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USB AF 1:1 (USB-HXS-114DIP) is a dual-layer USB connector designed for specific mounting requirements. It features a black thermoplastic housing and gold-plated contacts in the mating area for reliable performance.
Product Attributes
Brand: (Huade co-create)
Origin: (Shenzhen)
Housing Material: High Temperature Thermoplastics
Contact Material: Copper Alloy C2680
Shell Material: SPCC Tin Plating
Color: Black
Technical Specifications
Specification
Value
Product Name
USB AF 1:1
Part Number
USB-HXS-114DIP
Current Rating
1.5A/contact terminal
Voltage Rating
30V DC
Contact Resistance
30 milliohms MAX
Dielectric Withstanding Voltage
500 V AC AT Sea Level
Insulation Resistance
1000 MEGA ohms MIN
Plating (Contact)
Gold in Mating Area; Nickel Plating on Solder Tails
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Shenzhen ECER Network Technology Co., Ltd. is a professional company focus on integrated circuit ic business. ECER connects buyers worldwide with verified manufacturers across 40+ industries. Every component sourced with precision, quality, and reliability... Your Trusted Source for Integrated Circuit
Shenzhen ECER Network Technology Co., Ltd. is a professional company focus on integrated circuit ic business. ECER connects buyers worldwide with verified manufacturers across 40+ industries. Every component sourced with precision, quality, and reliability...