Shenzhen ECER Network Technology Co., Ltd.
| Card Connection Mode | Push-Pull |
| Packaging Details | SMD |
| Description | Micro SD card (TF card) Connector and Ejector Push-Pull Surface Mount |
| Stock | 5000 |
| Height Above Board | 1.2mm |
| Connector Type | Connector and Ejector |
| Card Type | MicroSD Card (TF Card) |
| Delivery Time | 12-17 working days |
| Operating Temperature | -25℃~+85℃ |
| Model Number | TF-129-ARP8 |
| Brand Name | TF-129-ARP8 |
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Product Specification
| Card Connection Mode | Push-Pull | Packaging Details | SMD |
| Description | Micro SD card (TF card) Connector and Ejector Push-Pull Surface Mount | Stock | 5000 |
| Height Above Board | 1.2mm | Connector Type | Connector and Ejector |
| Card Type | MicroSD Card (TF Card) | Delivery Time | 12-17 working days |
| Operating Temperature | -25℃~+85℃ | Model Number | TF-129-ARP8 |
| Brand Name | TF-129-ARP8 |
This document details the specifications and layout for a Micro-50 1.15H connector, designed for various electronic applications. It emphasizes ROHS compliance and provides detailed technical data for manufacturing and integration.
| Pin | Label | Dimension (mm) | Description |
|---|---|---|---|
| P1 | DAT2 | 2.40 | Data 2 |
| P2 | CD/DAT3 | 2-1.70 | Card Detect / Data 3 |
| P3 | CMD | 1.65 | Command |
| P4 | VDD | 1.25 | Power Supply |
| P5 | CLK | 6.05 | Clock |
| P6 | VSS | 2.15 | Ground |
| P7 | DAT0 | 4.80 | Data 0 |
| P8 | DAT1 | 2.15 | Data 1 |
| P9 | GND | - | Ground |
| P10 | GND | - | Ground |
| P11 | GND | - | Ground |
| P12 | GND | - | Ground |
| P13 | GND | - | Ground |
| P14 | GND | - | Ground |
| P15 | - | - | - |
| Item | Specification |
|---|---|
| Material - Housing | High Temperature Thermoplastic (LCP MG350), Color Black, UL 94V-0 |
| Material - Contact | Phosphor Bronze (C5210R-SH), T=0.12mm |
| Material - Cover | SUS304-H, T=0.10mm |
| Contact Terminal Plating - Contact Area | Gold 1 Min. |
| Contact Terminal Plating - Solder Area | Plated Sn 80min. |
| Contact Terminal Plating - Underplating | Ni overall 50 Min. |
| Cover Plating - Underplating | Ni overall 50 Min. |
| Cover Plating - Solder Area | Gold 0.8 Min. |
| Contact Current Rating | 0.5 Amperes |
| Dielectric Withstanding Voltage | AC500V r.m.s. |
| Insulation Resistance | 1000 Megohms Minimum at DC 500V |
| Contact Resistance | 100 m Maximum |
| Mating Cycles | 10,000 Cycles |
| Operating Temperature | -25C to +85C |
| General Tolerance | 0.05 mm |
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Agent,Importer
Year Established:
2009
Total Annual:
10000000-50000000
Employee Number:
300~500
Ecer Certification：
Verified Supplier
Your Trusted Source for Integrated Circuit Shenzhen ECER Network Technology Co., Ltd. is a professional company focus on integrated circuit ic business. ECER connects buyers worldwide with verified manufacturers across 40+ industries. Every component sourced with precision, quality, and reliability... Your Trusted Source for Integrated Circuit Shenzhen ECER Network Technology Co., Ltd. is a professional company focus on integrated circuit ic business. ECER connects buyers worldwide with verified manufacturers across 40+ industries. Every component sourced with precision, quality, and reliability...
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