Shenzhen ECER Network Technology Co., Ltd.
| Y-Width of Bottom Edge on Board | 5mm |
| Reference Series | PHD |
| Pins Structure | 2x8P |
| Contact Plating | - |
| Contact Material | -;PA |
| Operating Temperature | -25℃~+85℃ |
| Flame Retardant Rating | - |
| Supplementary Features | - |
| Pitch | 2mm |
| Voltage Rating (Max) | 250V |
| Number of PINs Per Row | 8 |
| Number of Rows | 2 |
| X-Length of Bottom Edge on Board (Spacing Line) | - |
| Z-Height of the Board | 9.5mm |
| Row Spacing | 2mm |
| Mounting Type | 弯插 |
| Description | Connector Header 16 position 2mm Pitch Right Angle |
| Mfr. Part # | PHD-2*8AW |
| Package | Through Hole,Right Angle,P=2mm |
| Model Number | PHD-2*8AW |
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Product Specification
| Y-Width of Bottom Edge on Board | 5mm | Reference Series | PHD |
| Pins Structure | 2x8P | Contact Plating | - |
| Contact Material | -;PA | Operating Temperature | -25℃~+85℃ |
| Flame Retardant Rating | - | Supplementary Features | - |
| Pitch | 2mm | Voltage Rating (Max) | 250V |
| Number of PINs Per Row | 8 | Number of Rows | 2 |
| X-Length of Bottom Edge on Board (Spacing Line) | - | Z-Height of the Board | 9.5mm |
| Row Spacing | 2mm | Mounting Type | 弯插 |
| Description | Connector Header 16 position 2mm Pitch Right Angle | Mfr. Part # | PHD-2*8AW |
| Package | Through Hole,Right Angle,P=2mm | Model Number | PHD-2*8AW |
The PH-D SERIES is a 2.0mm pitch wire-to-board connector series designed for reliable electrical connections. This specification covers the terminal, housing, and wafer assembly components, suitable for applications requiring a rated voltage of 250V and operating temperatures between -25 to +85. The connectors are available in lead-free configurations and are designed for various wire gauges from AWG #24 to #32.
| Item | Description | Specification |
|---|---|---|
| Scope | Connector Series | 2.0mm Pitch Wire to Board Connector |
| Product Name | Terminal | PH-D-PT (AWG #24-30) |
| Housing | PH-D-2*Y/HK | |
| Wafer Assembly (R/A) | PH-D-2*A | |
| Ratings | Rated Voltage (MAX.) | 250V |
| Maximum Insulation O.D. | 1.0mm | |
| Rated Current (MAX.) and Applicable wires | AWG. #24: 2.0 A; AWG. #32: 2.0 A | |
| Ambient Temperature Range | -25+85 | |
| Electrical Performance | Contact Resistance (mated) | < 20 milliohm MAX. |
| Insulation Resistance | > 100 Megohm MIN. (at 800V DC) | |
| Dielectric Strength | No Breakdown (at 800V AC for 1 minute) | |
| Contact Resistance on Crimped Portion | < 5 milliohm MAX. (at 20mV, 10mA) | |
| Mechanical Performance | Insertion and Withdrawal Force (Connector) | Refer to paragraph 7 |
| Crimping Strength | AWG. #24: 9.8 N (1.0kgf) MIN.; AWG. #32: 4.9 N (0.5kgf) MIN. | |
| Terminal Insertion Force (into housing) | 4.9 N (0.5kgf) MAX. | |
| Terminal/Housing Retention Force | 4.9 N (0.5kgf) MIN. | |
| Pin Retention Force | 4.9 N (0.5kgf) MIN. | |
| Environmental Performance | Mechanical Lifespan | 30 cycles (Contact Resistance: 40 milliohm MAX.) |
| Temperature Rise (at rated current) | 30 MAX. | |
| Vibration | No Damage, Contact Resistance: 40 milliohm MAX., Discontinuity: 1.0 microsecond MAX. | |
| Shock | No Damage, Contact Resistance: 40 milliohm MAX., Discontinuity: 1.0 microsecond MAX. | |
| Heat Resistance (96 hours at 85) | No Damage, Contact Resistance: 40 milliohm MAX. | |
| Cold Resistance (96 hours at -40) | No Damage, Contact Resistance: 40 milliohm MAX. | |
| Humidity (96 hours at 58-62, 90-95% RH) | No Damage, Contact Resistance: 40 milliohm MAX., Insulation Resistance: 10 Megohm MIN. | |
| Temperature Cycling (5 cycles: -55 to +105) | No Damage, Contact Resistance: 40 milliohm MAX. | |
| Salt Spray (48 hours, 51% NaCl solution at 352) | No Damage, Contact Resistance: 40 milliohm MAX. | |
| SO2 Gas (24 hours at 402, 505ppm SO2) | No Damage, Contact Resistance: 40 milliohm MAX. | |
| NH3 Gas (40 minutes exposure) | No Damage, Contact Resistance: 40 milliohm MAX. | |
| Solderability | 95% of immersed area must show no voids, pin holes. | |
| Resistance To Soldering Heat | No Damage | |
| Reflow Condition | Peak Temp | 250 MAX. |
| Time above 230 | 30 SEC. MIN. | |
| Total time (150-200 Pre-heat) | 120 SEC. | |
| Insertion/Withdrawal Force (Unit: N) | Housing and Wafer - Insertion Force | 1-5.5 N |
| Housing and Wafer - Withdrawal Force | 6 N | |
| Housing and Terminal - Insertion Force | 0.25 N | |
| Housing and Terminal - Withdrawal Force | 15-15.2 N | |
| Hootype Housing and Terminal - Insertion Force | 0.25 N | |
| Hootype Housing and Terminal - Withdrawal Force | 15-15.2 N |
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Agent,Importer
Year Established:
2009
Total Annual:
10000000-50000000
Employee Number:
300~500
Ecer Certification：
Verified Supplier
Your Trusted Source for Integrated Circuit Shenzhen ECER Network Technology Co., Ltd. is a professional company focus on integrated circuit ic business. ECER connects buyers worldwide with verified manufacturers across 40+ industries. Every component sourced with precision, quality, and reliability... Your Trusted Source for Integrated Circuit Shenzhen ECER Network Technology Co., Ltd. is a professional company focus on integrated circuit ic business. ECER connects buyers worldwide with verified manufacturers across 40+ industries. Every component sourced with precision, quality, and reliability...
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