Shenzhen ECER Network Technology Co., Ltd.
| Flame Retardant Rating | UL94V-0 |
| Number of Rows | 1 |
| Mounting Type | 立贴 |
| Pitch | 1mm |
| Number of PINs | 8P |
| Operating Temperature | -40℃~+85℃ |
| Contact Material | 铜合金 |
| Color | 黑色 |
| Current Rating | 1A |
| Contact Plating | 锡 |
| Voltage Rating (Max) | 50V |
| Description | Connector Header 1mm Pitch 1A Surface Mount,Vertical -40℃~+105℃ |
| Mfr. Part # | 2367197-8 |
| Package | SMD,P=1mm |
| Model Number | 2367197-8 |
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Product Specification
| Flame Retardant Rating | UL94V-0 | Number of Rows | 1 |
| Mounting Type | 立贴 | Pitch | 1mm |
| Number of PINs | 8P | Operating Temperature | -40℃~+85℃ |
| Contact Material | 铜合金 | Color | 黑色 |
| Current Rating | 1A | Contact Plating | 锡 |
| Voltage Rating (Max) | 50V | Description | Connector Header 1mm Pitch 1A Surface Mount,Vertical -40℃~+105℃ |
| Mfr. Part # | 2367197-8 | Package | SMD,P=1mm |
| Model Number | 2367197-8 |
The TE Connectivity 1.0mm Pitch Wire to Board Connector with Latch is designed for reliable wire-to-board connections. This low-profile connector series offers a secure latching mechanism and is suitable for applications requiring compact and robust interconnect solutions. It is engineered to meet stringent electrical, mechanical, and environmental performance requirements, making it ideal for various industrial and electronic applications.
| Product Part No. | Description | Pitch | Configuration | Working Voltage (per pin) | Voltage (AC, per pin) | Current Rating (AWG #28, per pin) | Operating Temperature | Applicable Wire Size | Recommended Insulation Diameter |
|---|---|---|---|---|---|---|---|---|---|
| *-2367196-* | Board side of Wire to Board Connector with Latch | 1.0mm | Right Angle | < 36 Volts | 50 Volts | 1 Ampere | -40 to +85 | AWG #28 | UL 3302 and equivalent |
| *-2367197-* | Board side of Vertical Wire to Board Connector with Latch | 1.0mm | Vertical | < 36 Volts | 50 Volts | 1 Ampere | -40 to +85 | AWG #28 | UL 3302 and equivalent |
| *-2367198-* | Cable end housing of Wire to Board Connector with Latch | 1.0mm | N/A | N/A | N/A | N/A | N/A | N/A | N/A |
| *-2367199-* | Cable end contact of Wire to Board Connector with Latch | 1.0mm | N/A | N/A | N/A | N/A | N/A | N/A | N/A |
| Performance Requirements: | |||||||||
| Electrical: | |||||||||
| Termination Resistance (Initial) | 10 m Max. | ||||||||
| Termination Resistance (Final) | R 20 m Max. | ||||||||
| Dielectric Withstanding Voltage | 250V AC for 1 minute (1mA Max. leakage) | ||||||||
| Insulation Resistance | 100 M Min. (500VDC for 1 minute) | ||||||||
| Temperature Rising | 30 Max. | ||||||||
| Mechanical: | |||||||||
| Connector Mating/Unmating Force | Refer to Item 5 (Operation Speed: 25.4 3 mm/minute) | ||||||||
| Durability (Repeated Mate/Unmating) | 30 cycles (25.4 3 mm/min) | ||||||||
| Contact Retention Force (Board Side) | 0.40 Kgf Min. (Operation Speed: 25.4 3 mm/minute) | ||||||||
| Crimping Terminal / Housing Retention Force (Cable Side) | 0.7 Kgf MIN. (Speed rate: 25.4 3 mm/minute) | ||||||||
| Crimping Pull Out Force (AWG #28) | 1.0 Kgf Min. (Operation Speed: 25.4 3 mm/minute) | ||||||||
| Vibration (Low Frequency) | No electrical discontinuity > 1 sec. (10-55 Hz, 0.76mm amplitude, 2 hours per direction) | ||||||||
| Physical Shock | No electrical discontinuity > 1 sec. (50 G's peak, 11ms duration, 3 shocks per axis) | ||||||||
| Environmental: | |||||||||
| Resistance to Wave Soldering Heat (Board Side) | Refer to Product Qualification and Test Sequence Group 10 (Lead Free) | ||||||||
| Resistance to Reflow Soldering Heat (Board Side) | Refer to Product Qualification and Test Sequence Group 10 (Lead Free) | ||||||||
| Thermal Shock | Refer to Product Qualification and Test Sequence Group 4 | ||||||||
| Humidity, Steady State | Refer to Product Qualification and Test Sequence Group 4 (40, 90-95% RH, 96 hours) | ||||||||
| Temperature Life | Refer to Product Qualification and Test Sequence Group 5 (85 for 96 hours) | ||||||||
| Salt Spray (Only For Gold Plating) | Refer to Product Qualification and Test Sequence Group (8-96 hours depending on plating thickness) | ||||||||
| Solder ability (Board Side) | Tin plating: Min. 95% coverage; Gold plating: Min. 75% coverage (245 5, 4-5 sec.) | ||||||||
| Hand Soldering Temperature Resistance (Board Side) | Appearance: No damage (T350 , 3 sec.) | ||||||||
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Agent,Importer
Year Established:
2009
Total Annual:
10000000-50000000
Employee Number:
300~500
Ecer Certification：
Verified Supplier
Your Trusted Source for Integrated Circuit Shenzhen ECER Network Technology Co., Ltd. is a professional company focus on integrated circuit ic business. ECER connects buyers worldwide with verified manufacturers across 40+ industries. Every component sourced with precision, quality, and reliability... Your Trusted Source for Integrated Circuit Shenzhen ECER Network Technology Co., Ltd. is a professional company focus on integrated circuit ic business. ECER connects buyers worldwide with verified manufacturers across 40+ industries. Every component sourced with precision, quality, and reliability...
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