| Description | Arrays, Edge Type, Mezzanine (Board to Board) RoHS |
| Mfr. Part # | 7000049941 |
| Model Number | 7000049941 |
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Product Specification
| Description | Arrays, Edge Type, Mezzanine (Board to Board) RoHS | Mfr. Part # | 7000049941 |
| Model Number | 7000049941 |
The 3M MetPak HSHM Press-Fit Socket, 2 mm Type B22, is a high-speed interconnect solution designed for demanding applications. Featuring 110 signal contacts arranged in 5 rows, this right-angle socket supports data rates up to 5 Gb/s with low crosstalk at high frequencies. Its modular and scalable format, compliant with IEC 61076-4-101, offers 63 mated lines per linear inch. The dual-beam contact construction ensures high reliability, and it is end-to-end stackable with other 5-row 3M MetPak sockets. This socket is designed for press-fit installation, providing a robust connection for various electronic systems.
| Specification | Details |
|---|---|
| Data Rates | Up to 5 Gb/s |
| Impedance | 50/100 (single-ended/differential) |
| Mated Lines per Linear Inch | 63 |
| Contact Construction | Dual beam |
| Stackability | End-to-end stackable with 5 row 3M MetPak CP2, HM, and HSHM sockets |
| Mating Compatibility | Mates with 5 row 3M MetPak CP2, HM, and HSHM headers |
| Insulation Material | High Temperature Thermoplastic (LCP) |
| Insulation Color | (Not specified) |
| Contact Material | Copper Alloy |
| Normal Force (Nominal) | 0.57 N [58 g] Signal, 0.74 N [75 g] Shield |
| Engagement Force (Nominal) | 0.32 N [33 g] Signal, 0.22 N [22 g] Shield |
| Separation Force (Nominal) | 0.20 N [20 g] Signal, 0.20 N [20 g] Shield |
| Wipe (Nominal, Shortest Contact) | 2.67 mm [0.105 in] Signal, 1.57 mm [0.062 in] Shield |
| Mate/Unmate Cycles | 250 |
| Application Suitability | Not suitable for stand-alone use |
| Characteristic Impedance | 50 Single-ended, 100 Differential |
| Current Rating (Fully Loaded) | 1 A @ 70 C |
| Insulation Resistance | 104 M @ 100 VDC |
| Withstanding Voltage | 750 VRMS |
| Temperature Rating | -55 C to 125 C |
| High Speed Option Codes | 1 = Row differential applications 3 = 6th Row and +2 Row Grounding Applications 4 = Coaxial and column differential applications |
| Plating (TG30) | 0.76 [30] m Min. Au Contact Area, 2.54 [100] m Min. SnPb Terminal Area, 1.27 [50] m Min. Ni All over |
| Plating (TG30L) | 0.76 [30] m Min. Au Contact Area (Lubricated), 2.54 [100] m Min. SnPb Terminal Area, 1.27 [50] m Min. Ni All over |
| Plating (TG50) | 1.27 [50] m Min. Au Contact Area (Lubricated), 2.54 [100] m Min. SnPb Terminal Area, 1.27 [50] m Min. Ni All over |
| PCB Hole Diameter (Finished) | 0.457 - 0.559 mm [0.0180 - 0.0220 in] |
| PCB Cu. Thickness | 0.025 - 0.045 mm [0.0010 - 0.0018 in] |
| PCB SnPb Thickness | 0.008 - 0.018 mm [0.0003 - 0.0007 in] |
| PCB Drilled Hole Diameter | 0.584 - 0.625 mm [0.0230 - 0.0246 in] |
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Agent,Importer
Year Established:
2009
Total Annual:
10000000-50000000
Employee Number:
300~500
Ecer Certification:
Verified Supplier
Your Trusted Source for Integrated Circuit Shenzhen ECER Network Technology Co., Ltd. is a professional company focus on integrated circuit ic business. ECER connects buyers worldwide with verified manufacturers across 40+ industries. Every component sourced with precision, quality, and reliability... Your Trusted Source for Integrated Circuit Shenzhen ECER Network Technology Co., Ltd. is a professional company focus on integrated circuit ic business. ECER connects buyers worldwide with verified manufacturers across 40+ industries. Every component sourced with precision, quality, and reliability...
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