Hefei Purple Horn E-Commerce Co., Ltd.
| Flame Retardant Rating | UL94V-0 |
| Pitch | 2mm |
| colour | 蓝色 |
| Number of Rows | 1 |
| With Wings | 不带翅 |
| Reference Series | PH |
| Operating Temperature | -25℃~+85℃ |
| Plastic Material | PA66 |
| Number of PINs Per Row | 2 |
| Number of Positions or Pins | 1x2P |
| Row Spacing | - |
| With Locker | 不带锁扣 |
| Description | Connector Housing 2 Position 2mm Pitch Single Row PH Series PA66 -25℃~+85℃ |
| Mfr. Part # | PHR-2-BL |
| Package | P=2mm |
| Model Number | PHR-2-BL |
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Product Specification
| Flame Retardant Rating | UL94V-0 | Pitch | 2mm |
| colour | 蓝色 | Number of Rows | 1 |
| With Wings | 不带翅 | Reference Series | PH |
| Operating Temperature | -25℃~+85℃ | Plastic Material | PA66 |
| Number of PINs Per Row | 2 | Number of Positions or Pins | 1x2P |
| Row Spacing | - | With Locker | 不带锁扣 |
| Description | Connector Housing 2 Position 2mm Pitch Single Row PH Series PA66 -25℃~+85℃ | Mfr. Part # | PHR-2-BL |
| Package | P=2mm | Model Number | PHR-2-BL |
This is a thin, low-profile 2.0mm pitch connector, 8.0mm in height after mounting and 4.5mm in width. It is designed to meet the demand for high-density connection of internal wires to printed circuit boards. It is compact, highly reliable, and low in cost, offering reliable contact, a fully shrouded header, and a printed circuit board retention mechanism. Available in Surface Mount (SMT) models.
| Model Type | Model No. | Circuits | Dimensions (mm) A | Dimensions (mm) B | Q'ty / Box | Material and Finish | Applicable Wire (mm) | Applicable Wire (AWG) | Insulation O.D. (mm) | Q'ty / reel | Notes |
| Contact | SPH-002T-P0.5S | - | - | - | - | Phosphor bronze, tin-plated (reflow treatment) | 0.05 0.22 | 3024 | 0.91.5 | 8,000 | - |
| Contact | SPH-002T-P0.5L | - | - | - | - | Phosphor bronze, tin-plated (reflow treatment) | 0.08 0.22 | 2824 | 0.81.5 | 10,000 | Low insertion force type |
| Contact | SPH-004T-P0.5S | - | - | - | - | Phosphor bronze, tin-plated (reflow treatment) | 0.0320.08 | 3228 | 0.50.9 | - | - |
| Receptacle Housing | PHR-2 | 2 | 2.0 | 5.8 | 1,000 | PA 66, UL94V-0, natural (white) | - | - | - | - | - |
| Receptacle Housing | PHR-16 | 16 | 30.0 | 33.8 | 1,000 | PA 66, UL94V-0, natural (white) | - | - | - | - | - |
| Through-hole Header (Top Entry) | B2B-PH-K-S | 2 | 2.0 | 5.9 | 1,000 | Post: Brass, copper-undercoated, tin-plated (reflow treatment) Wafer: PA 66, UL94V-0, natural (white) | - | - | - | - | - |
| Through-hole Header (Top Entry) | B16B-PH-K-S | 16 | 30.0 | 33.9 | 250 | Post: Brass, copper-undercoated, tin-plated (reflow treatment) Wafer: PA 66, UL94V-0, natural (white) | - | - | - | - | - |
| Through-hole Header (Side Entry) | S2B-PH-K-S | 2 | 2.0 | 5.9 | 1,000 | Post: Brass, copper-undercoated, tin-plated (reflow treatment) Wafer: PA 66, UL94V-0, natural (white) | - | - | - | - | - |
| Through-hole Header (Side Entry) | S16B-PH-K-S | 16 | 30.0 | 33.9 | 250 | Post: Brass, copper-undercoated, tin-plated (reflow treatment) Wafer: PA 66, UL94V-0, natural (white) | - | - | - | - | - |
| Through-hole Header (Top Entry, Low Insertion Force) | B2B-PH-KL | 2 | 2.0 | 5.9 | 1,000 | Post: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Wafer: PA 66, UL94V-0, gray | - | - | - | - | (LF)(SN) |
| Through-hole Header (Top Entry, Low Insertion Force) | B16B-PH-KL | 16 | 30.0 | 33.9 | 250 | Post: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Wafer: PA 66, UL94V-0, gray | - | - | - | - | (LF)(SN) |
| Through-hole Header (Side Entry, Low Insertion Force) | S2B-PH-KL | 2 | 2.0 | 5.9 | 1,000 | Post: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Wafer: PA 66, UL94V-0, gray | - | - | - | - | (LF)(SN) |
| Through-hole Header (Side Entry, Low Insertion Force) | S16B-PH-KL | 16 | 30.0 | 33.9 | 250 | Post: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Wafer: PA 66, UL94V-0, gray | - | - | - | - | (LF)(SN) |
| SMT Header (Top Entry) | B2B-PH-SM4-TB | 2 | 2.0 | 7.95 | 1,000 | Post: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Wafer: PA, UL94V-0, natural (ivory) Solder tab: Brass, copper-undercoated, tin-plated (reflow treatment) | - | - | - | - | (LF)(SN) |
| SMT Header (Top Entry) | B16B-PH-SM4-TB | 16 | 30.0 | 35.95 | 1,000 | Post: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Wafer: PA, UL94V-0, natural (ivory) Solder tab: Brass, copper-undercoated, tin-plated (reflow treatment) | - | - | - | - | (LF)(SN) |
| SMT Header (Side Entry) | S2B-PH-SM4-TB | 2 | 2.0 | 7.9 | 1,000 | Post: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Wafer: PA, UL94V-0, natural (ivory) Solder tab: Brass, copper-undercoated, tin-plated (reflow treatment) | - | - | - | - | (LF)(SN) |
| SMT Header (Side Entry) | S15B-PH-SM4-TB | 15 | 28.0 | 33.9 | 1,000 | Post: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Wafer: PA, UL94V-0, natural (ivory) Solder tab: Brass, copper-undercoated, tin-plated (reflow treatment) | - | - | - | - | (LF)(SN) |
| Specification | Value |
| Pitch | 2.0mm |
| Current Rating | 2A AC, DC (AWG #24) |
| Voltage Rating | 100V AC, DC |
| Temperature Range | -25C to +85C |
| Contact Resistance | Initial: 10mmax. After environmental testing: 20mmax. |
| Insulation Resistance | 1,000Mmin. |
| Withstanding Voltage | 800V AC/ minute |
| Applicable PC board thickness | 0.8 to 1.6mm |
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Agent,Importer
Year Established:
2009
Employee Number:
<300
Ecer Certification：
Verified Supplier
Hefei Purple Horn E-Commerce Co., Ltd. is a professional company focus on integrated circuit ic business. Hefei Purple Horn E-Commerce Co., Ltd. will also responsible with exporting and logistic business. there is professional factory Beijing Silk Road which focus on desigining and manufacture. Fou... Hefei Purple Horn E-Commerce Co., Ltd. is a professional company focus on integrated circuit ic business. Hefei Purple Horn E-Commerce Co., Ltd. will also responsible with exporting and logistic business. there is professional factory Beijing Silk Road which focus on desigining and manufacture. Fou...
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