Shenzhen ECER Network Technology Co., Ltd.
| Number of Positions | - |
| Adaptation Package Type | - |
| Description | IC Sockets RoHS |
| Mfr. Part # | 2256-9357-0A-2401 |
| Model Number | 2256-9357-0A-2401 |
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Product Specification
| Number of Positions | - | Adaptation Package Type | - |
| Description | IC Sockets RoHS | Mfr. Part # | 2256-9357-0A-2401 |
| Model Number | 2256-9357-0A-2401 |
Product Overview
3M Textool BGA Test & Burn-In Sockets, with a 1.00 mm pitch, are designed for reliable testing and burn-in applications of Ball Grid Array (BGA) devices. These open-top sockets feature a double-beam, normally-closed contact design that provides balanced, opposing forces to the solder ball, minimizing shear stress and producing only slight indentations with minimal ball deformation. They offer excellent airflow around the device and include a retractable locating guide for easy board mounting, accommodating hundreds of leads. Compatible with most robotic handlers while allowing for easy manual operation, these sockets accept package body sizes up to 29 mm square with a maximum matrix of 27 x 27. They are RoHS compliant, ensuring adherence to environmental regulations.
Key Features:
| Specification | Details |
|---|---|
| Pitch | 1.00 mm |
| Types | 0, I, II, and III |
| Contact Plating | 30" (0.76 m) Gold over 50" (1.3 m) Nickel |
| Insulation Resistance | >1000M at 500 Vdc |
| Withstanding Voltage | 500 Vrms at sea level |
| Initial Contact Resistance | <50m (at 1.0 mA applied current) |
| Current Rating | 1.0 A max @ 25C |
| Operating Temperature Rating | -55C to +150C |
| Durability | 20,000 actuations (10,000 devices load/unload) at room temperature |
| Initial Contact Force (Nominal) | 17 gf (0.17N) for 0.6 mm diameter solder ball 14 gf (0.14N) for 0.5 mm diameter solder ball |
| Initial Actuation Force (Type II) | 5Kgf @ full pin count |
| Contact Wiper Gap (Fully Open) | 0.85 mm Nom |
| Max Package Size (Overall) | Up to 29 mm square |
| Max Matrix (Overall) | 27 x 27 |
| Type 0 Package Specifications | |
| Max Package Size | 19.0 mm 0.1 mm SQ Max |
| Max Matrix | 17 17 |
| Ball Diameter | 0.40 mm - 0.70 mm |
| Ball Height | 0.40 mm Min |
| Type I Package Specifications | |
| Max Package Size | 29 mm 0.1 mm SQ Max |
| Max Matrix | 27 27 |
| Ball Diameter | 0.40 mm - 0.70 mm |
| Ball Height | 0.40 mm Min |
| Type II Package Specifications | |
| Max Package Size | 40.0 mm 0.1 mm SQ Max |
| Max Matrix | 39 39 |
| Ball Diameter | 0.40 mm - 0.70 mm |
| Ball Height | 0.40 mm Min |
| Type III Package Specifications | |
| Max Package Size | 47.5 mm 0.1 mm SQ Max |
| Max Matrix | 45 45 |
| Ball Diameter | 0.50 mm - 0.70 mm |
| Ball Height | 0.40 mm Min |
| PCB Recommendations (All Types) | |
| Board Thickness | 1.6 mm |
| Through Hole Diameter | 0.35 mm Min |
Contact Information:
For technical, sales, or ordering information call 800-225-5373 or visit http://www.3M.com/interconnects/.
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Agent,Importer
Year Established:
2009
Total Annual:
10000000-50000000
Employee Number:
300~500
Ecer Certification：
Verified Supplier
Your Trusted Source for Integrated Circuit Shenzhen ECER Network Technology Co., Ltd. is a professional company focus on integrated circuit ic business. ECER connects buyers worldwide with verified manufacturers across 40+ industries. Every component sourced with precision, quality, and reliability... Your Trusted Source for Integrated Circuit Shenzhen ECER Network Technology Co., Ltd. is a professional company focus on integrated circuit ic business. ECER connects buyers worldwide with verified manufacturers across 40+ industries. Every component sourced with precision, quality, and reliability...
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