| Description | Headers, Receptacles, Female Sockets RoHS |
| Mfr. Part # | MTB1-7SL86 |
| Model Number | MTB1-7SL86 |
View Detail Information
Explore similar products
Boardmount socket 3M 929850-01-18-10 with glass filled polyester insulator and
wave soldering 3M 929850-01-29-RA boardmount socket with solder standoffs and
Double Row Pin Header Surface Mount SMT Termination HCTL PM127-2-04-S-4.3
Durable SMT Header 2.0 by 4.3 Millimeter Dual Row Connector HDGC HDGCPH2.0-PMS
Product Specification
| Description | Headers, Receptacles, Female Sockets RoHS | Mfr. Part # | MTB1-7SL86 |
| Model Number | MTB1-7SL86 |
ITT Cannon's Microminiature Connectors are designed for high-performance applications requiring extremely small, lightweight, and reliable interconnects. These connectors utilize the proven Cannon Twist Pin Contact System, offering higher density contact configurations than traditional rectangular solutions without sacrificing quality or performance. They are ideal for harsh environments and applications demanding durability, shock, and vibration resistance. Key benefits include an ultra-small, lightweight, and high-performance form factor, exceptional bandwidth performance, and unique mechanical engagement and locking mechanisms. They are suitable for markets and applications such as automated space vehicles, oil & gas exploration, aerospace, defense, industrial, and transportation.
| Product Line | Key Features/Applications | Contact Material | Current Rating | Durability | Operating Temperatures | Shell Material |
|---|---|---|---|---|---|---|
| MDM Micro-D (MIL-DTL-83513) | High density, lightweight, field-proven twist pin contact design. Available in 8 shell sizes (9-100 contacts). | Gold plated copper alloy | 3A max. | 500 mating cycles | -55C to +150C (Standard) | Aluminum |
| MDLM Micro-D Metal Shell, Low Profile | Thinner, lower profile design package for harsh environments. | Gold plated copper alloy | 3A max. | 500 mating cycles | -55C to +125C | Aluminum |
| MDM F222 High Temp Micro | Tested to withstand 200C continuous operating temperature for 500 hours. Suitable for Oil and Gas exploration. | Gold plated copper alloy | 3A max. | 500 mating cycles | -55C to +200C | Aluminum |
| MDM F300 Ultra-High Temp Micro | Tested to withstand 230C continuous operating temperature for 500 hours. Suitable for Oil and Gas exploration. | Gold plated copper alloy | 3A max. | 500 mating cycles | -55C to +230C | Stainless Steel |
| MDMH Hermetic Micro | Hermetically-sealed for applications requiring vacuum or controlled pressure. Compression glass seal. | Gold plated copper alloy | 3A max. | N/A | N/A | Mild steel, tin-lead plated |
| TMDM Filter Micro | Transverse monolith filters for noise reduction and EMI/RFI/EMP shielding. Environmentally sealed. | Gold plated copper alloy | 3A max. | N/A | N/A | Aluminum alloy |
| MD* Plastic Micro-D | Highly reliable, extremely small, lightweight plastic connectors. Available in two insulator materials. | Gold plated copper alloy | 3A max. | N/A | N/A | Plastic (Thermoset or Thermoplastic) |
| MDB Coaxial Micro | Features two coaxial and five MicroPin/Micro-Socket contacts. Accommodates RG-178/U cables. | Gold plated copper alloy | 3A max. | N/A | N/A | Plastic |
| MJS Micro Center Jackscrew | Reliable interconnect for board-to-board, board-to-cable applications. Up to 76 contacts. | Gold plated copper alloy | N/A | N/A | N/A | Plastic (Diallyl phthalate, Polyester, Polyetherimide, Polyphenylene sulfide) |
| MIK Microminiature Circular | Rugged, lightweight, meets MIL-DTL-83513 requirements. Up to 55 contacts. | Gold plated copper alloy | 3 Amps max. | 500 cycles min. | -55C to +125C | Thermoplastic (plastic shell) or Stainless Steel (metal shell) |
| MIKM Microminiature Circular | Steel shell for improved ruggedness and RFI resistance. Up to 55 contacts. | Gold plated copper alloy | 3 Amps max. | N/A | -55C to +125C | Stainless Steel |
| MIKQ Microminiature Circular | Quick disconnect metal shell. Push/Pull coupling. | Gold plated copper alloy | 3 Amps max. | N/A | -55C to +125C | Brass |
| MT Microstrips | Extremely dense and reliable interconnection solution in a minimum profile package. .050 contact spacing. | Gold plated copper alloy | 3 Amps max. | 500 cycles min. | -55C to +150C | N/A (Insulator: Polyester or Diallyl phthalate) |
| MEB Micro Edgeboard | Machined aluminum shells, diallyl phthalate insulator. 36-position polarization key system. | Gold plated copper alloy | N/A | N/A | N/A | Aluminum Alloy |
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Agent,Importer
Year Established:
2009
Total Annual:
10000000-50000000
Employee Number:
300~500
Ecer Certification:
Verified Supplier
Your Trusted Source for Integrated Circuit Shenzhen ECER Network Technology Co., Ltd. is a professional company focus on integrated circuit ic business. ECER connects buyers worldwide with verified manufacturers across 40+ industries. Every component sourced with precision, quality, and reliability... Your Trusted Source for Integrated Circuit Shenzhen ECER Network Technology Co., Ltd. is a professional company focus on integrated circuit ic business. ECER connects buyers worldwide with verified manufacturers across 40+ industries. Every component sourced with precision, quality, and reliability...
Get in touch with us
Leave a Message, we will call you back quickly!