Xinzheng Dia Abrasives Co.,Ltd
Products
Manufacturer of a wide range of products which include Gang Cutting Blades Grinding Wheel For Semiconductor And Photoelectricity,Centerless Grinding Wheel For Semiconductor And Photoelectricity Industries,Small Centerless Grind...
MOQ: 1PC
Price: Negotiable
| Payment Terms | T/T |
| Supply Ability | 20000 pcs per month capacity |
| Delivery Time | 10-14 days delivery time |
| Packaging Details | Box |
| Common Shape | 1A1R |
| Bond | Resin Metal |
| Application | Semiconductor industry, Optical glass, Quartz, Magnetic material, Steel, Ceramic |
| Feature | High Precision |
| Key word | Gang Cutting Blades |
| Grit size | #80-#3000 |
| Place of Origin | China |
| Certification | High QC standard, 100% inspection |
MOQ: 1PC
Price: Negotiable
| Payment Terms | T/T |
| Supply Ability | 20000 pcs per month capacity |
| Delivery Time | 10-14 days delivery time |
| Packaging Details | Box |
| Bonding Agent | Resin |
| Common Shape | 1A1 |
| Type: | Cutting Tool |
| Feature | High efficiency |
| Key word | Centerless Wheels |
| Grit size | Resin bond the finest grit size is 3000 |
| Place of Origin | China |
| Certification | High QC standard, 100% inspection |
MOQ: 1PC
Price: Negotiable
| Payment Terms | T/T |
| Supply Ability | 20000 pcs per month capacity |
| Delivery Time | 10-14 days delivery time |
| Packaging Details | Box |
| Assurance: | quality warranty |
| Application | Semiconductor and Photovoltaic industries |
| Feature | High efficiency |
| Product Keywords | Centerless Grinder Wheels |
| Wheel Size | Resin Maximum OD is 750mm Vitrified OD:300mm~500mm |
| Grit size | Resin bond the finest grit size is 3000 |
| Place of Origin | China |
| Certification | High QC standard, 100% inspection |
MOQ: 1PC
Price: Negotiable
| Payment Terms | T/T |
| Supply Ability | 20000 pcs per month capacity |
| Delivery Time | 15-20 days delivery time |
| Packaging Details | Box |
| Common Shape | 6A2, 6A2T |
| Wheel Size | OD: 175,195,209,305,255,355 |
| Application | Semiconductor industry |
| Bond | Vitrified, Metal |
| Key word | Vitrified & Metal Bond Back Thinning Wheels |
| Grit size | "Coarse Grit: 270--800 Finish Grit: 2000--8000" |
| Place of Origin | China |
| Certification | High QC standard, 100% inspection |
MOQ: 1PC
Price: Negotiable
| Payment Terms | T/T |
| Supply Ability | 20000 pcs per month capacity |
| Delivery Time | 15-20 days delivery time |
| Packaging Details | Box |
| Bond | Resin |
| Wheel Size | OD: 175,195,209,305,255,355 |
| Application | Semiconductor industry |
| Key word | Resin Bond Back Thinning Wheels |
| Grit size | "Coarse Grit: 270--800 Finish Grit: 2000--8000" |
| Common Shape | 6A2, 6A2T |
| Place of Origin | China |
| Certification | High QC standard, 100% inspection |
MOQ: 1PC
Price: Negotiable
| Payment Terms | T/T |
| Supply Ability | 20000 pcs per month capacity |
| Delivery Time | 15-20 days delivery time |
| Packaging Details | Box |
| Feature | Good surface quality |
| Wheel Size | OD: 175,195,209,305,255,355 |
| Application | Semiconductor industry |
| Bond | Resin |
| Key word | Resin Bond Back Thinning Wheels |
| Grit size | Coarse Grit: 270--800 Finish Grit: 2000--8000 |
| Place of Origin | China |
| Certification | High QC standard, 100% inspection |
MOQ: 1PC
Price: Negotiable
| Payment Terms | T/T |
| Supply Ability | 20000 pcs per month capacity |
| Delivery Time | 15-20 days delivery time |
| Packaging Details | Box |
| Common Shape | 6A2, 6A2T |
| Bond | Vitrified |
| Application | Semiconductor industry |
| Key word | Back Thinning Wheels |
| Grit size | Coarse Grit: 270--800 Finish Grit: 2000--8000 |
| Feature | High efficiency |
| Place of Origin | China |
| Certification | High QC standard, 100% inspection |
MOQ: 1PC
Price: Negotiable
| Payment Terms | T/T |
| Supply Ability | 20000 pcs per month capacity |
| Delivery Time | 15-20 days delivery time |
| Packaging Details | Box |
| Common Shape | 6A2, 6A2T |
| Feature | No chipping |
| Wheel Size | OD: 175,195,209,305,255,355 |
| Bond | Vitrified |
| Application | Semiconductor And Photoelectricity industry |
| Key word | Vitrified Bond Back Thinning Wheels |
| Place of Origin | China |
| Certification | High QC standard, 100% inspection |
MOQ: 1PC
Price: Negotiable
| Payment Terms | T/T |
| Supply Ability | 20000 pcs per month capacity |
| Delivery Time | 15-20 days delivery time |
| Packaging Details | Box |
| Grit size | Coarse Grit: 270--800 Finish Grit: 2000--8000 |
| Workpiece & Material | Sapphire, silicon wafer |
| Application | Semiconductor industry |
| Bond | Vitrified |
| Key word | Vitrified Bond Back Thinning Wheels |
| Common Shape | 6A2, 6A2T |
| Place of Origin | China |
| Certification | High QC standard, 100% inspection |
MOQ: 1PC
Price: Negotiable
| Payment Terms | T/T |
| Supply Ability | 20000 pcs per month capacity |
| Delivery Time | 15-20 days delivery time |
| Packaging Details | Box |
| Common Shape | 1A8, 1A1R, 3A1 |
| Wheel Size | "OD:10-200 T:0.07-2.0 H:6, 8, 12.7, 31.75,50.8" |
| Application | Semiconductor & Photoelectricity |
| Bond | Resin Metal |
| Advantage: | high precision |
| Grit size | 3um-70um |
| Place of Origin | China |
| Certification | High QC standard, 100% inspection |
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