| Payment Terms | T/T, PayPal, Western Union, Escrow and others |
| Supply Ability | 500pcs |
| Packaging Details | tray, 10cmX10cmX5cm |
| Processor No. | i3-4102E |
| Product Collection | 4th Generation Core i3 Processors |
| Code Name | Haswell |
| Vertical Segment | Embadded |
| Status | Launched |
| Launch Date | Q3'13 |
| Lithography | 22nm |
| Use Condition | Industrial Commercial Temp/Sever |
| Model Number | I3-4102E |
| Certification | ORIGINAL PARTS |
View Detail Information
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Product Specification
| Payment Terms | T/T, PayPal, Western Union, Escrow and others | Supply Ability | 500pcs |
| Packaging Details | tray, 10cmX10cmX5cm | Processor No. | i3-4102E |
| Product Collection | 4th Generation Core i3 Processors | Code Name | Haswell |
| Vertical Segment | Embadded | Status | Launched |
| Launch Date | Q3'13 | Lithography | 22nm |
| Use Condition | Industrial Commercial Temp/Sever | Model Number | I3-4102E |
| Certification | ORIGINAL PARTS | ||
| High Light | laptop microprocessor ,laptop chips | ||
i3 4th processor core i3-4102E SR17R 3M Cache, 1.60 GHz, Notebook/ computer CPU
Core i3-4102E is a low-power dual-core processor for embedded systems launched in mid-2013. It is based on the Haswell architecture and is manufactured in 22nm. Due to Hyper-Threading, the two cores can handle up to four threads in parallel, leading to better utilization of the CPU. Each core offers a base speed of 1.6 GHz and includes no Turbo Boost support. The memory controller supports ECC.
| Processor number | i3-4102E |
| Family | Core i3 Mobile |
| Technology (micron) | 0.022 |
| Processor speed (GHz) | 1.6 |
| L2 cache size (KB) | 512 |
| L3 cache size (MB) | 3 |
| The number of cores | 2 |
| EM64T | Supported |
| HyperThreading technology | Supported |
| Virtualization technology | Supported |
| Enhanced SpeedStep technology | Supported |
| Execute-Disable bit feature | Supported |
General information:
| Type | CPU / Microprocessor | ||||||
| Market segment | Embedded | ||||||
| Family |
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| Model number |
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| CPU part number |
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| Frequency | 1600 MHz | ||||||
| Bus speed | 5 GT/s DMI | ||||||
| Clock multiplier | 16 | ||||||
| Package | 1364-ball micro-FCBGA package (FCBGA1364) | ||||||
| Socket | BGA1364 | ||||||
| Size | 1.48" x 1.26" / 3.75cm x 3.2cm | ||||||
| Introduction date | September 1, 2013 | ||||||
| Price at introduction | $225 | ||||||
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Architecture / Microarchitecture:
| Microarchitecture | Haswell |
| Platform | Shark Bay |
| Processor core | Haswell |
| Core stepping | C0 (SR17R) |
| Manufacturing process | 0.022 micron |
| Data width | 64 bit |
| The number of CPU cores | 2 |
| The number of threads | 4 |
| Floating Point Unit | Integrated |
| Level 1 cache size | 2 x 32 KB 8-way set associative instruction caches 2 x 32 KB 8-way set associative data caches |
| Level 2 cache size | 2 x 256 KB 8-way set associative caches |
| Level 3 cache size | 3 MB 12-way set associative shared cache |
| Physical memory | 16 GB |
| Multiprocessing | Uniprocessor |
| Extensions and Technologies |
|
| Low power features | Enhanced SpeedStep technology |
Integrated peripherals / components:
| Integrated graphics | GPU Type: HD 4600 Graphics tier: GT2 Microarchitecture: Gen 7.5 Execution units: 20 Base frequency (MHz): 400 Maximum frequency (MHz): 900 The number of supported displays: 3 |
| Memory controller | The number of controllers: 1 Memory channels: 2 Supported memory: DDR3L-1333, DDR3L-1600 Maximum memory bandwidth (GB/s): 25.6 ECC supported: Yes |
| Other peripherals |
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Electrical / Thermal parameters:
| Maximum operating temperature | 100°C |
| Thermal Design Power | 25 Watt |
Company Details
Business Type:
Distributor/Wholesaler,Agent,Importer,Exporter,Trading Company,Seller
Year Established:
2009
Total Annual:
5000000-10000000
Employee Number:
100~120
Ecer Certification:
Verified Supplier
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