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China factories

China factory - Zhengzhou Hongtuo Superabrasive Products Co., Ltd.

Zhengzhou Hongtuo Superabrasive Products Co., Ltd.

  • China,Zhengzhou ,Henan
  • Active Member
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Products

  1. Diamond Honing Tool[128]

  2. Single Pass Honing Tools[56]

  3. Cylinder Honing Tool[52]

  4. Vitrified Bond Grinding Wheel[51]

  5. Resin Bond Grinding Wheel[36]

  6. Metal Bond Grinding Wheels[28]

  7. CBN Grinding Wheels[26]

  8. Diamond Cutting Disc[10]

  9. Back Grinding Wheel[24]

  10. Hub Blade[24]

  11. Wafer Saw Blade[22]

  12. Diamond Dicing Blades[28]

  13. Resin Bond Diamond Blades[30]

  14. Porous Chuck Table[34]

Resin Bond Diamond Blades

Manufacturer of a wide range of products which include 0.25MM Resin Bond Diamond Blades Dicing For Wafer Semicoductor Ceramic Chips,Resin Bond Daimond Dicing Blade , Wafer Semicoductor Disco Dicing Blades,Tolerance +0.02~ 0 Resin ...

Quality 0.25MM Resin Bond Diamond Blades Dicing For Wafer Semicoductor Ceramic Chips for sale

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0.25MM Resin Bond Diamond Blades Dicing For Wafer Semicoductor Ceramic Chips

  1. MOQ: 2

  2. Price: Price can be negotiated

  3. Get Best Quote
Payment Terms T/C,T/T
Supply Ability 300/pcs per month
Delivery Time 2-3weeks
Packaging Details Carton Box
Type Machine Blade
Blade Material Diamond
Size 58
Application Semicoductor,Ceramic chips
Thickness 0.25MM
Bond Resin
Brand Name Hongtuo
Model Number HT-RB
Certification ISO9001:2015&ISO16949
Place of Origin China

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Yes, I am interested!
Quality Resin Bond Daimond Dicing Blade , Wafer Semicoductor Disco Dicing Blades for sale

Interested in this product?

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Resin Bond Daimond Dicing Blade , Wafer Semicoductor Disco Dicing Blades

  1. MOQ: 2

  2. Price: Price can be negotiated

  3. Get Best Quote
Payment Terms T/C,T/T
Supply Ability 300/pcs per month
Delivery Time 2-3weeks
Packaging Details Carton Box
Type Machine Blade
Blade Material Diamond
Finishing Other
Size 58
Application Semicoductor,Ceramic chips
Thickness 0.25MM
Bond Resin
Brand Name Hongtuo
Model Number HT-RB
Certification ISO9001:2015&ISO16949
Place of Origin China

View Complete Details

Yes, I am interested!
Quality Tolerance +0.02~ 0 Resin Bond Diamond Blades For Cutting Hard And Brittle Materials for sale

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Tolerance +0.02~ 0 Resin Bond Diamond Blades For Cutting Hard And Brittle Materials

  1. MOQ: 2

  2. Price: Price can be negotiated

  3. Get Best Quote
Payment Terms T/C,T/T
Supply Ability 300/pcs per month
Delivery Time 2-3weeks
Packaging Details Carton Box
Type Machine Blade
Blade Material Diamond
Finishing Other
Size 58
Application Semicoductor,Ceramic chips
Thickness 0.25MM
Bond Resin
Brand Name HT
Model Number HT-RB
Certification ISO9001:2015&ISO16949
Place of Origin China

View Complete Details

Yes, I am interested!
Quality Consistent Sharpness Dicing Saw Blade , Self - Sharpening Wafer Saw Blade for sale

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Consistent Sharpness Dicing Saw Blade , Self - Sharpening Wafer Saw Blade

  1. MOQ: 2

  2. Price: Price can be negotiated

  3. Get Best Quote
Payment Terms T/C,T/T
Supply Ability 300/pcs per month
Delivery Time 2-3weeks
Packaging Details Carton Box
Type Machine Blade
Blade Material Diamond
Size 58
Application Semicoductor,Ceramic chips
Thickness 0.25MM
Brand Name Hongtuo
Model Number HT-RB
Certification ISO9001:2015&ISO16949
Place of Origin Henan, China (Mainland)

View Complete Details

Yes, I am interested!
Quality Machine Resin Bond Diamond Blades High Self Sharpening Performance For Glass for sale

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Machine Resin Bond Diamond Blades High Self Sharpening Performance For Glass

  1. MOQ: 2

  2. Price: Price can be negotiated

  3. Get Best Quote
Payment Terms T/C,T/T
Supply Ability 300/pcs per month
Delivery Time 2-3weeks
Packaging Details Carton Box
Type Machine Blade
Blade Material Diamond
Finishing Other
Size 58
Application Semicoductor,Ceramic chips
Thickness 0.25MM
Bond Resin
Brand Name HT
Model Number HT-RB
Certification ISO9001:2015&ISO16949
Place of Origin China

View Complete Details

Yes, I am interested!
Quality Size 50 - 100 Diamond Dicing Blades , Ceramic Chips Diamond Wafering Blade for sale

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Size 50 - 100 Diamond Dicing Blades , Ceramic Chips Diamond Wafering Blade

  1. MOQ: 2

  2. Price: Price can be negotiated

  3. Get Best Quote
Payment Terms T/C,T/T
Supply Ability 300/pcs per month
Delivery Time 2-3weeks
Packaging Details Carton Box
Type Machine Blade
Blade Material Diamond
Finishing Other
Size 58
Application Semicoductor,Ceramic chips
Thickness 0.25MM
Bond Resin
Brand Name HT
Model Number HT-RB
Certification ISO9001:2015&ISO16949
Place of Origin Henan, China (Mainland)

View Complete Details

Yes, I am interested!
Quality Custom Size Resin Bond Diamond Blades Thickness 0.25MM ISO16949 Approved for sale

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Custom Size Resin Bond Diamond Blades Thickness 0.25MM ISO16949 Approved

  1. MOQ: 2

  2. Price: Price can be negotiated

  3. Get Best Quote
Payment Terms T/C,T/T
Supply Ability 300/pcs per month
Delivery Time 2-3weeks
Packaging Details Carton Box
Type Machine Blade
Blade Material Diamond
Finishing Other
Size 58
Application Semicoductor,Ceramic chips
Thickness 0.25MM
Bond Resin
Brand Name HT
Model Number HT-RB
Certification ISO9001:2015&ISO16949
Place of Origin China

View Complete Details

Yes, I am interested!
Quality Wafer Semicoductor Dicing Saw Blade High Cutting Efficiency For Cutting Hard Quartz for sale

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Wafer Semicoductor Dicing Saw Blade High Cutting Efficiency For Cutting Hard Quartz

  1. MOQ: 2

  2. Price: Price can be negotiated

  3. Get Best Quote
Payment Terms T/C,T/T
Supply Ability 300/pcs per month
Delivery Time 2-3weeks
Packaging Details Carton Box
Type Machine Blade
Blade Material Diamond
Finishing Other
Size 58
Application Semicoductor,Ceramic chips
Thickness 0.25MM
Bond Resin
Brand Name Hongtuo
Model Number HT-RB
Certification ISO9001:2015&ISO16949
Place of Origin China

View Complete Details

Yes, I am interested!
Quality Industrial Resin Bond Diamond Blades For Cutting Brittle Delicate Materials for sale

Interested in this product?

Get Best Quote

Industrial Resin Bond Diamond Blades For Cutting Brittle Delicate Materials

  1. MOQ: 2

  2. Price: Price can be negotiated

  3. Get Best Quote
Payment Terms T/C,T/T
Supply Ability 300/pcs per month
Delivery Time 2-3weeks
Packaging Details Carton Box
Type Machine Blade
Blade Material Diamond
Size 58
Application Semicoductor,Ceramic chips
Thickness 0.25MM
Brand Name Hongtuo
Model Number HT-RB
Certification ISO9001:2015&ISO16949
Place of Origin Henan, China (Mainland)

View Complete Details

Yes, I am interested!
Quality Self Sharpening Disco Diamond Blade High Flexibility Consistent Sharpness for sale

Interested in this product?

Get Best Quote

Self Sharpening Disco Diamond Blade High Flexibility Consistent Sharpness

  1. MOQ: 2

  2. Price: Price can be negotiated

  3. Get Best Quote
Payment Terms T/C,T/T
Supply Ability 300/pcs per month
Delivery Time 2-3weeks
Packaging Details Carton Box
Blade Material Diamond
Finishing Other
Size 58
Application Semicoductor,Ceramic chips
Thickness 0.25MM
Bond Resin
Brand Name HT
Model Number HT-RB
Certification ISO9001:2015&ISO16949
Place of Origin Henan, China (Mainland)

View Complete Details

Yes, I am interested!
Show more products

Explore more categories

  1. Diamond Honing Tool

    Diamond Honing Tool

    128 products available
  2. Single Pass Honing Tools

    Single Pass Honing Tools

    56 products available
  3. Cylinder Honing Tool

    Cylinder Honing Tool

    52 products available
  4. Vitrified Bond Grinding Wheel

    Vitrified Bond Grinding Wheel

    51 products available
  5. Resin Bond Grinding Wheel

    Resin Bond Grinding Wheel

    36 products available

  6. View All Categories

Get in touch with us

  • Reach Us
  • Zhengzhou Hongtuo Superabrasive Products Co., Ltd.
  • 176#, The 7th Street, Economic & Technological Development Area. 450016, Zhengzhou, China
  • https://www.diamondhoningtool.com/

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