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China factory - Shenzhen ECER Network Technology Co., Ltd.

Shenzhen ECER Network Technology Co., Ltd.

  • China,Shenzhen ,Anhui
  • Verified Supplier

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China Amphenol 10124632-0030001LF
China Amphenol 10124632-0030001LF

  1. China Amphenol 10124632-0030001LF

Amphenol 10124632-0030001LF

  1. MOQ: 15
  2. Price:
  3. Get Latest Price
Delivery Time 9-11 working days
Description Through Hole Inline Module Sockets RoHS
Stock 562
Packaging Details Through Hole
Model Number 10124632-0030001LF
Brand Name Amphenol

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  1. Product Details
  2. Company Details

Product Specification

Delivery Time 9-11 working days Description Through Hole Inline Module Sockets RoHS
Stock 562 Packaging Details Through Hole
Model Number 10124632-0030001LF Brand Name Amphenol

Product Overview

FCI's Vertical DDR4 DIMM sockets offer 288 contacts on a 0.85mm pitch, designed to accommodate DDR4 memory modules conforming to JEDEC MO-309. These sockets are engineered for convenient memory expansion in servers, workstations, desktop PCs, and embedded applications within communications and industrial equipment. Featuring low-resistance contacts, they support Registered DIMMs (RDIMM) to reduce power consumption in datacenter hardware like servers, storage, and networking equipment. The low 2.4mm module seating plane and slim ejector designs optimize airflow. Available termination options include Surface-Mount (SMT), Plated-Through-Hole (PTH) solder, and Press-Fit (PF).

Product Attributes

  • Brand: FCI
  • Contact Material: Copper alloy
  • Contact Finish Options: 15in., 20in. or 30in. Gold, 30in. GXT, or Gold flash over nickel (Contact area); Tin over nickel (Termination area)
  • Forklock Material: Copper alloy
  • Housing Material: High temperature thermoplastic, UL94V-0
  • Ejector Material: High performance thermoplastic, UL94V-0
  • Certifications: UL and CSA approvals pending; RoHS-Compliant and lead-free process-compatible options available
  • Packaging: Tray

Technical Specifications

Specification Details
Product Type Vertical DDR4 DIMM Sockets
Contact Pitch 0.85mm
Number of Contacts 288
Module Standard JEDEC MO-309
Module Seating Plane 2.4mm
Insertion Force < 24 pounds force
Solder Tail Thickness Support 1.6mm or 2.4mm motherboards
Press-fit Termination Support 1.6mm min. host-PCBs
High-Speed Signaling Up to 3.2Gb/s for DDR4
Contact Resistance 10m initial, 10m increase after environmental test
Current Rating 0.75A/contact (De-rated) with 30 C temperature rise above ambient
Durability 25 cycles
Product Specification GS-12-1092
Packaging Specification GS-14-2267
JEDEC Module Outline MO-309
JEDEC Socket Outlines PTH solder: SO-016, Surface-mount: SO-017, Press-fit: SO-019
Part Reference (SMT) 10124677
Part Reference (PTH Solder) 10124632
Part Reference (Press-fit) 10124806
BWBDDR4MMS0613EA4 Part Number

Company Details

Bronze Gleitlager

,

Bronze Sleeve Bushings

 and 

Graphite Plugged Bushings

 from Quality China Factory
  • Business Type:

    Manufacturer,Distributor/Wholesaler,Agent,Importer

  • Year Established:

    2009

  • Total Annual:

    10000000-50000000

  • Employee Number:

    300~500

  • Ecer Certification:

    Verified Supplier

Your Trusted Source for Integrated Circuit Shenzhen ECER Network Technology Co., Ltd. is a professional company focus on integrated circuit ic business. ECER connects buyers worldwide with verified manufacturers across 40+ industries. Every component sourced with precision, quality, and reliability... Your Trusted Source for Integrated Circuit Shenzhen ECER Network Technology Co., Ltd. is a professional company focus on integrated circuit ic business. ECER connects buyers worldwide with verified manufacturers across 40+ industries. Every component sourced with precision, quality, and reliability...

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Get in touch with us

  • Reach Us
  • Shenzhen ECER Network Technology Co., Ltd.
  • Unit A2603, One Avenue (South Zone), Zhuoyue Meilin Center Plaza, No. 126 Zhongkang Road, Meidu Community, Meilin Subdistrict, Futian District, Shenzhen
  • https://www.connectoric.com/

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