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This product is a silver-plated socket contact made of copper alloy, designed for crimp termination to wire and cable. It is suitable for power and signal applications and is compatible with 18 AWG or 0.75 mm wire sizes. The contact features a bright finish on the mating area and is part of the HDC HE series.
Product Attributes
Brand: TE Connectivity
Contact Type: Socket
Plating Material (Termination Area): Silver
Plating Material (Mating Area): Silver
Base Material: Copper Alloy
Wire Type: Solid or Stranded
Sealable: No
Circuit Application: Power & Signal
Series: HDC HE
Status: ACTIVE
Technical Specifications
TE Internal #
Part #
Wire Size
Contact Current Rating (Max)
Termination Method
Contact Base Material
Contact Mating Area Plating Material
Contact Termination Area Plating Material
T2030002010-000
T2030002010-000
.75 mm
16 A
Crimp
Copper Alloy
Silver
Silver
Product Compliance
EU RoHS Directive: 2011/65/EU Compliant with Exemptions
EU ELV Directive: 2000/53/EC Compliant with Exemptions
China RoHS Directive: MIIT Order No 32, 2016 Restricted Materials Above Threshold
EU REACH Regulation (EC) No. 1907/2006: Current ECHA Candidate List: JUNE 2023 (235). Candidate List Declared Against: JUNE 2023 (235). SVHC > Threshold: Pb (3.7% in Component Part).
Halogen Content: Low Halogen - Br, Cl, F, I < 900 ppm per homogenous material. Also BFR/CFR/PVC Free.
Solder Process Capability: Not reviewed for solder process capability.
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Shenzhen ECER Network Technology Co., Ltd. is a professional company focus on integrated circuit ic business. ECER connects buyers worldwide with verified manufacturers across 40+ industries. Every component sourced with precision, quality, and reliability...