Shenzhen ECER Network Technology Co., Ltd.
| Flame Retardant Rating | UL94V-0 |
| Pitch | 2mm |
| colour | 黄色 |
| Number of Rows | 1 |
| With Wings | 不带翅 |
| Reference Series | PH |
| Operating Temperature | -25℃~+85℃ |
| Plastic Material | PA66 |
| Number of PINs Per Row | 5 |
| Number of Positions or Pins | 1x5P |
| With Locker | 不带锁扣 |
| Row Spacing | - |
| Description | Connector Housing 5 Position 2mm Pitch Single Row PH Series PA66 -25℃~+85℃ |
| Mfr. Part # | PHR-5-Y |
| Package | P=2mm |
| Model Number | PHR-5-Y |
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Product Specification
| Flame Retardant Rating | UL94V-0 | Pitch | 2mm |
| colour | 黄色 | Number of Rows | 1 |
| With Wings | 不带翅 | Reference Series | PH |
| Operating Temperature | -25℃~+85℃ | Plastic Material | PA66 |
| Number of PINs Per Row | 5 | Number of Positions or Pins | 1x5P |
| With Locker | 不带锁扣 | Row Spacing | - |
| Description | Connector Housing 5 Position 2mm Pitch Single Row PH Series PA66 -25℃~+85℃ | Mfr. Part # | PHR-5-Y |
| Package | P=2mm | Model Number | PHR-5-Y |
This is a thin, low-profile 2.0mm pitch connector, measuring 8.0mm in height after mounting and 4.5mm in width. It is designed to meet the demand for high-density connection of internal wires to printed circuit boards. It is compact, highly reliable, and low in cost, featuring a reliable contact, fully shrouded header, printed circuit board retention mechanism, and surface mount model (SMT) option.
| Part Type | Model No. | Circuits | Dimensions (mm) A | Dimensions (mm) B | Material and Finish | Q'ty / box | Q'ty / reel | Applicable wire (mm) | Applicable wire (AWG) | Insulation O.D. (mm) |
| Contact | SPH-002T-P0.5S | - | - | - | Phosphor bronze, tin-plated (reflow treatment) | - | 8,000 | 0.05 0.22 | 3024 | 0.91.5 |
| Contact | SPH-002T-P0.5L | - | - | - | Phosphor bronze, tin-plated (reflow treatment) | - | 10,000 | 0.08 0.22 | 2824 | 0.81.5 |
| Contact | SPH-004T-P0.5S | - | - | - | Phosphor bronze, tin-plated (reflow treatment) | - | 8,000 | 0.0320.08 | 3228 | 0.50.9 |
| Receptacle Housing | PHR-2 | 2 | 2.0 | 5.8 | PA 66, UL94V-0, natural (white) | 1,000 | - | - | - | - |
| Receptacle Housing | PHR-3 | 3 | 4.0 | 7.8 | PA 66, UL94V-0, natural (white) | 1,000 | - | - | - | - |
| Receptacle Housing | PHR-16 | 16 | 30.0 | 33.8 | PA 66, UL94V-0, natural (white) | 1,000 | - | - | - | - |
| Through-hole header (Top entry) | B2B-PH-K-S | 2 | 2.0 | 5.9 | Post: Brass, copper-undercoated, tin-plated (reflow treatment) Wafer: PA 66, UL94V-0, natural (white) | 1,000 | - | - | - | - |
| Through-hole header (Top entry) | B3B-PH-K-S | 3 | 4.0 | 7.9 | Post: Brass, copper-undercoated, tin-plated (reflow treatment) Wafer: PA 66, UL94V-0, natural (white) | 1,000 | - | - | - | - |
| Through-hole header (Top entry) | B16B-PH-K-S | 16 | 30.0 | 33.9 | Post: Brass, copper-undercoated, tin-plated (reflow treatment) Wafer: PA 66, UL94V-0, natural (white) | 250 | - | - | - | - |
| Through-hole header (Side entry) | S2B-PH-K-S | 2 | 2.0 | 5.9 | Post: Brass, copper-undercoated, tin-plated (reflow treatment) Wafer: PA 66, UL94V-0, natural (white) | 1,000 | - | - | - | - |
| Through-hole header (Side entry) | S3B-PH-K-S | 3 | 4.0 | 7.9 | Post: Brass, copper-undercoated, tin-plated (reflow treatment) Wafer: PA 66, UL94V-0, natural (white) | 1,000 | - | - | - | - |
| Through-hole header (Side entry) | S16B-PH-K-S | 16 | 30.0 | 33.9 | Post: Brass, copper-undercoated, tin-plated (reflow treatment) Wafer: PA 66, UL94V-0, natural (white) | 250 | - | - | - | - |
| Through-hole header (Top entry, Low insertion force) | B2B-PH-KL | 2 | 2.0 | 5.9 | Post: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Wafer: PA 66, UL94V-0, gray | 1,000 | - | - | - | - |
| Through-hole header (Top entry, Low insertion force) | B16B-PH-KL | 16 | 30.0 | 33.9 | Post: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Wafer: PA 66, UL94V-0, gray | 250 | - | - | - | - |
| SMT header (Top entry) | B2B-PH-SM4-TB | 2 | 2.0 | 7.95 | Post: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Wafer: PA, UL94V-0, natural (ivory) Solder tab: Brass, copper-undercoated, tin-plated (reflow treatment) | 1,000 | - | - | - | - |
| SMT header (Top entry) | B16B-PH-SM4-TB | 16 | 30.0 | 35.95 | Post: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Wafer: PA, UL94V-0, natural (ivory) Solder tab: Brass, copper-undercoated, tin-plated (reflow treatment) | 1,000 | - | - | - | - |
| SMT header (Side entry) | S2B-PH-SM4-TB | 2 | 2.0 | 7.9 | Post: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Wafer: PA, UL94V-0, natural (ivory) Solder tab: Brass, copper-undercoated, tin-plated (reflow treatment) | 1,000 | - | - | - | - |
| SMT header (Side entry) | S15B-PH-SM4-TB | 15 | 28.0 | 33.9 | Post: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Wafer: PA, UL94V-0, natural (ivory) Solder tab: Brass, copper-undercoated, tin-plated (reflow treatment) | 1,000 | - | - | - | - |
Current rating: 2A AC, DC (AWG #24)
Voltage rating: 100V AC, DC
Temperature range: -25C to +85C (including temperature rise in applying electrical current)
Contact resistance: Initial value/ 10m max. After environmental testing/ 20m max.
Insulation resistance: 1,000M min.
Withstanding voltage: 800V AC/ minute
Applicable wire: AWG #32 to #24
Applicable PC board thickness: 0.8 to 1.6mm
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Agent,Importer
Year Established:
2009
Total Annual:
10000000-50000000
Employee Number:
300~500
Ecer Certification：
Verified Supplier
Your Trusted Source for Integrated Circuit Shenzhen ECER Network Technology Co., Ltd. is a professional company focus on integrated circuit ic business. ECER connects buyers worldwide with verified manufacturers across 40+ industries. Every component sourced with precision, quality, and reliability... Your Trusted Source for Integrated Circuit Shenzhen ECER Network Technology Co., Ltd. is a professional company focus on integrated circuit ic business. ECER connects buyers worldwide with verified manufacturers across 40+ industries. Every component sourced with precision, quality, and reliability...
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