SHENZHEN ECER NETWORK TECHNOLOGY CO.,LTD
Products
Manufacturer of a wide range of products which include I3-4100U SR16P Mobile Device Processors 3M Cache Up To 3.0GHz CORE I3 Series,5th Generation Intel Core I3 Mobile Processor I3-5015U SR245 3M Cache Up To 2,32GNAND+24GLPD3 FBGA...
MOQ: 1 piece
Price: Negotiation
| Payment Terms | T/T, PayPal, Western Union, Escrow and others |
| Supply Ability | 1000pcs |
| Delivery Time | 3-5 work days |
| Packaging Details | Tray, 10cm X 10cm X 5cm |
| Module Number | I3-4100U |
| Family | 4th Generation Core i3 Processors |
| CodeName | Products formerly Haswell |
| Market Segment | Mobile |
| Status | Launched |
| Launch Date | Q3'13 |
| Lithography | 22nm |
| Use Condition | Notebook |
| Model Number | I3-4100U SR16P |
| Certification | ORIGINAL PARTS |
MOQ: 1 piece
Price: Negotiation
| Payment Terms | T/T, PayPal, Western Union, Escrow and others |
| Supply Ability | 1000pcs |
| Delivery Time | 3-5 work days |
| Packaging Details | Tray, 10cm X 10cm X 5cm |
| Module Number | I3-5015U |
| Family | 5th Generation Core i3 Processors |
| CodeName | Products formerly Broadwell |
| Market Segment | Mobile |
| Status | Launched |
| Launch Date | Q1'15 |
| Lithography | 14nm |
| Use Condition | Notebook |
| Model Number | I3-5015U SR245 |
| Certification | ORIGINAL PARTS |
MOQ: 1 piece
Price: Negotiation
| Payment Terms | T/T, PayPal, Western Union, Escrow and others |
| Packaging Details | 10cm X 10cm X 5cm |
| Supply Ability | 500-2000pcs per month |
| Delivery Time | 3-5 work days |
| Part Numbe | H9TQ26ADFTACUR-KUM |
| Application | Mobile Phone |
| Product | eMCP |
| Density | 32GB |
| NAND Information | 32+24 eMCP-D3 |
| Package Type | 221 ball FBGA |
| Dissipation Power | 5W |
| Model Number | H9TQ26ADFTACUR-KUM |
| Certification | Original Parts |
MOQ: 1 piece
Price: Negotiation
| Payment Terms | T/T, PayPal, Western Union, Escrow and others |
| Supply Ability | 6000pcs per month |
| Delivery Time | 3-5 work days |
| Packaging Details | 10cm X 10cm X 5cm |
| Part Numbe | KMRC1000BM-B809 |
| Specifications | LPDDR3-1866MHz |
| Product | eMCP-eMMC |
| Density | 64GB |
| NAND Information | 64+24 eMCP-D3 |
| Package Type | BGA221 |
| Use Condion | Microprocessors/Microcontrollers/Peripheral ICs |
| Model Number | KMRC1000BM-B809 |
| Certification | Original Parts |
MOQ: 1 piece
Price: Negotiation
| Payment Terms | T/T, PayPal, Western Union, Escrow and others |
| Supply Ability | 6000pcs per month |
| Delivery Time | 3-5 work days |
| Packaging Details | 10cm X 10cm X 5cm |
| Part Numbe | KMFN60012M-B214 |
| Specifications | LPDDR3-1866MHz |
| Product | eMCP-eMMC |
| Density | 8GB |
| NAND Information | 8+8 eMCP-D3 |
| Package Type | 221FBGA |
| Use Condion | Microprocessors/Microcontrollers/Peripheral ICs |
| Model Number | KMFN60012M-B214 |
| Certification | Original Parts |
MOQ: 1 piece
Price: Negotiation
| Payment Terms | T/T, PayPal, Western Union, Escrow and others |
| Supply Ability | 6000pcs per month |
| Delivery Time | 3-5 work days |
| Packaging Details | 10cm X 10cm X 5cm |
| Part Numbe | KMRV50014M-B809 |
| Specifications | LPDDR3-1866MHz |
| Product | eMCP-eMMC |
| Density | 128GB |
| NAND Information | 128+32eMCP-D3 |
| Package Type | 221FBGA |
| Use Condion | Microprocessors/Microcontrollers/Peripheral ICs |
| Model Number | KMRV50014M-B809 |
| Certification | Original Parts |
MOQ: 1 piece
Price: Negotiation
| Payment Terms | T/T, PayPal, Western Union, Escrow and others |
| Supply Ability | 6000pcs per month |
| Delivery Time | 3-5 work days |
| Packaging Details | 10cm X 10cm X 5cm |
| Part Numbe | KMGE6001BM-B421 |
| Specifications | LPDDR3-1866MHz |
| Product | eMCP-eMMC |
| Density | 16GB |
| NAND Information | 16+24 eMCP-D3 |
| Package Type | BGA221 |
| Use Condion | Microprocessors/Microcontrollers/Peripheral ICs |
| Model Number | KMGE6001BM-B421 |
| Certification | Original Parts |
MOQ: 1 piece
Price: Negotiation
| Payment Terms | T/T, PayPal, Western Union, Escrow and others |
| Supply Ability | 500-2000pcs per month |
| Delivery Time | 3-5 work days |
| Packaging Details | 10cm X 10cm X 5cm |
| Part Numbe | KMQE60013M-B318 |
| Specifications | LPDDR3-1866MHz |
| Product | eMCP-eMMC |
| Density | 32GB |
| NAND Information | 16+16 eMCP-D3 |
| Package Type | BGA221 |
| Use Condion | Microprocessors/Microcontrollers/Peripheral ICs |
| Model Number | KMQE60013M-B318 |
| Certification | Original Parts |
MOQ: 1 piece
Price: Negotiation
| Payment Terms | T/T, PayPal, Western Union, Escrow and others |
| Supply Ability | 6000pcs per month |
| Delivery Time | 3-5 work days |
| Packaging Details | 10cm X 10cm X 5cm |
| Part Numbe | KMR310008M-A611 |
| Product | eMCP-eMMC |
| Density | 16GB |
| NAND Information | 16+24 eMCP-D3 |
| Package Type | BGA221 |
| Use Condion | Microprocessors/Microcontrollers/Peripheral ICs |
| Model Number | KMR310008M-A611 |
| Certification | Original Parts |
MOQ: 1 piece
Price: Negotiation
| Payment Terms | T/T, PayPal, Western Union, Escrow and others |
| Supply Ability | 6000pcs per month |
| Delivery Time | 3-5 work days |
| Packaging Details | 10cm X 10cm X 5cm |
| Part Numbe | KMDD60018M-B320 |
| Specifications | LPDDR4x-3733MHz |
| Product | eMCP-eMMC |
| Density | 32GB |
| NAND Information | 32+24 eMCP-D3 |
| Package Type | BGA254 |
| Use Condion | Microprocessors/Microcontrollers/Peripheral ICs |
| Model Number | KMDD60018M-B320 |
| Certification | Original Parts |
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