects buyers worldwide with verified manufacturers across 40+ industries. Every component sourced with precision, quality, and reliability...
Get in touch with us
Leave a Message, we will call you back quickly!