| Y-Width of Bottom Edge on Board | 3.7mm |
| Flame Retardant Rating | UL94V-0 |
| Pins Structure | 1x2P |
| Contact Plating | 锡 |
| Contact Material | 铜合金;PA |
| Pitch | 1.25mm |
| Voltage Rating (Max) | 125V |
| Number of PINs Per Row | 2 |
| Number of Rows | 1 |
| X-Length of Bottom Edge on Board (Spacing Line) | 7.25mm |
| Z-Height of the Board | 5.3mm |
| Operating Temperature | -40℃~+85℃ |
| Mounting Type | 立贴 |
| Description | Connector Header 2 position 1.25mm Pitch 1A Surface Mount,Vertical -40℃~+85℃ |
| Mfr. Part # | 1WF03-216002-00002 |
| Package | SMD,P=1.25mm |
| Model Number | 1WF03-216002-00002 |
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Product Specification
| Y-Width of Bottom Edge on Board | 3.7mm | Flame Retardant Rating | UL94V-0 |
| Pins Structure | 1x2P | Contact Plating | 锡 |
| Contact Material | 铜合金;PA | Pitch | 1.25mm |
| Voltage Rating (Max) | 125V | Number of PINs Per Row | 2 |
| Number of Rows | 1 | X-Length of Bottom Edge on Board (Spacing Line) | 7.25mm |
| Z-Height of the Board | 5.3mm | Operating Temperature | -40℃~+85℃ |
| Mounting Type | 立贴 | Description | Connector Header 2 position 1.25mm Pitch 1A Surface Mount,Vertical -40℃~+85℃ |
| Mfr. Part # | 1WF03-216002-00002 | Package | SMD,P=1.25mm |
| Model Number | 1WF03-216002-00002 |
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Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Agent,Importer
Year Established:
2009
Total Annual:
10000000-50000000
Employee Number:
300~500
Ecer Certification:
Verified Supplier
Your Trusted Source for Integrated Circuit Shenzhen ECER Network Technology Co., Ltd. is a professional company focus on integrated circuit ic business. ECER connects buyers worldwide with verified manufacturers across 40+ industries. Every component sourced with precision, quality, and reliability... Your Trusted Source for Integrated Circuit Shenzhen ECER Network Technology Co., Ltd. is a professional company focus on integrated circuit ic business. ECER connects buyers worldwide with verified manufacturers across 40+ industries. Every component sourced with precision, quality, and reliability...
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