Shenzhen ECER Network Technology Co., Ltd.
| Description | -20℃~+70℃ Push-Push 2mm Connector and Ejector MicroSD Card (TF Card) SMD PC Card Sockets RoHS |
| Delivery Time | 1工作日 |
| Card Detection | Yes |
| Card Type | MicroSD Card (TF Card) |
| Card Connection Mode | Push-Push |
| Connector Type | Connector and Ejector |
| Packaging Details | SMD |
| Operating Temperature | -20℃~+70℃ |
| Height Above Board | 2mm |
| Stock | 1237 |
| Rated Voltage (Max) | 5V |
| Model Number | HX TF PUSH |
| Brand Name | HX TF PUSH |
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Product Specification
| Description | -20℃~+70℃ Push-Push 2mm Connector and Ejector MicroSD Card (TF Card) SMD PC Card Sockets RoHS | Delivery Time | 1工作日 |
| Card Detection | Yes | Card Type | MicroSD Card (TF Card) |
| Card Connection Mode | Push-Push | Connector Type | Connector and Ejector |
| Packaging Details | SMD | Operating Temperature | -20℃~+70℃ |
| Height Above Board | 2mm | Stock | 1237 |
| Rated Voltage (Max) | 5V | Model Number | HX TF PUSH |
| Brand Name | HX TF PUSH |
This product specification defines the product performance and the test methods to ascertain the performance of the T-FLASH card holder, which is designed and manufactured by Shenzhen Hanxia Electronic Co., Ltd. This product specification defines the characteristics and test methods of the T-FLASH card connector products designed and produced by our company.
| Item | Requirements | Test Methods |
|---|---|---|
| 1. Confirmation of Product | ||
| 2. Contact resistance (Low Level) | 100 m Max. initial | Subject mated contacts assembled in housing to closed circuit of 10 mA max. at open circuit voltage of 20 mV max. |
| 3. Insulation resistance | 1000 M Min. | Measure by applying test potential between the adjacent contacts, and between the contacts and ground in the mated connector. MIL-STD-202, Method 302, Condition B (500 V DC10%). |
| 4. Dielectric Strength | Connector must withstand test potential of 500 V AC for 1 minute. Current leakage must be 1.0 mA max. | Measure by applying test potential between the adjacent contacts, and between the contacts and ground in the mated connector. MIL-STD-202, Method 301. |
| 5. Durability (Repeated Mating/Unmating) | Contact Resistance: 100 m Max. after testing | Mate and unmate connector for 5000 cycle. |
| 6. Temperature rise | 30C Max. | Carry rated current load. 0.3A per contact. (UL498) |
| 7. Vibration Sinusoidal Low Frequency | No electrical discontinuity greater then 1 sec (s) shall occur. Contact resistance: 100 m max. | Subject mated connector to 10-55-10 Hz traversed in 1 minute at 1.5 mm amplitude 2 hours each of 3 mutually perpendicular plane, 10 mA applied MIL-STD-202, Method 201. |
| 8. Shock | No electrical discontinuity greater than 1 sec. shall occur. No damage to product. | Applying an appropriate holder is allowed in vibration test and shock test. MIL-STD-202, Method 213, 490m/s2, 3 axes. |
| 9. Thermal shock | No damage, Contact Resistance (Low Level) (Final) 100 m max. | Temperature range from -55C to +85C. Start from -55C. After 30 min. change to +85C, change time is no more than 30 seconds. Total 5 cycles. MIL-STD-202, Method 107D, condition A. |
| 10. Humidity | No damage, Contact Resistance (Low Level) (Final) 100 m max.. Dielectric Strength should be OK, Insulation Resistance should be 100 M min. | Temperature :402C 96 hours. Relative humidity: 90-95%; Duration: 96 Hours. MIL-STD-202, Method 103. |
| 11. Solderability | Appearance of the specimen shall be inspected after the test with the assistance of a magnifier capable of giving a magnification of 10 X for any damage such as pinholes, void or rough surface. | Soldering time: 3 to 5 Seconds Temperature: 2555C. |
| 12. Resistance to soldering heat | No damage | Leave subject product in the 2555C chamber for 2 minutes. |
| 13. Salt Spray | Contact Resistance (Low Level) (Final) 100 m max. | 51% salt concentration 244 hours 35 2C MIL-STD-202, Method 101 Condition B. |
| 14. High temperature | Contact resistance: 100 m max. | Subject product to 852C for 96 hours continuously. MIL-STD-202, Method 108. |
| Parameter | Reference Specification |
|---|---|
| Average temperature gradient in preheating | 2.5C/s |
| Soak time tsoak | 2-3 minutes |
| Time above 217C t1 | 60 s |
| Time above 230C t2 | 50 s |
| Time above 255C t3 | 5 s |
| Peak temperature in reflow Tpeak | 255C (+5/-0C) |
| Temperature gradient in cooling | Max -5C/s |
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Agent,Importer
Year Established:
2009
Total Annual:
10000000-50000000
Employee Number:
300~500
Ecer Certification：
Verified Supplier
Your Trusted Source for Integrated Circuit Shenzhen ECER Network Technology Co., Ltd. is a professional company focus on integrated circuit ic business. ECER connects buyers worldwide with verified manufacturers across 40+ industries. Every component sourced with precision, quality, and reliability... Your Trusted Source for Integrated Circuit Shenzhen ECER Network Technology Co., Ltd. is a professional company focus on integrated circuit ic business. ECER connects buyers worldwide with verified manufacturers across 40+ industries. Every component sourced with precision, quality, and reliability...
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