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The 1.25 Ultra-Thin Series Connector is designed for reliable electrical connections in various applications. This series offers a compact and ultra-thin profile, making it suitable for space-constrained designs. It features robust materials and precise engineering to ensure consistent performance, including excellent contact resistance, high dielectric strength, and secure terminal retention. The connectors are built to withstand environmental challenges such as temperature fluctuations, humidity, and vibration, making them ideal for demanding industrial and electronic environments.
Product Attributes
Product Series: 1.25 Ultra-Thin Series Connector
Brand: Kinghelm ()
Website: www.kinghelm.com
Model/Part Number Reference: KH-A12501-09Y
Housing Material: PBT, UL94V-0, White
Wafer Material: PA9T, UL94V-0, Beige
Terminal Material: Phosphor Bronze
Contact Material: Phosphor Bronze
Environmental Protection: RoHS2.0
Technical Specifications
Specification
Details
Scope
1.25 Ultra-thin series connector specifications
Appearance
Product surface without defects, dirt, cracks, or mechanical damage. Contacts without rust, plating not oxidized or peeled.
Dimensions
According to drawings
Material & Surface Treatment
Terminal: Phosphor Bronze (0.15mm thick), Tin Plating (2.5-5m)
Solder Resistance (SMT Reflow): Refer to Section 9.1 temperature curve (Soldering Time: 5-10 sec, Temp: 2555)
Insertion/Withdrawal Force (Section 8)
No. of CTK PIN
Initial I.F (N Max)
Initial W.F (N Min)
30th I.F (N Max)
30th W.F (N Min)
2
4.5
0.4
2.4
0.3
3
6.5
0.6
2.6
0.5
4
9
0.8
2.8
0.6
5
11
1.0
3.0
0.8
6
13
1.2
3.2
0.9
7
15.5
1.4
3.4
1.1
8
17.5
1.6
3.6
1.2
9
20
1.8
3.8
1.5
10
22
2.0
4.0
1.5
11
24
2.2
4.2
1.7
12
26.5
2.4
4.4
1.8
13
28.5
2.6
4.6
2.0
14
31
2.8
4.8
2.1
15
33
3.0
5.0
2.3
16
35
3.2
5.2
2.4
17
37
3.4
5.4
2.6
18
39
3.6
5.6
2.7
19
41
3.8
5.8
2.9
20
44
4.0
6.0
3.0
SMT Lead-free Process Temperature Curve (Section 9)
Refer to provided temperature curve. Note: Reflow soldering conditions may vary based on soldering devices, P.C. boards, etc. Pre-check with own equipment is recommended.
Caution (Section 10)
Plastic components are hygroscopic. After opening the package, avoid exposure to environments with temperatures > 30 and humidity > 60% RH. Use all components within 24 hours after opening to prevent foaming and deformation during reflow or wave soldering processes.
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Shenzhen ECER Network Technology Co., Ltd. is a professional company focus on integrated circuit ic business. ECER connects buyers worldwide with verified manufacturers across 40+ industries. Every component sourced with precision, quality, and reliability... Your Trusted Source for Integrated Circuit
Shenzhen ECER Network Technology Co., Ltd. is a professional company focus on integrated circuit ic business. ECER connects buyers worldwide with verified manufacturers across 40+ industries. Every component sourced with precision, quality, and reliability...
